74AC08

MC74AC08, MC74ACT08 Quad 2−Input AND Gate Features • Outputs Source/Sink 24 mA • ′ACT08 Has TTL Compatible Inputs • Pb−Free Packages are Available MAXIMUM RATINGS Rating DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Sink/Source Current, per Pin DC VCC or GND Current per Output Pin Storage Temperature Symbol VCC Vin Vout Iin Iout ICC Tstg Value −0.5 to +7.0 −0.5 to VCC +0.5 −0.5 to VCC +0.5 ±20 ±50 ±50 −65 to +150 Unit V V V mA mA mA °C 14 1 14 1 http://onsemi.com PDIP−14 N SUFFIX CASE 646 SO−14 D SUFFIX CASE 751A Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 14 1 TSSOP−14 DT SUFFIX CASE 948G VCC 14 13 12 11 10 9 8 SOEIAJ−14 M SUFFIX CASE 965 1 14 1 2 3 4 5 6 7 GND Figure 1. Pinout: 14−Lead Packages Conductors (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2006 October, 2006 − Rev. 8 1 Publication Order Number: MC74AC08/D MC74AC08, MC74ACT08 RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout tr, tf Supply Voltage DC Input Voltage, Output Voltage (Ref. to GND) Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs Junction Temperature (PDIP) Operating Ambient Temperature Range Output Current − High Output Current − Low VCC @ 3.0 V VCC @ 4.5 V VCC @ 5.5 V VCC @ 4.5 V VCC @ 5.5 V Parameter ′AC ′ACT Min 2.0 4.5 0 − − − − − − −40 − − Typ 5.0 5.0 − 150 40 25 10 8.0 − 25 − − Max 6.0 5.5 VCC − − − − − 140 85 −24 24 ns/V °C °C mA mA Unit V V ns/V tr, tf TJ TA IOH IOL 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. DC CHARACTERISTICS 74AC 74AC TA = −40°C to +85°C Unit V Symbol VIH Parameter Minimum High Level Input Voltage Maximum Low Level Input Voltage Minimum High Level Output Voltage Conditions VOUT = 0.1 V or VCC − 0.1 V VOUT = 0.1 V or VCC − 0.1 V IOUT = −50 mA VCC (V) 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 5.5 5.5 5.5 5.5 TA = +25°C Typ 1.5 2.25 2.75 1.5 2.25 2.75 2.99 4.49 5.49 − − − − − − − − − − 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.56 3.86 4.86 0.36 0.36 0.36 ±0.1 − − 4.0 Guaranteed Limits 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.46 3.76 4.76 0.44 0.44 0.44 ±1.0 75 −75 40 VIL V VOH V VIN = VIL or VIH (Note 3) −12 mA IOH −24 mA −24 mA VOL Maximum Low Level Output Voltage VIN = VIL or VIH(Note 3) 12 mA IOL 24 mA 24 mA VI = VCC, GND VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND V V IIN IOLD IOHD ICC Maximum Input Leakage Current Minimum Dynamic (Note 4) Output Current Maximum Quiescent Supply Current mA mA mA mA NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. 3. All outputs loaded; thresholds on input associated with output under test. 4. Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 2 MC74AC08, MC74ACT08 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) 74AC TA = +25°C Symbol tPLH tPHL Propagation Delay Propagation Delay Parameter VCC (V) (Note5 ) 3.3 5.0 3.3 5.0 CL = 50 pF Min 1.5 1.5 1.5 1.5 Typ 7.5 5.5 7.0 5.5 Max 9.5 7.5 8.5 7.0 74AC TA = −40°C to +85°C CL = 50 pF Min 1.0 1.0 1.0 1.0 Max 10.0 8.5 9.0 7.5 Unit ns ns Fig. No. 3− 5 3− 5 5. Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS 74ACT 74ACT TA = VCC (V) 4.5 5.5 4.5 5.5 4.5 5.5 VIN = VIL or VIH (Note 6) −24 mA −24 mA VOL Maximum Low Level Output Voltage IOUT = 50 mA VIN = VIL or VIH (Note 6) 24 mA 24 mA IIN DICCT IOLD IOHD ICC Maximum Input Leakage Current Additional Max. ICC/Input Minimum Dynamic (Note 7) Output Current Maximum Quiescent Supply Current VI = VCC, GND VI = VCC − 2.1 V VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND 4.5 5.5 5.5 5.5 5.5 5.5 5.5 − − − 0.6 − − − 0.36 0.36 ±0.1 − − − 4.0 0.44 0.44 ±1.0 1.5 75 −75 40 mA mA mA mA mA 4.5 5.5 4.5 5.5 − − 0.001 0.001 3.86 4.86 0.1 0.1 3.76 4.76 0.1 0.1 V V TA = +25°C Typ 1.5 1.5 1.5 1.5 4.49 5.49 2.0 2.0 0.8 0.8 4.4 5.4 −40°C to +85°C Unit V 2.0 2.0 0.8 0.8 4.4 5.4 Symbol VIH VIL VOH Parameter Minimum High Level Input Voltage Maximum Low Level Input Voltage Minimum High Level Output Voltage Conditions VOUT = 0.1 V or VCC − 0.1 V VOUT = 0.1 V or VCC − 0.1 V IOUT = −50 mA Guaranteed Limits V V V 6. All outputs loaded; thresholds on input associated with output under test. 7. Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 3 MC74AC08, MC74ACT08 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) 74ACT TA = +25°C Symbol tPLH tPHL Propagation Delay Propagation Delay Parameter VCC (V) (Note 8) 5.0 5.0 CL = 50 pF Min 1.0 1.0 Typ − − Max 9.0 9.0 74ACT TA = −40°C to +85°C CL = 50 pF Min 1.0 1.0 Max 10.0 10.0 Unit ns ns Fig. No. 3− 5 3− 5 8. Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Value Symbol CIN CPD Input Capacitance Power Dissipation Capacitance Parameter Test Conditions VCC = 5.0 V VCC = 5.0 V Typ 4.5 20 Unit pF pF http://onsemi.com 4 MC74AC08, MC74ACT08 MARKING DIAGRAMS PDIP−14 14 1 MC74AC08N AWLYYWWG 1 14 MC74ACT08N AWLYYWWG 1 1 14 AC08G AWLYWWG 1 14 ACT08G AWLYWWG 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−free Package (Note: Microdot may be in either location) ACT 08 ALYWG G SOIC−14 14 AC 08 ALYWG G TSSOP−14 14 SOEIAJ−14 74AC08 ALYWG 1 14 14 74ACT08 ALYWG 1 ORDERING INFORMATION Device MC74AC08N MC74AC08NG MC74AC08D MC74AC08DG MC74AC08DR2 MC74AC08DR2G MC74AC08DTR2 MC74AC08DTR2G MC74AC08MEL MC74AC08MELG MC74ACT08N MC74ACT08NG MC74ACT08D MC74ACT08DG MC74ACT08DR2 MC74ACT08DR2G MC74ACT08DTR2 MC74ACT08DTR2G MC74ACT08MEL MC74ACT08MELG Package PDIP−14 PDIP−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) TSSOP−14* TSSOP−14* SOEIAJ−14 SOEIAJ−14 (Pb−Free) PDIP−14 PDIP−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) SOIC−14 SOIC−14 (Pb−Free) TSSOP−14* TSSOP−14* SOEIAJ−14 SOEIAJ−14 (Pb−Free) 2000 / Tape & Reel 2500 / Tape & Reel 55 Units / Rail 25 Units / Rail 2000 / Tape & Reel 2500 / Tape & Reel 55 Units / Rail 25 Units / Rail Shipping † †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 5 MC74AC08, MC74ACT08 PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE P 14 8 B 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 −−− 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 −−− 10 _ 0.38 1.01 A F N −T− SEATING PLANE L C H G D 14 PL K M J M DIM A B C D F G H J K L M N 0.13 (0.005) http://onsemi.com 6 MC74AC08, MC74ACT08 PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE H − A− 14 8 − B− P 7 PL 0.25 (0.010) M B M 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. G C −T− SEATING PLANE R X 45 _ F D 14 PL 0.25 (0.010) K M M S J TB A S DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 SOLDERING FOOTPRINT* 7X 7.04 1 0.58 14X 14X 1.52 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MC74AC08, MC74ACT08 PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U S M TU S V N S 2X L/2 14 8 0.25 (0.010) M L PIN 1 IDENT. 1 7 B − U− N F DETAIL E K 0.15 (0.006) T U S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ J J1 SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D G H DETAIL E SOLDERING FOOTPRINT* 7.06 1 0.36 14X 14X 1.26 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ A −V− K1 0.65 PITCH DIMENSIONS: MILLIMETERS MC74AC08, MC74ACT08 PACKAGE DIMENSIONS SOEIAJ−14 CASE 965−01 ISSUE A 14 8 LE Q1 E HE M_ L DETAIL P 1 7 Z D e A VIEW P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 1.42 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.056 c b 0.13 (0.005) M A1 0.10 (0.004) ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 9 MC74AC08/D