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1SMB15AT3

1SMB15AT3

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SMB(DO-214AA)

  • 描述:

    TVS DIODE 15VWM 24.4VC SMB

  • 数据手册
  • 价格&库存
1SMB15AT3 数据手册
1SMB5.0AT3G Series, SZ1SMB5.0AT3G Series 600 Watt Peak Power Zener Transient Voltage Suppressors http://onsemi.com Unidirectional The SMB series is designed to protect voltage sensitive components from high voltage, high energy transients. They have excellent clamping capability, high surge capability, low zener impedance and fast response time. The SMB series is supplied in ON Semiconductor’s exclusive, cost-effective, highly reliable SURMETIC  package and is ideally suited for use in communication systems, automotive, numerical controls, process controls, medical equipment, business machines, power supplies and many other industrial/consumer applications. PLASTIC SURFACE MOUNT ZENER OVERVOLTAGE TRANSIENT SUPPRESSORS 5.0 V − 170 V, 600 W PEAK POWER SMB CASE 403A PLASTIC Features           Working Peak Reverse Voltage Range − 5.0 V to 170 V Standard Zener Breakdown Voltage Range − 6.7 V to 199 V Peak Power − 600 W @ 1.0 ms ESD Rating of Class 3 (> 16 kV) per Human Body Model Maximum Clamp Voltage @ Peak Pulse Current Low Leakage < 5.0 mA Above 10 V UL 497B for Isolated Loop Circuit Protection Response Time is Typically < 1.0 ns SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable Pb−Free Packages are Available* Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic FINISH: All external surfaces are corrosion resistant and leads are readily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 Seconds LEADS: Modified L−Bend providing more contact area to bond pads POLARITY: Cathode indicated by polarity band MOUNTING POSITION: Any Cathode Anode MARKING DIAGRAM AYWW xx G G A Y WW xx G = Assembly Location = Year = Work Week = Device Code (Refer to page 3) = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping† 1SMBxxxAT3G SMB (Pb−Free) 2,500 / Tape & Reel SZ1SMBxxxAT3G SMB (Pb−Free) 2,500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.  Semiconductor Components Industries, LLC, 2012 February, 2012 − Rev. 13 1 See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet. Publication Order Number: 1SMB5.0AT3/D 1SMB5.0AT3G Series, SZ1SMB5.0AT3G Series MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation (Note 1) @ TL = 25C, Pulse Width = 1 ms PPK 600 W DC Power Dissipation @ TL = 75C Measured Zero Lead Length (Note 2) Derate Above 75C Thermal Resistance from Junction−to−Lead PD 3.0 40 25 W mW/C C/W W mW/C C/W RqJL DC Power Dissipation (Note 3) @ TA = 25C Derate Above 25C Thermal Resistance from Junction−to−Ambient PD RqJA 0.55 4.4 226 Forward Surge Current (Note 4) @ TA = 25C IFSM 100 A TJ, Tstg −65 to +150 C Operating and Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. 10 X 1000 ms, non−repetitive. 2. 1 in square copper pad, FR−4 board. 3. FR−4 board, using ON Semiconductor minimum recommended footprint, as shown in 403A case outline dimensions spec. 4. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. ELECTRICAL CHARACTERISTICS (TA = 25C unless I otherwise noted, VF = 3.5 V Max. @ IF (Note 5) = 30 A) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR IF VC VBR VRWM Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM IR VF IT Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF IPP Uni−Directional TVS 5. