483-02

MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 5 1 SCALE 2:1 TSOP-5 CASE 483-02 ISSUE H DATE 18 MAY 2007 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. DIM A B C D G H J K L M S MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 NOTE 5 2X D 5X 0.20 C A B M 0.10 T 0.20 T L G A 5 1 2 4 3 2X B S K DETAIL Z DETAIL Z J C 0.05 H T SEATING PLANE SOLDERING FOOTPRINT* 1.9 0.074 5 XXXAYWG G 1 2.4 0.094 1.0 0.039 0.7 0.028 Analog XXX = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb-Free Package SCALE 10:1 mm inches GENERIC MARKING DIAGRAM* 5 XX MG G 1 Discrete/Logic XX = Specific Device Code M = Date Code G = Pb-Free Package 0.95 0.037 (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, “G” or microdot “ G”, may or may not be present. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com October, DESCRIPTION: TSOP-5 2002 - Rev. 0 PAGE 1 OFXXX 2 1 DOCUMENT NUMBER: 98ARB18753C DOCUMENT NUMBER: 98ARB18753C PAGE 2 OF 2 ISSUE O A REVISION INITIATED NEW MECHANICAL OUTLINE #483. REQ BY WL CHIN/L. RENNICK. UPDATE OUTLINE DRAWING TO CORRECT DIN “C” (SHOULD BE FROM TIP OF LID TO TOP OF PKG). DIM IN TABLE INCORRECTLY LISTED TO G, F TO H, H TO J, N TO L & R TO M. REQ BY F. PADILLA CHANGE OF LEGAL ONWERSHIP FROM MOTOROLA TO ON SEMICONDUC‐ TOR. REQ BY A. GARLINGTON ADDED NOTE “4”. REQ BY S. RIGGS ADDED FOOTPRINT INFORMATION. UPDATED MARKING. REQ. BY D. JOERSZ CHANGED DEVICE MARKING FROM AWW TO AYW. REQ. BY J. MANES. UPDATED DRAWINGS TO LATEST JEDEC STANDARDS. ADDED NOTE 5. REQ. BY T. GURNETT. ADDED MARKING DIAGRAM FOR IC OPTION. REQ. BY J. MILLER. CORRECTED MARKING DIAGRAM ERROR BY REVERSING ANALOG AND DISCRETE LABELS. REQ. BY GK SUA. DATE 28 OCT 1998 13 NOV 1998 B C D E F G H 20 APR 2001 27 JUN 2003 07 APR 2005 14 SEP 2005 07 JUN 2006 21 FEB 2007 18 MAY 2007 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2007 May, 2007 - Rev. 02H Case Outline Number: 483