0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
74ABT16500CMTDX

74ABT16500CMTDX

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TSSOP56_14X6.1MM

  • 描述:

    IC UNIV BUS TXRX 18BIT 56TSSOP

  • 数据手册
  • 价格&库存
74ABT16500CMTDX 数据手册
Revised January 1999 74ABT16500 18-Bit Universal Bus Transceivers with 3-STATE Outputs General Description plementary (OEAB is active HIGH and OEBA is active LOW). The ABT16500 18-bit universal bus transceiver combines D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is HIGH. When LEAB is LOW, the A data is latched if CLKAB is held at a HIGH or LOW logic level. If LEAB is LOW, the A bus data is stored in the latch/flip-flop on the HIGH-to-LOW transition of CLKAB. Output-enable OEAB is active-high. When OEAB is HIGH, the outputs are active. When OEAB is LOW, the outputs are in the high-impedance state. Data flow for B to A is similar to that of A to B but uses OEBA, LEBA, and CLKBA. The output enables are com- Features ■ Combines D-Type latches and D-Type flip-flops for operation in transparent, latched, or clocked mode ■ Flow-through architecture optimizes PCB layout ■ Guaranteed latch-up protection ■ High impedance glitch free bus loading during entire power up and power down cycle ■ Non-destructive hot insertion capability Ordering Code: Order Number Package Number 74ABT16500CSSC MS56A 56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300” Wide Package Description 74ABT16500CMTD MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Devices also available in Tape and Reel. Specify by appending the letter suffix “X” to the ordering code. Connection Diagram Function Table (Note 1) Inputs Pin Assignment for SSOP Output OEAB LEAB CLKAB A B L X X X Z H H X L L H H X H H H L ↓ L L H L ↓ H H H L H X B0 (Note 2) H L L X B0 (Note 3) Note 1: A-to-B data flow is shown: B-to-A flow is similar but uses OEBA, LEBA, and CLKBA. Note 2: Output level before the indicated steady-state input conditions were established. Note 3: Output level before the indicated steady-state input conditions were established, provided that CLKAB was LOW before LEAB went LOW. © 1999 Fairchild Semiconductor Corporation DS011581.prf www.fairchildsemi.com 74ABT16500 18-Bit Universal Bus Transceivers with 3-STATE Outputs April 1993 74ABT16500 Logic Diagram www.fairchildsemi.com 2 −500 mA DC Latchup Source Current Storage Temperature −65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Junction Temperature under Bias −55°C to +150°C Over Voltage Latchup (I/O) 10V Recommended Operating Conditions VCC Pin Potential to −0.5V to +7.0V Free Air Ambient Temperature Input Voltage (Note 5) −0.5V to +7.0V Supply Voltage Input Current (Note 5) −30 mA to +5.0 mA Ground Pin in the Disabled or −0.5V to 5.5V in the HIGH State −0.5V to VCC +4.5V to +5.5V Minimum Input Edge Rate (∆V/∆t) Voltage Applied to Any Output Power-off State −40°C to +85°C Data Input 50 mV/ns Enable Input 20 mV/ns Note 4: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 5: Either voltage limit or current limit is sufficient to protect inputs. Current Applied to Output twice the rated IOL (mA) in LOW State (Max) DC Electrical Characteristics Symbol Parameter Min VIH Input HIGH Voltage VIL Input LOW Voltage VCD Input Clamp Diode Voltage VOH Output HIGH Voltage VOL Output LOW Voltage IIH Input HIGH Current Typ VCC Max Units V Recognized HIGH Signal 0.8 V Recognized LOW Signal 2.0 −1.2 2.5 Conditions V Min IIN = −18 mA V Min IOH = −3 mA V Min IOH = −32 mA 0.55 V Min IOL = 64 mA 1 µA Max VIN = 2.7V (Note 6) 2.0 VIN = VCC 1 IBVI Input HIGH Current Breakdown Test 7 µA Max VIN = 7.0V IIL Input LOW Current −1 µA Max VIN = 0.5V (Note 6) V 0.0 IID = 1.9 µA −1 4.75 VIN = 0.0V VID Input Leakage Test IIH + Output Leakage Current 10 µA 0 − 5.5V VOUT = 2.7V; OE, OE = 2.0V Output Leakage Current −10 µA 0 − 5.5V VOUT = 0.5V; OE, OE = 2.0V All Other Pins Grounded IOZH IIL + IOZL IOS Output Short-Circuit Current −275 mA Max VOUT = 0V ICEX Output HIGH Leakage Current −100 50 µA Max VOUT = VCC IZZ Bus Drainage Test 100 µA 0.0 VOUT = 5.5V; All Others GND ICCH Power Supply Current 1.0 mA Max All Outputs HIGH ICCL Power Supply Current 68 µA Max An or Bn Outputs Low ICCZ Power Supply Current 1.0 mA Max OEn = VCC, ICCT Additional ICC/Input 2.5 mA Max All Others at VCC or GND VI = VCC − 2.1V All Others at VCC or GND ICCD Dynamic ICC No Load mA/ (Note 6) 0.23 MHz Max Outputs Open Transparent Mode One Bit Toggling, 50% Duty Cycle Note 6: Guaranteed, but not tested. 