74LVXT4066

MC74LVXT4066 Quad Analog Switch/ Multiplexer/Demultiplexer High−Performance Silicon−Gate CMOS The MC74LVXT4066 utilizes silicon−gate CMOS technology to achieve fast propagation delays, low ON resistances, and low OFF−channel leakage current. This bilateral switch/multiplexer/ demultiplexer controls analog and digital voltages that may vary across the full power−supply range (from VCC to GND). The LVXT4066 is identical in pinout to the metal−gate CMOS MC14066 and the high−speed CMOS HC4066A. Each device has four independent switches. The device has been designed so that the ON resistances (RON) are much more linear over input voltage than RON of metal−gate CMOS analog switches. The ON/OFF control inputs are compatible with standard LSTTL outputs. The input protection circuitry on this device allows overvoltage tolerance on the ON/OFF control inputs, allowing the device to be used as a logic−level translator from 3.0 V CMOS logic to 5.0 V CMOS Logic or from 1.8 V CMOS logic to 3.0 V CMOS Logic while operating at the higher−voltage power supply. The MC74LVXT4066 input structure provides protection when voltages up to 7.0 V are applied, regardless of the supply voltage. This allows the MC74LVXT4066 to be used to interface 5.0 V circuits to 3.0 V circuits. Features http://onsemi.com MARKING DIAGRAMS 14 14 1 SOIC−14 D SUFFIX CASE 751A 1 LVXT4066 AWLYWW 14 14 1 TSSOP−14 DT SUFFIX CASE 948G 1 LVXT 4066 ALYW • • • • • • • • • Fast Switching and Propagation Speeds High ON/OFF Output Voltage Ratio Low Crosstalk Between Switches Diode Protection on All Inputs/Outputs Wide Power−Supply Voltage Range (VCC − GND) = 2.0 to 6.0 V Analog Input Voltage Range (VCC − GND) = 2.0 to 6.0 V Improved Linearity and Lower ON Resistance over Input Voltage than the MC14016 or MC14066 Low Noise Pb−Free Packages are Available* 14 SOEIAJ−14 M SUFFIX CASE 965 1 74LVXT4066 ALYW 14 1 A WL or L Y WW or W = = = = Assembly Location Wafer Lot Year Work Week ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005 1 March, 2005 − Rev. 2 Publication Order Number: MC74LVXT4066/D MC74LVXT4066 LOGIC DIAGRAM XA A ON/OFF CONTROL XB B ON/OFF CONTROL XC C ON/OFF CONTROL XD D ON/OFF CONTROL 1 13 4 5 8 6 11 12 10 YD 9 YC 3 YB ANALOG OUTPUTS/INPUTS 2 YA PIN CONNECTION (Top View) XA YA YB XB B ON/OFF CONTROL C ON/OFF CONTROL GND 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC A ON/OFF CONTROL D ON/OFF CONTROL XD YD YC XC ANALOG INPUTS/OUTPUTS = XA, XB, XC, XD PIN 14 = VCC PIN 7 = GND FUNCTION TABLE On/Off Control Input L H State of Analog Switch Off On ORDERING INFORMATION Device MC74LVXT4066DR2 MC74LVXT4066DR2G MC74LVXT4066DTR2 MC74LVXT4066M MC74LVXT4066MG MC74LVXT4066MEL MC74LVXT4066MELG Package SOIC−14 SOIC−14 (Pb−Free) TSSOP−14* SOEIAJ−14 SOEIAJ−14 (Pb−Free) SOEIAJ−14 SOEIAJ−14 (Pb−Free) Shipping† 2500 Tape & Reel 2500 Tape & Reel 2500 Tape & Reel 50 Units / Rail 50 Units / Rail 2000 Tape & Reel 2000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 2 MC74LVXT4066 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î ÎÎ Î Î ÎÎ Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎ Î Î Î Î ÎÎÎ Î Î Î Î Î ÎÎ Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î Î ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î Î ÎÎ Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î ÎÎÎ Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î ÎÎÎ Î Î ÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎ ÎÎÎ Î ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ MAXIMUM RATINGS Symbol VCC VIS Vin I Parameter Value Unit V V V Positive DC Supply Voltage (Referenced to GND) Analog Input Voltage (Referenced to GND) Digital Input Voltage (Referenced to GND) DC Current Into or Out of Any Pin Power Dissipation in Still Air, Storage Temperature – 0.5 to + 7.0 – 0.5 to VCC + 0.5 – 0.5 to VCC + 0.5 −20 500 450 mA PD SOIC Package† TSSOP Package† mW _C _C Tstg TL – 65 to + 150 260 Lead Temperature, 1 mm from Case for 10 Seconds Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. †Derating − SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: − 6.1 mW/_C from 65_ to 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V CC ). Unused outputs must be left open. I/O pins must be connected to a properly terminated line or bus. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIS Vin Parameter Min 2.0 Max 5.5 Unit V V V V Positive DC Supply Voltage (Referenced to GND) Analog Input Voltage (Referenced to GND) Digital Input Voltage (Referenced to GND) Static or Dynamic Voltage Across Switch GND GND − VCC VCC 1.2 VIO* TA Operating Temperature, All Package Types – 55 0 0 + 85 100 20 _C tr, tf Input Rise and Fall Time, ON/OFF Control Inputs (Figure 10) VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V ns/V *For voltage drops across the switch greater than 1.2 V (switch on), excessive VCC current may be drawn; i.e., the current out of the switch may contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded. DC ELECTRICAL CHARACTERISTIC Digital Section (Voltages Referenced to GND) