1N5407G

DATA SHEET www.onsemi.com Axial-Lead Glass Passivated Standard Recovery Rectifiers STANDARD RECOVERY RECTIFIERS 50−1000 VOLTS 3.0 AMPERES 1N5400 thru 1N5408 Lead mounted standard recovery rectifiers are designed for use in power supplies and other applications having need of a device with the following features: Features • • • • • • • AXIAL LEAD CASE 267−05 STYLE 1 High Current to Small Size High Surge Current Capability Low Forward Voltage Drop Void−Free Economical Plastic Package Available in Volume Quantities Plastic Meets UL 94 V−0 for Flammability These are Pb−Free Devices MARKING DIAGRAM Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 1.1 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • 260°C Max. for 10 Seconds Polarity: Cathode Indicated by Polarity Band A 1N 540x YYWWG G A = Assembly Location 1N540x = Device Number x = 0, 1, 2, 4, 6, 7 or 8 YY = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information on page 5 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2008 August, 2021 − Rev. 12 1 Publication Order Number: 1N5400/D 1N5400 thru 1N5408 MAXIMUM RATINGS Symbol 1N5400 1N5401 1N5402 1N5404 1N5406 1N5407 1N5408 Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating VRRM VRWM VR 50 100 200 400 600 800 1000 V Non−repetitive Peak Reverse Voltage VRSM 100 200 300 525 800 1000 1200 V Average Rectified Forward Current (Single Phase Resistive Load, 1/2 in. Leads, TL = 105°C) IO 3.0 A Non−repetitive Peak Surge Current (8 ms Single Half−Sine−Wave) IFSM 200 (one cycle) A Operating and Storage Junction Temperature Range TJ Tstg − 65 to +150 − 65 to +175 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Ambient (PC Board Mount, 1/2 in. Leads) Symbol Typ Unit RqJA 53 °C/W ELECTRICAL CHARACTERISTICS Characteristic Symbol Min Typ Max Unit Forward Voltage (IF = 3.0 A, TA = 25°C) vF − − 1.0 V Reverse Current (Rated DC Voltage) TA = 25°C TA = 100°C IR − − − − 10 50 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. Ratings at 25°C ambient temperature unless otherwise specified. 60 Hz resistive or inductive loads. For capacitive load, derate current by 20%. www.onsemi.com 2 1N5400 thru 1N5408 NOTE 1 — AMBIENT MOUNTING DATA Data shown for thermal resistance junction−to−ambient (RqJA) for the mountings shown is to be used as typical guideline values for preliminary engineering or in case the tie point temperature cannot be measured. TYPICAL VALUES FOR RqJA IN STILL AIR Mounting Method 1 2 Lead Length, L (IN) 1/8 1/4 1/2 3/4 55 51 53 50 63 59 61 58 °C/W °C/W 3 28 °C/W MOUNTING METHOD 1 P.C. Board Where Available Copper Surface area is small L RqJA MOUNTING METHOD 3 P.C. Board with 1−1/2” x 1−1/2” Copper Surface L ÉÉÉÉÉÉÉÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ L = 1/2” MOUNTING METHOD 2 Vector Push−In Terminals T−28 Board Ground Plane ÉÉÉÉÉÉÉÉÉ L L www.onsemi.com 3 1N5400 thru 1N5408 200 IFSM, PEAK HALF WAVE CURRENT (A) 400 TJ = 25°C 100 TYPICAL 50 30 20 200 1 CYCLE 100 90 80 70 60 50 40 1.0 5.0 7.0 10 2.0 3.0 20 50 70 100 30 10 NUMBER OF CYCLES 7.0 Figure 2. Maximum Nonrepetitive Surge Current IF(AV), AVERAGE FORWARD CURRENT (A) 5.0 3.0 2.0 1.0 0.7 0.5 0.3 0.2 0.4 0.8 1.6 1.2 2.0 2.4 2.8 Square Wave 1/4” 2 L = 1/32” 1/2” 1 50 60 70 80 90 100 110 120 130 140 150 160 Figure 3. Maximum Current Derating, Lead, Various Lengths 4 DC 3 DC 2 Square Wave 50 3 Figure 1. Forward Voltage RqJA = 28°C/W RqJA = 50°C/W 40 4 TL, LEAD TEMPERATURE (°C) 5 0 Both Leads to Heat Sink with Lengths as Shown DC vF, INSTANTANEOUS VOLTAGE (V) 6 1 5 0 40 3.2 60 70 80 90 100 110 120 130 140 150 160 TA, AMBIENT TEMPERATURE (°C) PF(AV), AVERAGE POWER DISSIPATION (W) iF, INSTANTANEOUS FORWARD CURRENT (AMPS) 70 Surge Applied @ TJ = 25°C f = 60 Hz 300 16 IPK/IAV = 20 14 5 10 Square Wave 12 10 dc 8 6 4 2 0 TJ = 25°C 0 1 2 3 4 5 6 7 8 IF(AV), AVERAGE FORWARD CURRENT (A) Figure 5. Forward Power Dissipation Figure 4. Maximum Current Derating, Ambient, PC Board Mounting www.onsemi.com 4 9 10 1N5400 thru 1N5408 ORDERING INFORMATION Package Shipping† 1N5400G Axial Lead* 500 Units/Box 1N5400RLG Axial Lead* 1200/Tape & Reel 1N5401G Axial Lead* 500 Units/Box 1N5401RLG Axial Lead* 1200/Tape & Reel 1N5402G Axial Lead* 500 Units/Box 1N5402RLG Axial Lead* 1200/Tape & Reel 1N5404G Axial Lead* 500 Units/Box 1N5404RLG Axial Lead* 1200/Tape & Reel 1N5406G Axial Lead* 500 Units/Box 1N5406RLG Axial Lead* 1200/Tape & Reel 1N5407G Axial Lead* 500 Units/Box 1N5407RLG Axial Lead* 1200/Tape & Reel 1N5408G Axial Lead* 500 Units/Box 1N5408RLG Axial Lead* 1200/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS AXIAL LEAD CASE 267−05 ISSUE G DATE 06/06/2000 SCALE 1:1 K D NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 267-04 OBSOLETE, NEW STANDARD 267-05. A 1 2 B K STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE DOCUMENT NUMBER: DESCRIPTION: DIM A B D K 98ASB42170B AXIAL LEAD INCHES MIN MAX 0.287 0.374 0.189 0.209 0.047 0.051 1.000 --- MILLIMETERS MIN MAX 7.30 9.50 4.80 5.30 1.20 1.30 25.40 --- STYLE 2: NO POLARITY Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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