3 www.fairchildsemi.com 74ABT16500 Absolute Maximum Ratings(Note 4) 74ABT16500 DC Electrical Characteristics Symbol Parameter Min Typ Max Units VCC 0.7 1.2 Conditions CL = 50 pF; RL = 500Ω TA = 25°C (Note 7) VOLP Quiet Output Maximum Dynamic VOL V 5.0 VOLV Quiet Output Minimum Dynamic VOL −1.5 −1.0 V 5.0 TA = 25°C (Note 7) VOHV Minimum HIGH Level Dynamic Output Voltage 2.5 3.0 V 5.0 TA = 25°C (Note 8) VIHD Minimum HIGH Level Dynamic Input Voltage 2.2 VILD Maximum LOW Level Dynamic Input Voltage 1.8 1.2 0.8 V 5.0 TA = 25°C (Note 9) V 5.0 TA = 25°C (Note 9) Note 7: Max number of outputs defined as (n). n − 1 data inputs are driven 0V to 3V. One output at LOW. Guaranteed, but not tested. Note 8: Max number of outputs defined as (n). n − 1 data inputs are driven 0V to 3V. One output HIGH. Guaranteed, but not tested. Note 9: Max number of data inputs (n) switching. n − 1 inputs switching 0V to 3V. Input-under-test switching: 3V to threshold (VILD), 0V to threshold (VIHD ). Guaranteed, but not tested. AC Electrical Characteristics Symbol Parameter TA = +25°C TA = −40°C to +85°C VCC = +5V VCC = 4.5V–5.5V CL = 50 pF CL = 50 pF Min Typ fmax Maximum Clock Frequency 150 200 Max Min tPLH Propagation Delay 1.5 2.7 4.6 1.5 4.6 tPHL A or B to B or A 1.5 3.2 4.6 1.5 4.6 tPLH Propagation Delay 1.5 3.1 5.0 1.5 5.0 tPHL LEAB or LEBA to B or A 1.5 3.6 5.0 1.5 5.0 tPLH Propagation Delay 1.5 3.4 5.3 1.5 5.3 tPHL CLKAB or CLKBA to B or A 1.5 3.7 5.3 1.5 5.3 Max 150 MHz tPZH Propagation Delay 1.5 2.7 5.6 1.5 5.6 tPZL OEAB or OEBA to B or A 1.5 3.0 5.6 1.5 5.6 tPHZ Propagation Delay 1.5 3.7 6.0 1.5 6.0 tPLZ OEAB or OEBA to B or A 1.5 3.2 6.0 1.5 6.0 www.fairchildsemi.com 4 Units ns ns ns ns ns Symbol TA = +25°C TA = −40°C to +85°C VCC = +5V VCC = 4.5V–5.5V CL = 50 pF CL = 50 pF Parameter Min Max Min tS(H) Setup Time, 4.5 4.5 tS(L) A to CLKAB 4.5 4.5 tH(H) Hold Time, 0 0 tH(L) A to CLKAB 0 0 tS(H) Setup Time, 4.0 4.0 tS(L) B to CLKBA 4.0 4.0 tH(H) Hold Time, 0 0 tH(L) B to CLKBA 0 0 tS(H) Setup Time, A to LEAB 1.5 1.5 tS(L) or B to LEBA, CLK HIGH 1.5 1.5 tH(H) Hold Time, A to LEAB 1.5 1.5 tH(L) or B to LEBA, CLK HIGH 1.5 1.5 tS(H) Setup Time, A to LEAB 4.5 4.5 tS(L) or B to LEBA, CLK LOW 4.5 4.5 tH(H) Hold Time, A to LEAB 1.5 1.5 tH(L) or B to LEBA, CLK LOW 1.5 1.5 tW(H) Pulse Width, 3.3 3.3 tW(L) LEAB or LEBA, HIGH 3.3 3.3 tW(H) Pulse Width, CLKAB 3.3 3.3 tW(L) or CLKBA, HIGH or LOW 3.3 3.3 Units Max ns ns ns ns ns ns ns ns ns ns Extended AC Electrical Characteristics Symbol TA = −40°C to +85°C TA = −40°C to +85°C TA = −40°C to +85°C VCC = 4.5V–5.5V VCC = 4.5V–5.5V VCC = 4.5V–5.5V CL = 50 pF CL = 250 pF CL = 250 pF 18 Outputs Switching 1 Output Switching 18 Outputs Switching Parameter (Note 10) Min (Note 11) Typ (Note 12) Max Min Max Min Max 9.9 tPLH Propagation Delay 1.5 6.5 2.0 7.0 2.5 tPHL Data to Outputs 1.5 6.5 2.0 7.0 2.5 9.2 tPLH Propagation Delay 1.5 6.0 2.0 7.5 2.5 8.5 tPHL LEAB or LEBA to B or A 1.5 6.0 2.0 7.5 2.5 8.5 tPLH Propagation Delay 1.5 6.2 2.0 7.7 2.5 8.5 tPHL CLKAB or CLKBA to B or A 1.5 6.2 2.0 7.7 2.5 8.5 tPZH Output Enable Time 1.5 6.5 2.0 7.0 2.5 8.5 1.5 6.5 2.5 7.0 2.5 8.5 tPZL tPHZ Output Disable 1.5 6.5 tPLZ Time 1.5 6.5 (Note 13) Units (Note 13) ns ns ns ns ns Note 10: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase (i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.). Note 