74AC11
Triple 3-Input AND Gate
Features
General Description
■ ICC reduced by 50%
The AC11 contains three, 3-input AND gates.
■ Outputs source/sink 24mA
Ordering Information
Order
Number
Package
Number
Package Description
74AC11SC
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74AC11SJ
M14D
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74AC11MTC
74AC11PC
MTC14
N14A
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Connection Diagram
Logic Symbol
IEEE/IEC
Pin Description
Pin Names
Description
An, Bn, Cn
Inputs
On
Outputs
©1988 Fairchild Semiconductor Corporation
74AC11 Rev. 1.6.1
www.fairchildsemi.com
74AC11 — Triple 3-Input AND Gate
January 2008
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
VCC
IIK
Parameter
Rating
Supply Voltage
–0.5V to +7.0V
DC Input Diode Current
VI = –0.5V
–20mA
VI = VCC + 0.5
+20mA
VI
DC Input Voltage
–0.5V to VCC + 0.5V
IOK
DC Output Diode Current
VO = –0.5V
–20mA
VO = VCC + 0.5V
+20mA
VO
DC Output Voltage
–0.5V to VCC + 0.5V
IO
DC Output Source or Sink Current
±50mA
ICC or IGND DC VCC or Ground Current per Output Pin
±50mA
TSTG
Storage Temperature
–65°C to +150°C
TJ
Junction Temperature
140°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
VCC
Parameter
Rating
Supply Voltage
2.0V to 6.0V
VI
Input Voltage
0V to VCC
VO
Output Voltage
0V to VCC
TA
Operating Temperature
∆V / ∆t
–40°C to +85°C
Minimum Input Edge Rate:
125mV/ns
VIN from 30% to 70% of VCC, VCC @ 3.3V, 4.5V, 5.5V
©1988 Fairchild Semiconductor Corporation
74AC11 Rev. 1.6.1
www.fairchildsemi.com
2
74AC11 — Triple 3-Input AND Gate
Absolute Maximum Ratings
Symbol
VIH
Parameter
VCC
(V)
Minimum HIGH Level
Input Voltage
3.0
Maximum LOW Level
Input Voltage
3.0
Minimum HIGH Level
Output Voltage
3.0
TA = +25°C
Conditions
VOUT = 0.1V
or VCC – 0.1V
Units
2.1
2.1
2.25
3.15
3.15
2.75
3.85
3.85
1.5
0.9
0.9
2.25
1.35
1.35
2.75
1.65
1.65
2.99
2.9
2.9
4.5
4.49
4.4
4.4
5.5
5.49
5.4
5.4
2.56
2.46
3.86
3.76
4.86
4.76
0.002
0.1
0.1
4.5
0.001
0.1
0.1
5.5
0.001
0.1
0.1
0.36
0.44
0.36
0.44
0.36
0.44
±0.1
±1.0
µA
4.5
4.5
VOUT = 0.1V
or VCC – 0.1V
5.5
VOH
Guaranteed Limits
1.5
5.5
VIL
Typ.
TA = –40°C to +85°C
3.0
IOUT = –50µA
VIN = VIL or VIH,
V
V
V
IOH = –12mA
4.5
VIN = VIL or VIH,
IOH = –24mA
5.5
VIN = VIL or VIH,
IOH =
VOL
Maximum LOW Level
Output Voltage
3.0
3.0
–24mA(1)
IOUT = 50µA
VIN = VIL or VIH,
V
IOL = 12mA
4.5
VIN = VIL or VIH,
IOL = 24mA
5.5
VIN = VIL or VIH,
IOL =
IIN
(3)
IOLD
IOHD
ICC
(3)
24mA(1)
Maximum Input
Leakage Current
5.5
VI = VCC, GND
Minimum Dynamic
Output Current(2)
5.5
VOLD = 1.65V Max.
75
mA
5.5
VOHD = 3.85V Min.
–75
mA
Maximum Quiescent
Supply Current
5.5
VIN = VCC or GND
20.0
µA
2.0
Notes:
1. All outputs loaded; thresholds on input associated with output under test.
2. Maximum test duration 2.0ms, one output loaded at a time.
3. IIN and ICC @ 3.0V are guaranteed to be less than or equal to the respective limit @ 5.5V VCC.
©1988 Fairchild Semiconductor Corporation
74AC11 Rev. 1.6.1
www.fairchildsemi.com
3
74AC11 — Triple 3-Input AND Gate
DC Electrical Characteristics
TA = +25°C,
CL = 50pF
Symbol
tPLH
tPHL
Parameter
Propagation Delay
Propagation Delay
TA = –40°C to +85°C,
CL = 50pF
VCC (V)(4)
Min.