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, non−repetitive duty cycle. http://onsemi.com 2 V 1SMB5.0AT3G Series, SZ1SMB5.0AT3G Series ELECTRICAL CHARACTERISTICS Device* Device Marking VC @ IPP (Note 8) Breakdown Voltage VRWM (Note 6) IR @ VRWM V mA Min Nom @ IT VC IPP Ctyp (Note 9) Max mA V A pF VBR (Note 7) Volts 1SMB5.0AT3G 1SMB6.0AT3G 1SMB6.5AT3G 1SMB7.0AT3G KE KG KK KM 5.0 6.0 6.5 7.0 800 800 500 500 6.40 6.67 7.22 7.78 6.7 7.02 7.6 8.19 7.0 7.37 7.98 8.6 10 10 10 10 9.2 10.3 11.2 12.0 65.2 58.3 53.6 50.0 2700 2300 2140 2005 1SMB7.5AT3G 1SMB8.0AT3G 1SMB8.5AT3G 1SMB9.0AT3G KP KR KT KV 7.5 8.0 8.5 9.0 100 50 10 5.0 8.33 8.89 9.44 10.0 8.77 9.36 9.92 10.55 9.21 9.83 10.4 11.1 1.0 1.0 1.0 1.0 12.9 13.6 14.4 15.4 46.5 44.1 41.7 39.0 1890 1780 1690 1605 1SMB10AT3G 1SMB11AT3G 1SMB12AT3G 1SMB13AT3G KX KZ LE LG 10 11 12 13 5.0 5.0 5.0 5.0 11.1 12.2 13.3 14.4 11.7 12.85 14 15.15 12.3 13.5 14.7 15.9 1.0 1.0 1.0 1.0 17.0 18.2 19.9 21.5 35.3 33.0 30.2 27.9 1460 1345 1245 1160 1SMB14AT3G 1SMB15AT3G 1SMB16AT3G 1SMB17AT3G LK LM LP LR 14 15 16 17 5.0 5.0 5.0 5.0 15.6 16.7 17.8 18.9 16.4 17.6 18.75 19.9 17.2 18.5 19.7 20.9 1.0 1.0 1.0 1.0 23.2 24.4 26.0 27.6 25.8 24.0 23.1 21.7 1085 1020 965 915 1SMB18AT3G 1SMB20AT3G 1SMB22AT3G 1SMB24AT3G LT LV LX LZ 18 20 22 24 5.0 5.0 5.0 5.0 20.0 22.2 24.4 26.7 21.05 23.35 25.65 28.1 22.1 24.5 26.9 29.5 1.0 1.0 1.0 1.0 29.2 32.4 35.5 38.9 20.5 18.5 16.9 15.4 870 790 730 675 1SMB26AT3G 1SMB28AT3G 1SMB30AT3G 1SMB33AT3G ME MG MK MM 26 28 30 33 5.0 5.0 5.0 5.0 28.9 31.1 33.3 36.7 30.4 32.75 35.05 38.65 31.9 34.4 36.8 40.6 1.0 1.0 1.0 1.0 42.1 45.4 48.4 53.3 14.2 13.2 12.4 11.3 630 590 555 510 1SMB36AT3G 1SMB40AT3G 1SMB43AT3G 1SMB45AT3G MP MR MT MV 36 40 43 45 5.0 5.0 5.0 5.0 40.0 44.4 47.8 50.0 42.1 46.75 50.3 52.65 44.2 49.1 52.8 55.3 1.0 1.0 1.0 1.0 58.1 64.5 69.4 72.7 10.3 9.3 8.6 8.3 470 430 400 385 1SMB48AT3G 1SMB51AT3G 1SMB54AT3G 1SMB58AT3G MX MZ NE NG 48 51 54 58 5.0 5.0 5.0 5.0 53.3 56.7 60.0 64.4 56.1 59.7 63.15 67.8 58.9 62.7 66.3 71.2 1.0 1.0 1.0 1.0 77.4 82.4 87.1 93.6 7.7 7.3 6.9 6.4 365 345 330 310 1SMB60AT3G 1SMB64AT3G 1SMB70AT3G 1SMB75AT3G NK NM NP NR 60 64 70 75 5.0 5.0 5.0 5.0 66.7 71.1 77.8 83.3 70.2 74.85 81.9 87.7 73.7 78.6 86 92.1 1.0 1.0 1.0 1.0 96.8 103 113 121 6.2 5.8 5.3 4.9 300 280 260 245 1SMB85AT3G 1SMB90AT3G 1SMB100AT3G NV NX NZ 85 90 100 55.0 5.0 5.0 94.4 100 111 99.2 105.5 117 104 111 123 1.0 1.0 1.0 137 146 162 4.4 4.1 3.7 220 210 190 1SMB110AT3G 1SMB120AT3G 1SMB130AT3G 1SMB150AT3G PE PG PK PM 110 120 130 150 5.0 5.0 5.0 5.0 122 133 144 167 128.5 140 151.5 176 135 147 159 185 1.0 1.0 1.0 1.0 177 193 209 243 3.4 3.1 2.9 2.5 175 160 150 135 1SMB160AT3G 1SMB170AT3G PP PR 160 170 5.0 5.0 178 189 187.5 199 197 209 1.0 1.0 259 275 2.3 2.2 125 120 6. A transient suppressor is normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC or continuous peak operating voltage level. 7. VBR measured at pulse test current IT at an ambient temperature of 25C. 8. Surge current waveform per Figure 2 and derate per Figure 4 of the General Data − 600 W at the beginning of this group. 9. Bias Voltage = 0 V, F = 1 MHz, TJ = 25C †Please see 1SMB10CAT3 to 1SMB78CAT3 for Bidirectional devices. * Include SZ-prefix devices where applicable. http://onsemi.com 3 1SMB5.0AT3G Series, SZ1SMB5.0AT3G Series NONREPETITIVE PULSE WAVEFORM SHOWN IN FIGURE 2 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IPP. tr 10 ms 100 10 PEAK VALUE - IPP VALUE (%) PPK, PEAK POWER (kW) 100 I HALF VALUE - PP 2 50 1 tP 0.1 0.1 ms 1 ms 10 ms 100 ms 1 ms 0 10 ms 0 1 2 tP, PULSE WIDTH 5 4 t, TIME (ms) Figure 1. Pulse Rating Curve Figure 2. Pulse Waveform 10,000 160 TJ = 25C f = 1 MHz 140 120 C, CAPACITANCE (pF) PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25 C 3 100 80 60 40 20 1SMB10AT3G 100 0 25 50 75 100 125 150 1SMB48AT3G 1SMB170AT3G 10 1 0 1SMB5.0AT3G 1000 1 10 TA, AMBIENT TEMPERATURE (C) 100 1000 BIAS VOLTAGE (VOLTS) Figure 4. Typical Junction Capacitance vs. Bias Voltage Figure 3. Pulse Derating Curve Zin LOAD Vin VL Figure 5. Typical Protection Circuit http://onsemi.com 4 1SMB5.0AT3G Series, SZ1SMB5.0AT3G Series APPLICATION NOTES Response Time minimum lead lengths and placing the suppressor device as close as possible to the equipment or components to be protected will minimize this overshoot. Some input impedance represented by