Revised January 1999
74ABT652
Octal Transceivers and Registers with 3-STATE Outputs
General Description
The ABT652 consists of bus transceiver circuits with Dtype flip-flops and control circuitry arranged for multiplexed
transmission of data directly from the input bus or from the
internal registers. Data on the A or B bus will be clocked
into the registers as the appropriate clock pin goes to HIGH
logic level. Output Enable pins (OEAB, OEBA) are provided to control the transceiver function.
■ A and B output sink capability of 64 mA, source
capability of 32 mA
■ Guaranteed output skew
■ Guaranteed multiple output switching specifications
■ Output switching specified for both 50 pF and
250 pF loads
■ Guaranteed simultaneous switching noise level and
dynamic threshold performance
■ Guaranteed latchup protection
Features
■ Independent registers for A and B buses
■ High impedance glitch free bus loading during entire
power up and power down cycle
■ Multiplexed real-time and stored data
■ Nondestructive hot insertion capability
Ordering Code:
Order Number
Package Number
74ABT652CSC
M24B
Package Description
24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Body
74ABT652CMSA
MSA24
24-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74ABT652CMTC
MTC24
24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagram
Pin Descriptions
Pin Assignment for
SOIC, SSOP and TSSOP
© 1999 Fairchild Semiconductor Corporation
Pin Names
A0–A7
DS011512.prf
Description
Data Register A Inputs/3-STATE Outputs
B0–B7
Data Register B Inputs/3-STATE Outputs
CPAB, CPBA
Clock Pulse Inputs
SAB, SBA
Select Inputs
OEAB, OEBA
Output Enable Inputs
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74ABT652 Octal Transceivers and Registers with 3-STATE Outputs
November 1992
74ABT652
Truth Table
Inputs
Inputs/Outputs (Note 1)
OEBA
CPAB
CPBA
H
H or L
H or L
OEAB
L
L
H
X
H
H
H
L
X
L
L
L
L
H or L
X
H or L
SAB
A0 thru A7
SBA
X
X
X
X
Input
Operating Mode
B0 thru B7
Input
Isolation
Store A and B Data
X
X
Input
Not Specified Store A, Hold B
X
X
Input
Output
X
X
Not Specified Input
Store A in Both Registers
Hold A, Store B
X
X
Output
Input
Store B in Both Registers
X
X
L
Output
Input
Real-Time B Data to A Bus
Input
Output
L
L
X
H or L
X
H
H
H
X
X
L
X
H
H
H or L
X
H
X
H
L
H or L
H or L
H
H
Store B Data to A Bus
Real-Time A Data to B Bus
Stored A Data to B Bus
Output
Output
Stored A Data to B Bus and
Stored B Data to A Bus
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
= LOW to HIGH Clock Transition
Note 1: The data output functions may be enabled or disabled by various signals at OEAB or OEBA inputs. Data input functions are always enabled, i.e.,
data at the bus pins will be stored on every LOW to HIGH transition on the clock inputs.
Functional Description
Data on the A or B data bus, or both, can be stored in the
internal D flip-flop by LOW to HIGH transitions at the
appropriate Clock Inputs (CPAB, CPBA) regardless of the
Select or Output Enable Inputs. When SAB and SBA are in
the real time transfer mode, it is also possible to store data
without using the internal D flip-flops by simultaneously
enabling OEAB and OEBA. In this configuration each Output reinforces its Input. Thus when all other data sources to
the two sets of bus lines are in a HIGH impedance state,
each set of bus lines will remain at its last state.
In the transceiver mode, data present at the HIGH impedance port may be stored in either the A or B register or
both.
The select (SAB, SBA) controls can multiplex stored and
real-time.
The examples in Figure 1 demonstrate the four fundamental bus-management functions that can be performed with
the ABT652.
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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2
OEAB OEBA
L
L
Note B: Real-Time
Transfer Bus A to Bus B
CPAB CPBA SAB SBA
X
X
X
OEAB OEBA
L
H
Note C: Storage
OEAB OEBA
X
H
L
X
L
H
74ABT652
Note A: Real-Time
Transfer Bus B to Bus A
H
CPAB CPBA SAB SBA
X
X
L
X
Note D: Transfer Storage
Data to A or B
CPAB CPBA SAB SBA
X
X
X
X
X
X
X
X
OEAB OEBA
H
L
CPAB CPBA SAB SBA
H or L H or L
H
H
FIGURE 1.