Typ.
Max.
Min.
Max.
Units
3.3
1.5
5.5
9.5
1.0
10.0
ns
5.0
1.5
4.0
8.0
1.0
8.5
3.3
1.5
5.5
8.5
1.0
9.5
5.0
1.5
4.0
7.0
1.0
7.5
ns
Note:
4. Voltage range 3.3 is 3.3V ± 0.3V. Voltage range 5.0 is 5.0V ± 0.5V.
Capacitance
Symbol
Parameter
Conditions
Typ.
Units
CIN
Input Capacitance
VCC = OPEN
4.5
pF
CPD
Power Dissipation Capacitance
VCC = 5.0V
20.0
pF
©1988 Fairchild Semiconductor Corporation
74AC11 Rev. 1.6.1
www.fairchildsemi.com
4
74AC11 — Triple 3-Input AND Gate
AC Electrical Characteristics
8.75
8.50
0.65
A
7.62
14
8
B
5.60
4.00
3.80
6.00
PIN ONE
INDICATOR
1
1.70
7
0.51
0.35
1.27
0.25
1.27
LAND PATTERN RECOMMENDATION
M
C B A
(0.33)
1.75 MAX
1.50
1.25
SEE DETAIL A
0.25
0.10
C
0.25
0.19
0.10 C
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AB, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
GAGE PLANE
FLASH OR BURRS.
D) LANDPATTERN STANDARD:
SOIC127P600X145-14M
0.36
E) DRAWING CONFORMS TO ASME Y14.5M-1994
F) DRAWING FILE NAME: M14AREV13
0.50 X 45°
0.25
R0.10
R0.10
8°
0°
0.90
0.50
(1.04)
SEATING PLANE
DETAIL A
SCALE: 20:1
Figure 1. 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1988 Fairchild Semiconductor Corporation
74AC11 Rev. 1.6.1
www.fairchildsemi.com
5
74AC11 — Triple 3-Input AND Gate
Physical Dimensions
74AC11 — Triple 3-Input AND Gate
Physical Dimensions (Continued)
Figure 2. 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1988 Fairchild Semiconductor Corporation
74AC11 Rev. 1.6.1
www.fairchildsemi.com
6
74AC11 — Triple 3-Input AND Gate
Physical Dimensions (Continued)
0.65
0.43 TYP
1.65
6.10
0.45
12.00° TOP
& BOTTOM
R0.09 min
A. CONFORMS TO JEDEC REGISTRATION MO-153,
VARIATION AB, REF NOTE 6
B. DIMENSIONS ARE IN MILLIMETERS
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS
D. DIMENSIONING AND TOLERANCES PER ANSI
Y14.5M, 1982
E. LANDPATTERN STANDARD: SOP65P640X110-14M
F. DRAWING FILE NAME: MTC14REV6
1.00
R0.09min
Figure 3. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1988 Fairchild Semiconductor Corporation
74AC11 Rev. 1.6.1
www.fairchildsemi.com
7
74AC11 — Triple 3-Input AND Gate
Physical Dimensions (Continued)
19.56
18.80
14
8
6.60
6.09
1
7
(1.74)
8.12
7.62
1.77
1.14
3.56
3.30
0.35
0.20
5.33 MAX
0.38 MIN
3.81
3.17
0.58
0.35
8.82
2.54
NOTES: UNLESS OTHERWISE SPECIFIED
THIS PACKAGE CONFORMS TO
A) JEDEC MS-001 VARIATION BA
B) ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONS ARE EXCLUSIVE OF BURRS,
C) MOLD FLASH, AND TIE BAR EXTRUSIONS.
D) DIMENSIONS AND TOLERANCES PER
ASME Y14.5-1994
E) DRAWING FILE NAME: MKT-N14AREV7
Figure 4. 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1988 Fairchild Semiconductor Corporation
74AC11 Rev. 1.6.1
www.fairchildsemi.com
8
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In Design
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data; supplementary data will be
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Rev. I32
©1988 Fairchild Semiconductor Corporation
74AC11 Rev. 1.6.1
www.fairchildsemi.com
9
74AC11 — Triple 3-Input AND Gate
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