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74LCX245MTCX

74LCX245MTCX

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TSSOP20_6.5X4.4MM

  • 描述:

    IC TXRX NON-INVERT 3.6V 20TSSOP

  • 数据手册
  • 价格&库存
74LCX245MTCX 数据手册
Revised March 2005 74LCX245 Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs General Description Features The LCX245 contains eight non-inverting bidirectional buffers with 3-STATE outputs and is intended for bus oriented applications. The device is designed for low voltage (2.5V and 3.3V) VCC applications with capability of interfacing to a 5V signal environment. The T/R input determines the direction of data flow through the device. The OE input disables both the A and B ports by placing them in a high impedance state. ■ 5V tolerant inputs and outputs The LCX245 is fabricated with an advanced CMOS technology to achieve high speed operation while maintaining CMOS low power dissipation. ■ 2.3V to 3.6V VCC specifications provided ■ 7.0 ns tPD max (VCC 3.3V), 10 PA ICC max ■ Power down high impedance inputs and outputs ■ Supports live insertion/withdrawal (Note 1) ■ r24 mA output drive (VCC 3.0V) ■ Implements patented noise/EMI reduction circuitry ■ Latch-up performance exceeds 500 mA ■ ESD performance: Human body model ! 2000V Machine model ! 200V ■ Leadless DQFN Pb-Free package Note 1: To ensure the high-impedance state during power up or down, OE should be tied to VCC through a pull-up resistor: the minimum value or the resistor is determined by the current-sourcing capability of the driver. Ordering Code: Order Number Package Number Package Description 74LCX245WM (Note 2) M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74LCX245WMX_NL (Note 4) M20B Pb-Free 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74LCX245SJ (Note 2) M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LCX245BQX (Note 3) MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm 74LCX245MSA (Note 2) MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74LCX245MTC (Note 2) MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74LCX245MTCX_NL (Note 4) MTC20 Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Pb-Free package per JEDEC J-STD-020B. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Note 3: DQFN package available in Tape and Reel only. Note 4: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only. © 2005 Fairchild Semiconductor Corporation DS012006 www.fairchildsemi.com 74LCX245 Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs February 1994 74LCX245 Logic Symbol Connection Diagrams Pin Assignments for SOIC, SOP, SSOP, and TSSOP Pin Descriptions Pin Names Description OE Output Enable Input T/R Transmit/Receive Input A0–A7 Side A Inputs or 3-STATE Outputs B0–B7 Side B Inputs or 3-STATE Outputs Pin Assignment for DQFN Truth Table Inputs Outputs OE T/R L L L H Bus A0 – A7 Data to Bus B0 – B7 H X HIGH Z State on A0 – A7, B0 – B7 (Note 5) Bus B0 – B7 Data to Bus A0 – A7 H HIGH Voltage Level L LOW Voltage Level X Immaterial Z High Impedance Note 5: Unused bus terminals during HIGH Z State must be held HIGH or LOW. (Top Through View) Logic Diagram www.fairchildsemi.com 2 Symbol Parameter VCC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current Value IO DC Output Source/Sink Current ICC DC Supply Current per Supply Pin IGND DC Ground Current per Ground Pin TSTG Storage Temperature Conditions 0.5 to 7.0 0.5 to 7.0 0.5 to 7.0 0.5 to VCC  0.5 50 50 50 r50 r100 r100 65 to 150 Units V V Output in 3-STATE Output in HIGH or LOW State (Note 7) VI  GND V mA VO  GND mA VO ! VCC mA mA mA qC Recommended Operating Conditions (Note 8) Symbol VCC Parameter VI Input Voltage VO Output Voltage IOH/IOL Min Max Operating 2.0 3.6 Data Retention 1.5 3.6 Supply Voltage Output Current TA Free-Air Operating Temperature 't/'V Input Edge Rate, VIN 0.8V to 2.0V, VCC 0 5.5 HIGH or LOW State 0 VCC 3-STATE 0 5.5 VCC 3.0V to 3.6V VCC 2.7V to 3.0V VCC 2.3V to 2.7V r24 r12 r8 Units V V V mA 40 85 qC 0 10 ns/V 3.0V Note 6: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation. Note 7: IO Absolute Maximum Rating must be