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Revised June 2002
74LCX16500
Low Voltage 18-Bit Universal Bus Transceivers with
5V Tolerant Inputs and Outputs
General Description
Features
These 18-bit universal bus transceivers combine D-type
latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes.
■ 5V tolerant inputs and outputs
Data flow in each direction is controlled by output-enable
(OEAB and OEBA), latch-enable (LEAB and LEBA), and
clock (CLKAB and CLKBA) inputs.
The LCX16500 is designed for low voltage (2.5V or 3.3V)
VCC applications with the capability of interfacing to a 5V
signal environment.
The LCX16500 is fabricated with an advanced CMOS technology to achieve high speed operation while maintaining
CMOS low power.
■ 2.3V–3.6V VCC specifications provided
■ 6.0 ns tPD max (VCC = 3.3V), 20 µA ICC max
■ Power down high impedance inputs and outputs
■ Supports live insertion/withdrawal (Note 1)
■ ±24 mA output drive (VCC = 3.0V)
■ Uses proprietary noise/EMI reduction circuitry
■ Latch-up performance exceeds 500 mA
■ ESD performance:
Human body model > 2000V
Machine model > 200V
■ Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to VCC and OE tied to GND through a resistor: the minimum
value or the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Order Number
74LCX16500G
(Note 2)(Note 3)
Package Number
BGA54A
74LCX16500MEA
(Note 3)
MS56A
74LCX16500MTD
(Note 3)
MTD56
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 2: Ordering code “G” indicates Trays.
Note 3: Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
© 2002 Fairchild Semiconductor Corporation
DS012407
www.fairchildsemi.com
74LCX16500 Low Voltage 18-Bit Universal Bus Transceivers with 5V Tolerant Inputs and Outputs
March 1995
74LCX16500
Connection Diagrams
Pin Descriptions
Pin Names
Pin Assignment for SSOP and TSSOP
Description
A1 - A18
Data Register A Inputs/3-STATE Outputs
B1 - B18
Data Register B Inputs/3-STATE Outputs
CLKAB, CLKBA Clock Pulse Inputs
LEAB, LEBA
Latch Enable Inputs
OEBA, OEBA
Output Enable Inputs
FBGA Pin Assignments
1
2
3
4
5
6
A
A2
A1
OEAB
GND
B1
B2
B
A4
A3
LEAB CLKAB
B3
B4
C
A6
A5
VCC
VCC
B5
B6
D
A8
A7
GND
GND
B7
B8
E
A10
A9
GND
GND
B9
B10
F
A12
A11
GND
GND
B11
B12
G
A14
A13
VCC
VCC
B13
B14
H
A16
A15
OEBA CLKBA
B15
B16
J
A17
A18
LEBA
B18
B17
GND
Truth Table (Note 4)
Inputs
OEAB
Pin Assignment for FBGA
LEAB
Output
CLKAB
An
Bn
Z
L
X
X
X
H
H
X
L
L
H
H
X
H
H
H
L
↓
L
L
H
L
↓
H
H
H
L
H
X
B0 (Note 5)
H
L
L
X
B0 (Note 6)
Note 4: A-to-B data flow is shown: B-to-A flow is similar but uses OEBA,
LEBA, and CLKBA.
Note 5: Output level before the indicated steady-state input conditions
were established.
Note 6: Output level before the indicated steady-state input conditions
were established, provided that CLKAB was LOW before LEAB went LOW.
Functional Description
For A-to-B data flow, the LCX16500 operates in the transparent mode when LEAB is HIGH. When LEAB is LOW,
the A data is latched if CLKAB is held at a HIGH or LOW
logic level. If LEAB is LOW, the A bus data is stored in the
latch/flip-flop on the HIGH-to-LOW transition of CLKAB.
Output-enable OEAB is active-HIGH. When OEAB is
HIGH, the outputs are active. When OEAB is LOW, the outputs are in the high impedance state.
