488AA-01

MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 1 DFN5 5x6, 1.27P (SO−8FL) CASE 488AA−01 ISSUE E 2X SCALE 2:1 DATE 17 AUG 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. 0.20 C D 2 D1 A B 2X 0.20 C E1 2 E c 4X q A1 1 2 3 4 TOP VIEW 3X C SEATING PLANE 0.10 C A 0.10 C SIDE VIEW 8X e DETAIL A DIM A A1 b c D D1 D2 E E1 E2 e G K L L1 M q MILLIMETERS MIN NOM MAX 0.90 1.00 1.10 0.00 −−− 0.05 0.33 0.41 0.51 0.23 0.28 0.33 5.15 BSC 4.50 4.90 5.10 3.50 −−− 4.22 6.15 BSC 5.50 5.80 6.10 3.45 −−− 4.30 1.27 BSC 0.51 0.61 0.71 0.51 −−− −−− 0.51 0.61 0.71 0.05 0.17 0.20 3.00 3.40 3.80 0_ −−− 12 _ DETAIL A GENERIC MARKING DIAGRAM* 1 XXXXXX AYWWG G b e/2 1 4 0.10 0.05 CAB c L K E2 L1 SOLDERING FOOTPRINT* M 1.270 3X PIN 5 (EXPOSED PAD) 0.750 4X 1.000 4X XXXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. G D2 BOTTOM VIEW 1.330 0.965 0.905 4.530 0.475 2X 2X STYLE 1: PIN 1. SOURCE 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN STYLE 2: PIN 1. ANODE 2. ANODE 3. ANODE 4. NO CONNECT 5. CATHODE 0.495 3.200 2X 1.530 4.560 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: REF TO JEDEC MO−240A © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com DESCRIPTION: DFN5 5X6, 1.27P (SO−8FL) October, 2002 − Rev. 0 PAGE 1 OFXXX 2 1 DOCUMENT NUMBER: 98AON14036D DOCUMENT NUMBER: 98AON14036D PAGE 2 OF 2 ISSUE O A B C D E ADDED STYLE 1. REQ. BY K. KIME. ADDED DIMENSION M AND SOLDERING FOOTPRINT. UPDATED DESCRIPTION. REQ. BY K. KIME. CHANGED DIMENSION A NOM FROM 0.99 TO 1.00 & MAX FROM 1.20 TO 1.10. REQ. BY L. DELUCA. CHANGED PACKAGE DESCRIPTION FROM DFN6 TO DFN5. REQ. BY D. TRUHITTE. ADDED STYLE 2. REQ. BY D. TRUHITTE. REVISION RELEASED FOR PRODUCTION. REQ. BY K. KIME. DATE 13 JAN 2004 23 MAR 2004 31 AUG 2005 29 JUN 2007 31 MAR 2009 17 AUG 2010 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2010 August, 2010 − Rev. 01E Case Outline Number: 488AA