observed. Note 8: Unused inputs or I/O pins must be held HIGH or LOW. They may not float. DC Electrical Characteristics Symbol VIH VIL VOH VOL Parameter Conditions HIGH Level Input Voltage LOW Level Input Voltage HIGH Level Output Voltage LOW Level Output Voltage Min 2.3 to 2.7 1.7 2.7 to 3.6 2.0 40qC to 85qC Max 2.3 to 2.7 0.7 0.8 100 PA 8 mA 2.3 1.8 IOH 12 mA 2.7 2.2 IOH 18 mA 3.0 2.4 2.2 2.3 to 3.6 V IOH 24 mA 3.0 100 PA 2.3 to 3.6 IOL 8mA 2.3 0.6 IOL 12 mA 2.7 0.4 IOL 16 mA 3.0 0.4 IOL 24 mA IOZ 3-STATE I/O Leakage 0 d VO d 5.5V VI VIH or VIL VI or VO 5.5V 3 V VCC  0.2 IOL 0 d VI d 5.5V Units V 2.7 to 3.6 IOH Input Leakage Current Power-Off Leakage Current TA (V) IOH II IOFF VCC 0.2 V 3.0 0.55 2.3 to 3.6 r5.0 PA 2.3 to 3.6 r5.0 PA 0 10 PA www.fairchildsemi.com 74LCX245 Absolute Maximum Ratings(Note 6) 74LCX245 DC Electrical Characteristics Symbol Parameter Conditions Quiescent Supply Current ICC (Continued) VI VCC or GND 3.6V d VI, VO d 5.5V (Note 9) 'ICC Increase in ICC per Input VIH VCC 0.6V 40qC to 85qC VCC TA (V) Min Units Max 2.3 to 3.6 10 2.3 to 3.6 r10 2.3 to 3.6 500 PA PA Note 9: Outputs disabled or 3-STATE only. AC Electrical Characteristics 40qC to 85qC, RL TA Symbol Parameter VCC CL 3.3V r 0.3V VCC 50 pF 2.7V CL 500: VCC 50 pF CL 2.5V r 0.2V 30 pF Min Max Min Max Min tPHL Propagation Delay 1.5 7.0 1.5 8.0 1.5 8.4 tPLH An to Bn or Bn to An 1.5 7.0 1.5 8.0 1.5 8.4 tPZL Output Enable Time tPZH tPLZ Output Disable Time tPHZ Max 1.5 8.5 1.5 9.5 1.5 10.5 1.5 8.5 1.5 9.5 1.5 10.5 1.5 7.5 1.5 8.5 1.5 9.0 1.5 7.5 1.5 8.5 1.5 9.0 tOSHL Output to Output Skew 1.0 tOSLH (Note 10) 1.0 Units ns ns ns ns Note 10: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Dynamic Switching Characteristics Symbol VOLP VOLV Parameter Quiet Output Dynamic Peak VOL Quiet Output Dynamic Valley VOL VCC Conditions TA 25qC (V) Typical CL 50 pF, VIH 3.3V, VIL 0V 3.3 0.8 CL 30 pF, VIH 2.5V, VIL 0V 2.5 0.6 CL 50 pF, VIH 3.3V, V IL 0V 3.3 0.8 CL 30 pF, VIH 2.5V, VIL 0V 2.5 0.6 Units V V Capacitance Symbol Parameter Conditions CIN Input Capacitance VCC Open, VI CI/O Input/Output Capacitance VCC 3.3V, VI 0V or VCC CPD Power Dissipation Capacitance VCC 3.3V, VI 0V or VCC, f www.fairchildsemi.com 4 0V or VCC 10 MHz Typical Units 7.0 pF 8.0 pF 25.0 pF 74LCX245 AC LOADING and WAVEFORMS Generic for LCX Family FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance) Test Switch tPLH, tPHL Open tPZL, tPLZ 6V at VCC 3.3V r 0.3V VCC x 2 at VCC tPZH, tPHZ 2.5V r 0.2V GND Waveform for Inverting and Non-Inverting Functions 3-STATE Output High Enable and Disable Times for Logic Propagation Delay. Pulse Width and trec Waveforms Setup Time, Hold Time and Recovery Time for Logic trise and tfall 3-STATE Output Low Enable and Disable Times for Logic FIGURE 2. Waveforms (Input Characteristics; f =1MHz, tr = tf = 3ns) Symbol VCC 3.3V r 0.3V 2.7V 2.5V r 0.2V Vmi 1.5V 1.5V VCC/2 Vmo 1.5V 1.5V VCC/2 Vx VOL  0.3V VOL  0.3V VOL  0.15V Vy VOH  0.3V VOH  0.3V VOH  0.15V 5 www.fairchildsemi.com 74LCX245 Schematic Diagram Generic for LCX Family www.fairchildsemi.com 6 Tape Format for DQFN Package Designator BQX Tape Number Cavity Section Cavities Status Cover Tape Status Leader (Start End) 125 (typ) Empty Sealed Carrier 3000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed TAPE DIMENSIONS inches (millimeters) REEL DIMENSIONS inches (millimeters) Tape Size 12 mm A B C D N W1 W2 13.0 0.059 0.512 0.795 2.165 0.488 0.724 (330.0) (1.50) (13.00) (20.20) (55.00) (12.4) (18.4) 7 www.fairchildsemi.com 74LCX245 Tape and Reel Specification 74LCX245 Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package Number M20B www.fairchildsemi.com 8 74LCX245 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D 9 www.fairchildsemi.com 74LCX245 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm Package Number MLP020B www.fairchildsemi.com 10 74LCX245 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide Package Number MSA20 11 www.fairchildsemi.com 74LCX245 Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com www.fairchildsemi.com 12
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