Zin is essential to prevent overstress of the protection device. This impedance should be as high as possible, without restricting the circuit operation. In most applications, the transient suppressor device is placed in parallel with the equipment or component to be protected. In this situation, there is a time delay associated with the capacitance of the device and an overshoot condition associated with the inductance of the device and the inductance of the connection method. The capacitive effect is of minor importance in the parallel protection scheme because it only produces a time delay in the transition from the operating voltage to the clamp voltage as shown in Figure 6. The inductive effects in the device are due to actual turn-on time (time required for the device to go from zero current to full current) and lead inductance. This inductive effect produces an overshoot in the voltage across the equipment or component being protected as shown in Figure 7. Minimizing this overshoot is very important in the application, since the main purpose for adding a transient suppressor is to clamp voltage spikes. The SMB series have a very good response time, typically < 1.0 ns and negligible inductance. However, external inductive effects could produce unacceptable overshoot. Proper circuit layout, V Duty Cycle Derating The data of Figure 1 applies for non-repetitive conditions and at a lead temperature of 25C. If the duty cycle increases, the peak power must be reduced as indicated by the curves of Figure 8. Average power must be derated as the lead or ambient temperature rises above 25C. The average power derating curve normally given on data sheets may be normalized and used for this purpose. At first glance the derating curves of Figure 8 appear to be in error as the 10 ms pulse has a higher derating factor than the 10 ms pulse. However, when the derating factor for a given pulse of Figure 8 is multiplied by the peak power value of Figure 1 for the same pulse, the results follow the expected trend. V Vin (TRANSIENT) OVERSHOOT DUE TO INDUCTIVE EFFECTS Vin (TRANSIENT) VL VL Vin td tD = TIME DELAY DUE TO CAPACITIVE EFFECT t t Figure 6. Figure 7. 1 0.7 DERATING FACTOR 0.5 0.3 0.2 PULSE WIDTH 10 ms 0.1 0.07 0.05 1 ms 0.03 100 ms 0.02 0.01 10 ms 0.1 0.2 0.5 1 2 5 10 D, DUTY CYCLE (%) 20 50 100 Figure 8. Typical Derating Factor for Duty Cycle http://onsemi.com 5 1SMB5.0AT3G Series, SZ1SMB5.0AT3G Series UL RECOGNITION including Strike Voltage Breakdown test, Endurance Conditioning, Temperature test, Dielectric Voltage-Withstand test, Discharge test and several more. Whereas, some competitors have only passed a flammability test for the package material, we have been recognized for much more to be included in their Protector category. The entire series has Underwriters Laboratory Recognition for the classification of protectors (QVGQ2) under the UL standard for safety 497B and File #E210057. Many competitors only have one or two devices recognized or have recognition in a non-protective category. Some competitors have no recognition at all. With the UL497B recognition, our parts successfully passed several tests http://onsemi.com 6 1SMB5.0AT3G Series, SZ1SMB5.0AT3G Series PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE H HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. E b DIM A A1 b c D E HE L L1 D POLARITY INDICATOR OPTIONAL AS NEEDED MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.20 2.28 0.10 0.19 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.087 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.090 0.007 0.087 0.012 0.156 0.181 0.220 0.063 A L L1 A1 c SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SURMETIC is a registered trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative 1SMB5.0AT3/D
1SMB15AT3 价格&库存

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