74AC244

MC74AC244, MC74ACT244 Octal Buffer/Line Driver with 3-State Outputs The MC74AC244/74ACT244 is an octal buffer and line driver designed to be employed as a memory address driver, clock driver and bus oriented transmitter/receiver which provides improved PC board density. http://onsemi.com PDIP–20 N SUFFIX CASE 738 20 1 • 3–State Outputs Drive Bus Lines or Buffer Memory Address • Outputs Source/Sink 24 mA • ′ACT244 Has TTL Compatible Inputs VCC 20 OE2 19 18 17 16 15 14 13 12 11 20 1 Registers SO–20 DW SUFFIX CASE 751 20 1 TSSOP–20 DT SUFFIX CASE 948E EIAJ–20 M SUFFIX CASE 967 1 1 OE1 2 3 4 5 6 7 8 9 10 GND 20 Figure 1. Pinout: 20–Lead Packages Conductors (Top View) TRUTH TABLE Inputs OE1 L L H NOTE: D L H X Outputs (Pins 12, 14, 16, 18) L H Z ORDERING INFORMATION Device MC74AC244N MC74ACT244N MC74AC244DW MC74AC244DWR2 MC74ACT244DW MC74ACT244DWR2 MC74AC244DT Package PDIP–20 PDIP–20 SOIC–20 SOIC–20 SOIC–20 SOIC–20 TSSOP–20 TSSOP–20 TSSOP–20 TSSOP–20 EIAJ–20 EIAJ–20 EIAJ–20 EIAJ–20 Shipping 18 Units/Rail 18 Units/Rail 38 Units/Rail 1000 Tape & Reel 38 Units/Rail 1000 Tape & Reel 75 Units/Rail 2500 Tape & Reel 75 Units/Rail 2500 Tape & Reel 40 Units/Rail 2000 Tape & Reel 40 Units/Rail 2000 Tape & Reel H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance TRUTH TABLE Inputs OE2 L L H NOTE: D L H X Outputs (Pins 3, 5, 7, 9) L H Z MC74AC244DTR2 MC74ACT244DT MC74ACT244DTR2 MC74AC244M MC74AC244MEL MC74ACT244M MC74ACT244MEL H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance DEVICE MARKING INFORMATION See general marking information in the device marking section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2001 1 May, 2001 – Rev. 5 Publication Order Number: MC74AC244/D MC74AC244, MC74ACT244 MAXIMUM RATINGS* Symbol VCC VIN VOUT IIN IOUT ICC Tstg Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Sink/Source Current, per Pin DC VCC or GND Current per Output Pin Storage Temperature Value –0.5 to +7.0 –0.5 to VCC +0.5 –0.5 to VCC +0.5 ±20 ±50 ±50 –65 to +150 Unit V V V mA mA mA °C *Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT Supply Voltage DC Input Voltage, Output Voltage (Ref. to GND) VCC @ 3.0 V tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Devices except Schmitt Inputs VCC @ 4.5 V VCC @ 5.5 V tr, tf TJ TA IOH IOL In ut Rise and Fall Time (Note 2) Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs Junction Temperature (PDIP) Operating Ambient Temperature Range Output Current – High Output Current – Low VCC @ 4.5 V VCC @ 5.5 V Parameter ′AC ′ACT Min 2.0 4.5 0 – – – – – – –40 – – Typ 5.0 5.0 – 150 40 25 10 8.0 – 25 – – Max 6.0 5.5 VCC – – – – ns/V – 140 85 –24 24 °C °C mA mA ns/V V V Unit 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 2 MC74AC244, MC74ACT244 DC CHARACTERISTICS 74AC Symbol Parameter VCC (V) TA = +25°C Typ VIH Minimum High Level g Input Voltage Maximum Low Level Input Voltage Minimum High Level g Output Voltage 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 VOL Maximum Low Level Output Voltage 3.0 4.5 5.5 3.0 4.5 5.5 IIN IOZ Maximum Input Leakage Current Maximum 3–State Current C †Minimum Dynamic Output C O t t Current t Maximum Q Quiescent Supply Current 5.5 55 1.5 2.25 2.75 1.5 2.25 2.75 2.99 4.49 5.49 – – – 0.002 0.001 0.001 – – – – 74AC TA = –40°C to +85°C Unit Conditions Guaranteed Limits 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.56 3.86 4.86 0.1 0.1 0.1 0.36 0.36 0.36 ±0.1 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.46 3.76 4.76 0.1 0.1 0.1 0.44 0.44 0.44 ±1.0 V VOUT = 0.1 V or VCC – 0.1 V VOUT = 0.1 V or VCC – 0.1 V IOUT = –50 µA V *VIN = VIL or VIH –12 mA IOH –24 mA –24 mA IOUT = 50 µA V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA VI = VCC, GND GND VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND GND VIL V VOH V V µA 5.5 5.5 5.5 5.5 55 – – – – ±0.5 – – 8.0 ±5.0 75 –75 80 µA mA mA µA IOLD IOHD ICC *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 3 MC74AC244, MC74ACT244 AC CHARACTERISTICS (For Figures and Waveforms – See Section 3) 74AC Symbol Parameter VCC* (V) Min tPLH tPHL tPZH tPZL tPHZ tPLZ Propagation Delay Data to Output Propagation Delay Data to Output Output Enable Time Output Enable Time Output Enable Time Output