(Top Thru View)
Data flow for B to A is similar to that of A to B but uses
OEBA, LEBA, and CLKBA. The output enables are complementary (OEAB is active HIGH and OEBA is active
LOW).
www.fairchildsemi.com
2
74LCX16500
Logic Diagram
3
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74LCX16500
Absolute Maximum Ratings(Note 7)
Symbol
Parameter
Value
VCC
Supply Voltage
−0.5 to +7.0
VI
DC Input Voltage
−0.5 to +7.0
VO
DC Output Voltage
−0.5 to +7.0
Conditions
Units
V
V
Output in 3-STATE
−0.5 to VCC + 0.5
Output in HIGH or LOW State (Note 8)
IIK
DC Input Diode Current
−50
VI < GND
IOK
DC Output Diode Current
−50
VO < GND
+50
VO > VCC
V
mA
mA
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature
−65 to +150
°C
Recommended Operating Conditions
(Note 9)
Symbol
VCC
Parameter
Supply Voltage
VI
Input Voltage
VO
Output Voltage
IOH/IOL
TA
Free-Air Operating Temperature
Input Edge Rate, VIN = 0.8V–2.0V, VCC = 3.0V
Max
2.0
3.6
Data Retention
1.5
3.6
0
5.5
HIGH or LOW State
0
VCC
3-STATE
0
5.5
Output Current
∆t/∆V
Min
Operating
VCC = 3.0V − 3.6V
±24
VCC = 2.7V − 3.0V
±12
VCC = 2.3V − 2.7V
±8
Units
V
V
V
mA
−40
85
°C
0
10
ns/V
Note 7: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation.
Note 8: IO Absolute Maximum Rating must be observed.
Note 9: Unused (inputs or I/O's) must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
Symbol
VIH
VIL
VOH
VOL
Parameter
Conditions
HIGH Level Input Voltage
LOW Level Input Voltage
HIGH Level Output Voltage
LOW Level Output Voltage
IOH = −100 µA
VCC
TA = −40°C to +85°C
(V)
Min
2.3 − 2.7
1.7
2.7 − 3.6
2.0
Max
V
2.3 − 2.7
0.7
2.7 − 3.6
0.8
2.3 − 3.6
Units
V
VCC − 0.2
IOH = −8 mA
2.3
1.8
IOH = −12 mA
2.7
2.2
IOH = −18 mA
3.0
2.4
IOH = −24 mA
3.0
2.2
IOL = 100 µA
2.3 − 3.6
0.2
IOL = 8 mA
2.3
0.6
IOL = 12 mA
2.7
0.4
IOL = 16 mA
3.0
0.4
V
V
IOL = 24 mA
3.0
0.55
II
Input Leakage Current
0 ≤ VI ≤ 5.5V
2.3 − 3.6
±5.0
µA
IOZ
3-STATE I/O Leakage
0 ≤ VO ≤ 5.5V
2.3 − 3.6
±5.0
µA
0
10
µA
VI = VIH or VIL
IOFF
Power-Off Leakage Current
www.fairchildsemi.com
VI or VO = 5.5V
4
Symbol
(Continued)
Parameter
VCC
Conditions
(V)
ICC
∆ICC
Quiescent Supply Current
Increase in ICC per Input
TA = −40°C to +85°C
Min
Units
Max
VI = V CC or GND
2.3 − 3.6
20
3.6V ≤ VI, VO ≤ 5.5V (Note 10)
2.3 − 3.6
±20
VIH = VCC −0.6V
2.3 − 3.6
500
µA
µA
Note 10: Outputs disabled or 3-STATE only.
