1SMF5920BT1G

1SMF5920BT1G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOD-123F

  • 描述:

    1SMF5920B Zener Diodes is offered in highly efficient micro miniature and space saving surface mount...

  • 数据手册
  • 价格&库存
1SMF5920BT1G 数据手册
1SMF5920B 2.5 Watt Zener Diode in Flat Lead Package This complete new line of 2.5 Watt Zener Diodes are offered in highly efficient micro miniature and space saving surface mount design. Because of its small size, it is ideal for use in cellular phones, portable devices, business machines and many other industrial/ consumer applications. Features • • • • • • • • • Zener Breakdown Voltage: 6.2 V Low Leakage < 5 mA ESD Rating of Class 3 (> 16 kV) per Human Body Model Small Footprint − Footprint Area of 8.45 mm2 Low Profile − Maximum Height of 1.0 mm Supplied in 8 mm Tape and Reel − 3,000 Units per Reel Cathode Indicated by Polarity Band Lead Orientation in Tape: Cathode Lead to Sprocket Holes These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant http://onsemi.com PLASTIC SURFACE MOUNT 2.5 WATT ZENER DIODE 6.2 VOLTS 1 2 1: CATHODE 2: ANODE SOD−123FL CASE 498 Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic MARKING DIAGRAM Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any 1 CATHODE QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements 5Y2M G G 2 ANODE 5Y2 = Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package 1SMF5920BT1G SOD−123FL (Pb−Free) Shipping† 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2014 August, 2014 − Rev. 0 1 Publication Order Number: 1SMF5920B/D 1SMF5920B MAXIMUM RATINGS Rating DC Power Dissipation @ TA = 25°C (Note 1) Derate above 25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Lead Symbol Value Unit °PD° RqJA 350 2.9 350 °mW mW/°C °C/W RqJL 30 °C/W °PD 2.5 W TJ, Tstg −55 to +150 °C Maximum DC Power Dissipation (Notes 1 and 2) Operating and Storage Temperature Range Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Mounted with recommended minimum pad size, PC board FR−4. 2. At lead temperature 75°C ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 1.5 V Max. @ IF = 200 mA for all types) IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP IR IF Parameter Symbol VRWM I VC VBR VRWM V IR VF IT Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF IPP Uni−Directional TVS ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.25 Volts @ 200 mA) Zener Voltage (Note 3) VZ @ IZT (Volts) Device Device Marking Min Nom 1SMF5920BT1G 5Y2 5.89 6.2 VR ZZT @ IZT (Note 4) (mA) (V) 5.0 4.0 IZT IR @ VR Max (mA) 6.51 60.5 ZZK @ IZK (Note 4) IZK (W) (W) (mA) 2.0 200 1.0 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Zener voltage is measured with the device junction in thermal equilibrium with an ambient temperature of 25°C. 4. Zener Impedance Derivation ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for IZ(ac) = 0.1 IZ(dc) with the ac frequency = 60 Hz. http://onsemi.com 2 1SMF5920B 3.5 100 3 IZ, ZENER CURRENT (mA) P D , MAXIMUM POWER DISSIPATION (W) TYPICAL CHARACTERISTICS 2.5 2 TL 1.5 1 10 1 0.5 0 0.1 25 50 75 100 125 150 175 5 6 T, TEMPERATURE (°C) 7 8 9 10 VZ, ZENER VOLTAGE (VOLTS) Figure 2. VZ 10 8 ZZ , DYNAMIC IMPEDANCE (OHMS) qVZ, TEMPERATURE COEFFICIENT (mV/°C) Figure 1. Steady State Power Derating VZ @ IZT 6 4 2 0 −2 200 IZ(dc) = 1mA 100 70 50 −4 2 4 6 8 10 VZ, ZENER VOLTAGE (VOLTS) 30 20 10 7 5 10 mA 20 mA 3 2 5 12 7 iZ(rms) = 0.1 IZ(dc) 10 20 30 50 VZ, ZENER VOLTAGE (VOLTS) 70 100 Figure 4. Effect of Zener Voltage Figure 3. Zener Voltage 1k 10,000 TJ = 25°C iZ(rms) = 0.1 IZ(dc) 500 C, CAPACITANCE (pF) Z Z , DYNAMIC IMPEDANCE (OHMS) 11 200 100 50 20 10 5 1000 MEASURED @ 0 V BIAS MEASURED @ 50% VR 100 2 1 0.5 1 6.8 V 2 5 10 20 50 100 200 500 IZ, ZENER TEST CURRENT (mA) 10 1 10 VZ, REVERSE ZENER VOLTAGE (VOLTS) Figure 6. Capacitance versus Reverse Zener Voltage Figure 5. Effect of Zener Current http://onsemi.com 3 100 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOD−123FL CASE 498 ISSUE D DATE 10 MAY 2013 SCALE 4:1 E D q 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. 4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. 2 POLARITY INDICATOR OPTIONAL AS NEEDED A END VIEW TOP VIEW q HE SIDE VIEW 2X b INCHES NOM 0.037 0.002 0.035 0.006 0.065 0.106 0.030 0.142 − MAX 0.039 0.004 0.043 0.008 0.071 0.114 0.037 0.150 8° (Note: Microdot may be in either location) 4.20 ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ MIN 0.035 0.000 0.028 0.004 0.059 0.098 0.022 0.134 0° XXX = Specific Device Code M = Date Code G = Pb−Free Package RECOMMENDED SOLDERING FOOTPRINT* 1.22 MILLIMETERS NOM MAX 0.95 0.98 0.05 0.10 0.90 1.10 0.15 0.20 1.65 1.80 2.70 2.90 0.75 0.95 3.60 3.80 8° − XXXMG G L BOTTOM VIEW 2X MIN 0.90 0.00 0.70 0.10 1.50 2.50 0.55 3.40 0° GENERIC MARKING DIAGRAM* c 2X A1 DIM A A1 b c D E L HE q *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 2X ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ 1.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON11184D SOD−123FL Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
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