3
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74ABT652
Absolute Maximum Ratings(Note 2)
Over Voltage Latchup (I/O)
Storage Temperature
−65°C to +150°C
Ambient Temperature under Bias
−55°C to +125°C
Junction Temperature under Bias
−55°C to +150°C
Recommended Operating
Conditions
VCC Pin Potential to Ground Pin
−0.5V to +7.0V
Free Air Ambient Temperature
Input Voltage (Note 3)
−0.5V to +7.0V
Supply Voltage
Input Current (Note 3)
−30 mA to +5.0 mA
in the Disable
−0.5V to +5.5V
Data Input
50 mV/ns
Enable Input
20 mV/ns
100 mV/ns
Note 2: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
Current Applied to Output
Note 3: Either voltage limit or current limit is sufficient to protect inputs.
twice the rated IOL (mA)
in LOW State (Max)
+4.5V to +5.5V
Clock Input
−0.5V to VCC
in the HIGH State
−40°C to +85°C
Minimum Input Edge Rate (∆V/∆t)
Voltage Applied to Any Output
or Power-Off State
10V
−500 mA
DC Latchup Source Current
DC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
VCC
Input HIGH Voltage
VIL
Input LOW Voltage
0.8
V
VCD
Input Clamp Diode Voltage
−1.2
V
Min
VOH
Output HIGH
2.5
V
Min
Voltage
2.0
VOL
Output LOW Voltage
VID
Input Leakage Test
2.0
Units
VIH
V
Conditions
Recognized HIGH Signal
Recognized LOW Signal
IIN = −18 mA (Non I/O Pins)
IOH = −3 mA, (An, Bn)
IOH = −32 mA, (An, Bn)
0.55
4.75
V
Min
V
0.0
IOL = 64 mA, (An, Bn)
IID = 1.9 µA, (Non-I/O Pins)
All Other Pins Grounded
IIH
Input HIGH Current
1
µA
Max
VIN = 2.7V (Non-I/O Pins) (Note 4)
VIN = VCC (Non-I/O Pins)
1
IBVI
Input HIGH Current Breakdown Test
7
µA
Max
VIN = 7.0V (Non-I/O Pins)
IBVIT
Input HIGH Current Breakdown Test (I/O)
100
µA
Max
VIN = 5.5V (An, B n)
IIL
Input LOW Current
−1
µA
Max
−1
IIH +
IOZH
Output Leakage Current
IIL + IOZL
Output Leakage Current
IOS
Output Short-Circuit Current
ICEX
VIN = 0.5V (Non-I/O Pins) (Note 4)
VIN = 0.0V (Non-I/O Pins)
10
µA
0V–5.5V VOUT = 2.7V (An, Bn);
−10
µA
0V–5.5V VOUT = 0.5V (An, Bn);
−275
mA
Max
VOUT = 0V (An, Bn)
Output HIGH Leakage Current
50
µA
Max
VOUT = VCC (An, Bn)
IZZ
Bus Drainage Test
100
µA
0.0V
VOUT = 5.5V (An, Bn); All Others GND
ICCH
Power Supply Current
250
µA
Max
All Outputs HIGH
ICCL
Power Supply Current
30
mA
Max
All Outputs LOW
ICCZ
Power Supply Current
50
µA
Max
Outputs 3-STATE;
ICCT
Additional ICC/Input
2.5
mA
Max
VI = VCC − 2.1V
ICCD
Dynamic ICC
0.18
mA/MHz
Max
OEBA = 2.0V and OEAB = GND = 2.0V
OEBA = 2.0V and OEAB = GND = 2.0V
−100
All others at VCC or GND
All others at VCC or GND
No Load
Outputs Open (Note 5)
OEAB = OEBA = GND
(Note 6)
One bit toggling, 50% duty cycle
Note 4: Guaranteed but not tested.
Note 5: For 8 outputs toggling, ICCD < 1.4 mA/MHz.
