513AL-01

MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TLLGA140 10x10, 0.5P, Dual−Row, Staggered−Pad CASE 513AL−01 ISSUE O SCALE 1:1 D PIN ONE LOCATION DATE 20 OCT 2009 A B e/2 140X L e A39 B33 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 b D D2 E E2 e L MILLIMETERS MIN MAX 0.50 0.60 --0.05 0.25 0.35 10.00 BSC 5.70 5.90 10.00 BSC 5.70 5.90 0.50 BSC 0.25 0.35 2X 0.15 2X C 0.15 C 0.10 C 0.08 C NOTE 3 0.15 C A B A20 B17 0.15 C A B E2 140X B1 A1 A76 B64 DOCUMENT NUMBER: October, 2002 − Rev. 01O STATUS: ON 2002 © Semiconductor Components Industries, LLC,SEMICONDUCTOR © Semiconductor Components Industries, LLC, 2002 NEW STANDARD: October, DESCRIPTION: 2002 − Rev. 0 ÉÉÉ ÉÉÉ ÉÉÉ TOP VIEW A SIDE VIEW D2 A58 e E 140X b DETAIL A GENERIC MARKING DIAGRAM A1 XXXXXXXXX XXXXXXXXX AWLYYWWG C SEATING PLANE 140X L A39 B33 DETAIL A e e/2 XXXXX = Device Code A = Assembly Site WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package b 0.10 C A B 0.05 C RECOMMENDED SOLDERING FOOTPRINT* 0.35 A1 100X 5.95 0.50 PITCH 0.48 40X B49 BOTTOM VIEW 10.10 5.95 0.35 100X 0.50 PITCH 0.25 10.10 0.48 40X DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 98AON42332E STANDARD 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed Case Outline Number: versions are uncontrolled except when stamped 485M “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 http://onsemi.com TLLGA140, 10X10, 0.5P 1 DOCUMENT NUMBER: 98AON42332E PAGE 2 OF 2 ISSUE O REVISION RELEASED FOR PRODUCTION. REQ. BY B. JENSEN. DATE 20 OCT 2009 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2009 October, 2009 − Rev. 01O Case Outline Number: 513AL