AC Electrical Characteristics
TA = −40°C to +85°C, RL = 500 Ω
Symbol
Parameter
VCC = 3.3V ± 0.3V
VCC = 2.7V
VCC = 2.5V ± 0.2V
CL = 50 pF
CL = 50 pF
CL = 30 pF
Min
Max
Min
Max
Min
Max
1.5
6.0
1.5
7.0
1.5
7.2
Bus to Bus
1.5
6.0
1.5
7.0
1.5
7.2
fMAX
Maximum Clock Frequency
170
tPHL
Propagation Delay
tPLH
MHz
tPHL
Propagation Delay
1.5
6.7
1.5
8.0
1.5
8.4
tPLH
Clock to Bus
1.5
6.7
1.5
8.0
1.5
8.4
tPHL
Propagation Delay
1.5
7.0
1.5
8.0
1.5
8.4
tPLH
LE to Bus
1.5
7.0
1.5
8.0
1.5
8.4
tPZL
Output Enable Time
1.5
7.2
1.5
8.2
1.5
9.4
1.5
7.2
1.5
8.2
1.5
9.4
1.5
7.0
1.5
8.0
1.5
8.4
1.5
7.0
1.5
8.0
1.5
8.4
tPZH
tPLZ
Output Disable Time
tPHZ
Units
ns
ns
ns
ns
ns
tS
Setup Time
2.5
2.5
3.0
ns
tH
Hold Time
1.5
1.5
2.0
ns
tW
Pulse Width
3.0
3.0
3.5
ns
tOSHL
Output to Output Skew
1.0
tOSLH
(Note 11)
1.0
ns
Note 11: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL), or LOW-to-HIGH (tOSLH).
Dynamic Switching Characteristics
Symbol
VOLP
VOLV
Parameter
Quiet Output Dynamic Peak VOL
Quiet Output Dynamic Valley VOL
Conditions
VCC
TA = 25°C
(V)
Typical
CL = 50 pF, VIH = 3.3V, VIL = 0V
3.3
0.8
CL = 30 pF, VIH =2.5V, VIL = 0V
2.5
0.6
CL = 50 pF, VIH = 3.3V, VIL = 0V
3.3
−0.8
CL = 30 pF, VIH =2.5V, VIL = 0V
2.5
−0.6
Units
V
V
Capacitance
Typical
Units
CIN
Symbol
Input Capacitance
Parameter
VCC = Open, VI = 0V or VCC
Conditions
7
pF
CI/O
Input/Output Capacitance
VCC = 3.3V, VI = 0V or VCC
8
pF
CPD
Power Dissipation Capacitance
VCC = 3.3V, VI = 0V or VCC, f = 10 MHz
20
pF
5
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74LCX16500
DC Electrical Characteristics
74LCX16500
AC LOADING and WAVEFORMS Generic for LCX Family
FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance)
Test
Switch
tPLH, tPHL
Open
tPZL, tPLZ
6V at VCC = 3.3 ± 0.3V, and 2.7V
VCC x 2 at VCC = 2.5 ± 0.2V
tPZH,tPHZ
GND
Waveform for Inverting and Non-Inverting Functions
3-STATE Output High Enable and
Disable Times for Logic
Propagation Delay. Pulse Width and trec Waveforms
Setup Time, Hold Time and Recovery Time for Logic
trise and tfall
3-STATE Output Low Enable and
Disable Times for Logic
FIGURE 2. Waveforms
(Input Characteristics; f =1MHz, tr = tf = 3ns)
Symbol
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VCC
3.3V ± 0.3V
2.7V
2.5V ± 0.2V
Vmi
1.5V
1.5V
VCC/2
Vmo
1.5V
1.5V
VCC/2
Vx
VOL + 0.3V
VOL + 0.3V
VOL + 0.15V
Vy
VOH − 0.3V
VOH − 0.3V
VOH − 0.15V
6
74LCX16500
Schematic Diagram Generic for LCX Family
7
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74LCX16500
Physical Dimensions inches (millimeters) unless otherwise noted
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
Package Number BGA54A
www.fairchildsemi.com
8
74LCX16500
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
Package Number MS56A
9
www.fairchildsemi.com
74LCX16500 Low Voltage 18-Bit Universal Bus Transceivers with 5V Tolerant Inputs and Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD56
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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10
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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