Note 6: Guaranteed, but not tested.
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4
(SOIC package)
Symbol
Parameter
Min
Typ
Max
Units
VCC
0.6
0.8
Conditions
CL = 50 pF, RL = 500Ω
TA = 25°C (Note 7)
VOLP
Quiet Output Maximum Dynamic VOL
V
5.0
VOLV
Quiet Output Minimum Dynamic VOL
−1.2
−0.9
V
5.0
TA = 25°C (Note 7)
VOHV
Minimum HIGH Level Dynamic Output Voltage
2.5
3.0
V
5.0
TA = 25°C (Note 8)
VIHD
Minimum HIGH Level Dynamic Input Voltage
2.2
VILD
Maximum LOW Level Dynamic Input Voltage
1.8
0.8
0.4
V
5.0
TA = 25°C (Note 9)
V
5.0
TA = 25°C (Note 9)
Note 7: Max number of outputs defined as (n). n − 1 data inputs are driven 0V to 3V. One output at LOW. Guaranteed, but not tested.
Note 8: Max number of outputs defined as (n). n − 1 data inputs are driven 0V to 3V. One output HIGH. Guaranteed, but not tested.
Note 9: Max number of data inputs (n) switching. n − 1 inputs switching 0V to 3V. Input-under-test switching: 3V to threshold (VILD), 0V to threshold (VIHD).
Guaranteed, but not tested.
AC Electrical Characteristics
(SOIC and SSOP Package)
Symbol
Parameter
TA = +25°C
TA = −40°C to +85°C
VCC = +5.0V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 50 pF
Min
Typ
Max
Min
Max
fmax
Max Clock Frequency
200
tPLH
Propagation Delay
1.7
3.0
4.9
1.7
4.9
tPHL
Clock to Bus
1.7
3.4
4.9
1.7
4.9
tPLH
Propagation Delay
1.5
2.6
4.5
1.5
4.5
tPHL
Bus to Bus
1.5
3.0
4.5
1.5
4.5
tPLH
Propagation Delay
1.5
3.0
5.0
1.5
5.0
tPHL
SBA or SAB to An to Bn
1.5
3.4
5.0
1.5
5.0
tPZH
Enable Time
1.5
3.3
5.5
1.5
5.5
tPZL
OEBA or OEAB to An or Bn
1.5
3.7
5.5
1.5
5.5
tPHZ
Disable Time
1.5
3.7
6.0
1.5
6.0
tPLZ
OEBA or OEAB to An or Bn
1.5
3.3
6.0
1.5
6.0
200
5
Units
MHz
ns
ns
ns
ns
ns
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74ABT652
DC Electrical Characteristics
74ABT652
AC Operating Requirements
Symbol
Parameter
TA = +25°C
TA = −40°C to +85°C
VCC = +5.0V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 50 pF
Min
tS(H)
Setup Time, HIGH
tS(L)
or LOW Bus to Clock
tH(H)
Hold Time, HIGH
tH(L)
or LOW Bus to Clock
tW(H)
Pulse Width,
tW(L)
HIGH or LOW
Max
Min
Units
Max
1.5
1.5
ns
1.0
1.0
ns
3.0
3.0
ns
Extended AC Electrical Characteristics
(SOIC package):
Symbol
Parameter
TA = −40°C to +85°C
TA = −40°C to +85°C
TA = −40°C to +85°C
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 250 pF
CL = 250 pF
8 Outputs Switching
1 Output Switching
8 Outputs Switching
(Note 10)
(Note 11)
(Note 12)
Min
Max
Min
Max
Min
Max
tPLH
Propagation Delay
1.5
5.5
2.0
7.5
2.5
10.0
tPHL
Clock to Bus
1.5
5.5
2.0
7.5
2.5
10.0
tPLH
Propagation Delay
1.5
6.0
2.0
7.0
2.5
9.5
tPHL
Bus to Bus
1.5
6.0
2.0
7.0
2.5
9.5
tPLH
Propagation Delay
1.5
6.0
2.0
7.5
2.5
10.0
tPHL
SBA or SAB to An or Bn
1.5
6.0
2.0
7.5
2.5
10.0
tPZH
Output Enable Time
1.5
6.0
2.0
8.0
2.5
11.5
2.0
8.0
2.5
11.5
tPZL
OEBA or OEAB to An or Bn
1.5
6.0
tPHZ
Output Disable Time
1.5
6.0
tPLZ
OEBA or OEAB to An or Bn
1.5
6.0
(Note 13)
Units
(Note 13)
ns
ns
ns
ns
ns
Note 10: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase (i.e., all LOW-toHIGH, HIGH-to-LOW, etc.).