11: This specification is guaranteed but not tested. The limits represent propagation delay with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. This specification pertains to single output switching only. Note 12: This specification is guaranteed but not tested. The limits represent propagation delays for all paths described switching in phase (i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.) with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. Note 13: 3-STATE delays are dominated by the RC network (500Ω, 250 pF) on the output and have been excluded from the datasheet. 5 www.fairchildsemi.com 74ABT16500 AC Operating Requirements 74ABT16500 Skew Symbol Parameter tOSHL Pin to Pin Skew (Note 16) HL Transitions tOSLH Pin to Pin Skew (Note 16) LH Transitions tPS Duty Cycle (Note 17) LH–HL Skew tOST Pin to Pin Skew (Note 16) LH/HL Transitions tPV Device to Device Skew (Note 18) LH/HL Transitions TA = −40°C to +85°C TA = −40°C to +85°C VCC = 4.5V–5.5V VCC = 4.5V–5.5V CL = 50 pF CL = 250 pF 18 Outputs Switching 18 Outputs Switching (Note 14) (Note 15) Max Max 2.0 2.8 2.0 2.5 2.0 2.8 2.5 3.0 3.0 3.5 Units ns ns ns ns ns Note 14: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase (i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.) Note 15: These specifications guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. Note 16: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device. The specification applies to any outputs switching HIGH-to-LOW (tOSHL), LOW-to-HIGH (tOSLH), or any combination switching LOW-to-HIGH and/or HIGHto-LOW (tOST). The specification is guaranteed but not tested. Note 17: This describes the difference between the delay of the LOW-to-HIGH and the HIGH-to-LOW transition on the same pin. It is measured across all the outputs (drivers) on the same chip, the worst (largest delta) number is the guaranteed specification. This specification is guaranteed but not tested. Note 18: Propagation delay variation for a given set of conditions (i.e., temperature and VCC) from device to device. This specification is guaranteed but not tested. Capacitance Symbol CIN CI/O (Note 19) Typ Units Input Capacitance 5.0 pF VCC = 0.0V Output Capacitance 11.0 pF VCC = 5.0V Note 19: CI/O is measured at frequency f = 1 MHz per MIL-STD-883, Method 3012. www.fairchildsemi.com Conditions Parameter 6 TA = 25°C 74ABT16500 AC Loading *Includes jig and probe capacitance. FIGURE 2. VM = 1.5V FIGURE 1. Standard AC Test Load Input Pulse Requirements Amplitude 3.0V Rep. Rate tW tr tf 1 MHz 500 ns 2.5 ns 2.5 ns FIGURE 3. Test Input Signal Requirements AC Waveforms FIGURE 4. Propagation Delay Waveforms for Inverting and Non-Inverting Functions FIGURE 6. 3-STATE Output HIGH and LOW Enable and Disable Times FIGURE 5. Propagation Delay, Pulse Width Waveforms FIGURE 7. Setup Time, Hold Time and Recovery Time Waveforms 7 www.fairchildsemi.com 74ABT16500 Physical Dimensions inches (millimeters) unless otherwise noted 56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300” Wide Package Number MS56A www.fairchildsemi.com 8 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Package Number MTD56 LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support 1. Life support devices or systems are devices or systems device or system whose failure to perform can be reawhich, (a) are intended for surgical implant into the sonably expected to cause the failure of the life support body, or (b) support or sustain life, and (c) whose failure device or system, or to affect its safety or effectiveness. to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the www.fairchildsemi.com user. Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. 74ABT16500 18-Bit Universal Bus Transceivers with 3-STATE Outputs Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
74ABT16500CMTDX 价格&库存

很抱歉,暂时无法提供与“74ABT16500CMTDX”相匹配的价格&库存,您可以联系我们找货

免费人工找货