74LCX07MTCX

Revised February 2005 74LCX07 Low Voltage Hex Buffer with Open Drain Outputs General Description Features The LCX07 contains six buffers. The inputs tolerate voltages up to 7V allowing the interface of 5V systems to 3V systems. ■ 5V tolerant inputs The outputs of the LCX07 are open drain and can be connected to other open drain outputs to implement active HIGH wire AND or active LOW wire OR functions. The 74LCX07 is fabricated with advanced CMOS technology to achieve high speed operation while maintaining CMOS low power dissipation. ■ 2.3V to 5.5V VCC specifications provided ■ 2.9 ns tPD max (VCC 3.3V), 10 PA ICC max ■ Power down high impedance inputs and outputs ■ 24 mA output drive (VCC 3.0V) ■ Implements patented noise/EMI reduction circuitry ■ Latch-up performance exceeds JEDEC 78 conditions ■ ESD performance: Human body model ! 2000V Machine model ! 200V ■ Leadless Pb-Free DQFN package Ordering Code: Order Number Package Package Description Number 74LCX07M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow 74LCX07MX_NL (Note 1) M14A Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow 74LCX07SJ 74LCX07BQX (Note 2) M14D MLP014A Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm 74LCX07MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74LCX07MTCX_NL (Note 1) MTC14 Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only. Note 2: DQFN package available in Tape and Reel only. © 2005 Fairchild Semiconductor Corporation DS500238 www.fairchildsemi.com 74LCX07 Low Voltage Hex Buffer with Open Drain Outputs October 1999 74LCX07 Logic Symbol Connection Diagrams IEEE/IEC Pin Assignments for SOIC, SOP, and TSSOP Pad Assignments for DQFN Pin Descriptions Pin Names Description An Inputs On Outputs (Top Through View) www.fairchildsemi.com 2 Symbol Parameter VCC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current Value IO DC Output Current ICC DC Supply Current per Supply Pin IGND DC Ground Current per Ground Pin TSTG Storage Temperature Recommended Operating Conditions Symbol VCC Conditions 0.5 to 7.0 0.5 to 7.0 0.5 to 7.0 50 50 50 r50 r100 r100 65 to 150 Units V V Output in HIGH or LOW State (Note 4) VI  GND V mA VO  GND mA VO ! VCC mA mA mA qC (Note 5) Parameter Min Max Operating 2.0 5.5 Data Retention 1.5 5.5 Supply Voltage Units V VI Input Voltage 0 5.5 V VO Output Voltage 0 5.5 V IOL Output Current 32 24 12 8 mA VCC TA Free-Air Operating Temperature 't/'V Input Edge Rate, VIN 0.8V–2.0V, VCC 4.5  5.5V VCC 3.0V  3.6V VCC 2.7V  3.0V VCC 2.3V  2.7V 40 85 qC 0 10 ns/V 3.0V Note 3: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The Recommended Operating Conditions table will define the conditions for actual device operation. Note 4: IO Absolute Maximum Rating must be observed. Note 5: Unused inputs must be held HIGH or LOW. They may not float. DC Electrical Characteristics Symbol VIH VIL VOL Parameter Conditions HIGH Level Input Voltage 2.3  2.7 1.7 2.7  3.6 2.0 4.5  5.5 0.7 x VCC Max Units V 0.7 2.7  3.6 0.8 4.5 - 5.5 0.3 x VCC 100 PA 2.3  5.5 0.2 IOL 8 mA 2.3 0.6 IOL 12 mA 2.7 0.4 IOL 16 mA 3.0 0.4 IOL 24 mA 3.0 0.55 IOL 32 mA V V 4.5 0.55 2.3  5.5 r5.0 PA 0 10 PA VCC or GND 2.3  5.5 10 3.6V d VI d 5.5V 2.3  5.5 r10 V CC 0.6V 2.3  3.6 500 PA 4.5  5.5 1 mA 2 - 5.5 10 PA Input Leakage Current 0 d VI d 5.5V IOFF Power-Off Leakage Current VI or VO ICC Quiescent Supply Current VI 'ICC Increase in ICC per Input VIH Off State Current 40qC to 85qC Min IOL II IOHZ TA (V) 2.3  2.7 LOW Level Input Voltage LOW Level Output Voltage VCC VO 5.5V 5.5 3 PA www.fairchildsemi.com 74LCX07 Absolute Maximum Ratings(Note 3) 74LCX07 AC Electrical Characteristics TA Symbol VCC Parameter 5.0V r 0.5V VCC CL 50 pF tPZL Propagation Delay Time tPLZ 40qC to 85qC, RL 3.3V r 0.3V 500: VCC CL 50 pF 2.7V VCC CL 50 pF 2.5V r 0.2V Units CL 30 pF Min Max Min Max Min Max Min Max 0.5 3.0 0.8 3.7 1.0 4.4 0.8 3.8 0.5 3.0 0.8 3.7 1.0 4.4 0.8 3.8 ns Dynamic Switching Characteristics Symbol Parameter VOLP Quiet Output Dynamic Peak VOL VOLV Quiet Output Dynamic Valley VOL VCC Conditions TA 25qC (V) Typical 0.9 CL 50 pF, VIH 3.3V, VIL 0V 3.3 CL 30 pF, VIH 2.5V, VIL 0V 2.5 0.7 CL 50 pF, VIH 3.3V, VIL 0V 3.3 0.8 CL 30 pF, VIH 2.5V, VIL 0V 2.5 0.6 Units V V Capacitance Symbol Parameter Conditions CIN Input Capacitance VCC Open, VI COUT Output Capacitance VCC 3.3V, VI 0V or VCC CPD Power Dissipation Capacitance VCC 3.3V, VI 0V or VCC, f www.fairchildsemi.com 4 0V or VCC 10 MHz Typical Units 7 pF 8 pF 25 pF 74LCX07 AC Loading and Waveforms FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance) Test Switch VCC x 2 at VCC tPZL, tPLZ 6V at VCC 5.0 r 0.5V 3.3 r 0.3V VCC x 2 at VCC 2.5 r 0.2V trise and tfall 3-STATE Output Low Enable and Disable Times for Logic FIGURE 2. Waveforms (Input Pulse Characteristics; f =1MHz, tr = tf = 3ns) Symbol VCC 5.0V r 0.5V 3.3V r 0.3V 2.7V 2.5V r 0.2V Vmi VCC/2 1.5V 1.5V VCC/2 Vmo VCC/2 1.5V 1.5V VCC/2 Vx VOL  0.3V VOL  0.3V VOL  0.3V VOL  0.15V Vy VOH  0.3V VOH  0.3V VOH  0.3V VOH  0.15V 5 www.fairchildsemi.com 74LCX07 Tape and Reel Specification Tape Format for DQFN Package Designator BQX Tape Number Cavity Section Cavities Status Cover Tape Status Leader (Start End) 125 (typ) Empty Sealed Carrier 2500/3000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed TAPE DIMENSIONS inches (millimeters) REEL DIMENSIONS inches (millimeters) Tape Size 12 mm A B C D N W1 W2 13.0 0.059 0.512 0.795 7.008 0.488 0.724 (330) (1.50) (13.00) (20.20) (178) (12.4) (18.4) www.fairchildsemi.com 6 74LCX07 Physical Dimensions inches (millimeters) unless otherwise noted 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Package Number M14A 7 www.fairchildsemi.com 74LCX07 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M14D www.fairchildsemi.com 8 74LCX07 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm Package Number MLP014A 9 www.fairchildsemi.com 74LCX07 Low Voltage Hex Buffer with Open Drain Outputs Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC14 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com www.fairchildsemi.com 10