Note 11: This specification is guaranteed but not tested. The limits represent propagation delay with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. This specification pertains to single output switching only.
Note 12: This specification is guaranteed but not tested. The limits represent propagation delays for all paths described switching in phase (i.e., all LOW-toHIGH, HIGH-to-LOW, etc.) with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load.
Note 13: The 3-STATE delay times are dominated by the RC network (500Ω, 250 pF) on the output and has been excluded from the datasheet.
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6
74ABT652
Skew
(SOIC Package)
Symbol
TA = −40°C to +85°C
TA = −40°C to +85°C
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 250 pF
8 Outputs Switching
8 Outputs Switching
(Note 16)
(Note 17)
Max
Max
1.3
2.5
ns
1.0
2.0
ns
2.0
4.0
ns
2.0
4.0
ns
2.5
4.5
ns
Parameter
tOSHL
Pin to Pin Skew
(Note 14)
HL Transitions
tOSLH
Pin to Pin Skew
(Note 14)
LH Transitions
tPS
Duty Cycle
(Note 18)
LH–HL Skew
tOST
Pin to Pin Skew
(Note 14)
LH/HL Transitions
tPV
Device to Device Skew
(Note 15)
LH/HL Transitions
Units
Note 14: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device.
The specification applies to any outputs switching HIGH to LOW (tOSHL), LOW-to-HIGH (tOSLH), or any combination switching LOW-to-HIGH and/or HIGH-toLOW (tOST). This specification is guaranteed but not tested.
Note 15: Propagation delay variation for a given set of conditions (i.e., temperature and VCC) from device to device. This specification is guaranteed but not
tested
Note 16: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase (i.e., all LOW-toHIGH, HIGH-to-LOW, etc.).
Note 17: This specification is guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load
capacitors in the standard AC load.
Note 18: This describes the difference between the delay of the LOW-to-HIGH and the HIGH-to-LOW transition on the same pin. It is measured across all
the outputs (drivers) on the same chip, the worst (largest delta) number is the guaranteed specification. This specification is guaranteed but not tested.
Capacitance
Symbol
Parameter
Typ
Units
Conditions
(TA = 25°C)
CIN
Input Capacitance
5.0
pF
V CC = 0V (non I/O pins)
CI/O (Note 19)
I/O Capacitance
11.0
pF
V CC = 5.0V (An, Bn)
Note 19: CI/O is measured at frequency, f = 1 MHz, per MIL-STD-883D, Method 3012.
7
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74ABT652
AC Loading
*Includes jig and probe capacitance
FIGURE 2. Standard AC Test Load
FIGURE 3. Test Input Signal Levels
Input Pulse Requirements
Amplitude
Rep. Rate
tW
tr
tf
3.0V
1 MHz
500 ns
2.5 ns
2.5 ns
FIGURE 4. Test Input Signal Requirements
AC Waveforms
FIGURE 5. Propagation Delay Waveforms
for Inverting and Non-Inverting Functions
FIGURE 7. 3-STATE Output HIGH
and LOW Enable and Disable Times
FIGURE 6. Propagation Delay,
Pulse Width Waveforms
FIGURE 8. Setup Time, Hold Time
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and Recovery Time Waveforms
8
74ABT652
Physical Dimensions inches (millimeters) unless otherwise noted
24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Body
Package Number M24B
24-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
Package Number MSA24
9
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74ABT652 Octal Transceivers and Registers with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC24
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
1. Life support devices or systems are devices or systems
device or system whose failure to perform can be reawhich, (a) are intended for surgical implant into the
sonably expected to cause the failure of the life support
body, or (b) support or sustain life, and (c) whose failure
device or system, or to affect its safety or effectiveness.
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
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user.
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.