Enable Time Output Disable Time Output Disable Time Output Disable Time Output Disable Time 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 2.0 1.5 2.0 1.5 2.0 1.5 2.5 1.5 3.0 2.5 2.5 2.0 TA = +25°C CL = 50 pF Typ 6.5 5.0 6.5 5.0 6.0 5.0 7.5 5.5 7.0 6.5 7.5 6.5 Max 9.0 7.0 9.0 7.0 10.5 7.0 10.0 8.0 10.0 9.0 10.5 9.0 74AC TA = –40°C to +85°C CL = 50 pF Min 1.5 1.0 2.0 1.0 1.5 1.5 2.0 1.5 1.5 1.0 2.5 2.0 Max 10.0 7.5 10.0 7.5 11.0 8.0 11.0 8.5 10.5 9.5 11.5 9.5 ns ns ns ns ns ns 3–5 –5 3–5 –5 3–7 –7 3–8 3–7 –7 3–8 Unit Fig. No. *Voltage Range 3.3 V is 3.3 V ±0.3 V. *Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS 74ACT Symbol Parameter VCC (V) TA = +25°C Typ VIH VIL VOH Minimum High Level g Input Voltage Maximum Low Level Input Voltage Minimum High Level g Output Voltage 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 VOL Maximum Low Level Output Voltage 4.5 5.5 4.5 5.5 IIN ∆ICCT IOZ Maximum Input Leakage Current Additional Max. ICC/Input Maximum 3–State Current C †Minimum Dynamic Output C O t t Current t Maximum Q Quiescent Supply Current 5.5 55 5.5 5.5 5.5 5.5 5.5 55 1.5 1.5 1.5 1.5 4.49 5.49 – – 0.001 0.001 – – – 0.6 – – – – 74ACT TA = –40°C to +85°C Unit Conditions Guaranteed Limits 2.0 2.0 0.8 0.8 4.4 5.4 3.86 4.86 0.1 0.1 0.36 0.36 ±0.1 – ±0.5 – – 8.0 2.0 2.0 0.8 0.8 4.4 5.4 3.76 4.76 0.1 0.1 0.44 0.44 ±1.0 1.5 ±5.0 75 –75 80 V V V VOUT = 0.1 V or VCC – 0.1 V VOUT = 0.1 V or VCC – 0.1 V IOUT = –50 µA *VIN = VIL or VIH –24 mA IOH –24 mA IOUT = 50 µA *VIN = VIL or VIH 24 mA IOL 24 mA VI = VCC, GND GND VI = VCC – 2.1 V VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND GND V V V µA mA µA mA mA µA IOLD IOHD ICC *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 4 MC74AC244, MC74ACT244 AC CHARACTERISTICS (For Figures and Waveforms – See Section 3) 74ACT Symbol Parameter VCC* (V) Min tPLH tPHL tPZH tPZL tPHZ tPLZ Pro agation Delay Propagation Delay Data to Output Pro agation Delay Propagation Delay Data to Output Output Enable Time Output Enable Time Output Disable Time Output Disable Time 5. 50 5. 50 5.0 5.0 5.0 5.0 2.0 2.0 1.5 2.0 2.0 2.5 TA = +25°C CL = 50 pF Typ 6.5 5 7. 70 6.0 7.0 7.0 7.5 Max 9.0 9.0 8.5 9.5 9.5 10.0 74ACT TA = –40°C to +85°C CL = 50 pF Min 1.5 5 1.5 5 1.0 1.5 1.5 2.0 Max 10.0 10.0 9.5 10.5 10.5 10.5 ns ns ns ns ns ns 3–5 –5 3–5 –5 3–7 3–8 3–7 3–8 Unit Fig. No. *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol CIN CPD Input Capacitance Power Dissipation Capacitance Parameter Value Typ 4.5 45 Unit pF pF Test Conditions VCC = 5.0 V VCC = 5.0 V MARKING DIAGRAMS PDIP–20 MC74AC244N AWLYYWW SO–20 AC244 AWLYYWW TSSOP–20 EIAJ–20 AC 244 ALYW 74AC244 AWLYWW MC74ACT244N AWLYYWW ACT244 AWLYYWW ACT 244 ALYW 74ACT244 AWLYWW A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 5 MC74AC244, MC74ACT244 PACKAGE DIMENSIONS PDIP–20 N SUFFIX 20 PIN PLASTIC DIP PACKAGE CASE 738–03 ISSUE E –A– 20 1 11 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 B 10 C L –T– SEATING PLANE K M E G F D 20 PL N J 0.25 (0.010) M 20 PL 0.25 (0.010) TA M M TB M SO–20 DW SUFFIX 20 PIN PLASTIC SOIC PACKAGE CASE 751D–05 ISSUE F D q NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 12.65 12.95 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 q 0_ 7_ A 11 X 45 _ H M B M 20 10X 0.25 E 1 10 20X B 0.25 M B TA S B S A SEATING PLANE h 18X e A1 T C http://onsemi.com 6 L MC74AC244, MC74ACT244 PACKAGE DIMENSIONS TSSOP–20 DT SUFFIX 20 PIN PLASTIC TSSOP PACKAGE CASE 948E–02 ISSUE A 20X K REF M 0.15 (0.006) T U S 0.10 (0.004) TU S V S 2X L/2 B L PIN 1 IDENT 1 10 J J1 –U– SECTION N–N 0.25 (0.010) M N 0.15 (0.006) T U S A –V– N F C D 0.100 (0.004) –T– SEATING PLANE G H DETAIL E EIAJ–20 M SUFFIX 20 PIN PLASTIC EIAJ PACKAGE CASE 967–01 ISSUE O 20 11 LE Q1 M_ L DETAIL P E HE 1 10 Z D e VIEW P A b 0.13 (0.005) M A1 0.10 (0.004) http://onsemi.com 7 ÍÍÍ ÍÍÍ ÍÍÍ DETAIL E 20 11 K K1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ –W– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 0_ 10 _ 0.70 0.90 --0.81 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 0_ 10 _ 0.028 0.035 --0.032 c MC74AC244, MC74ACT244 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). 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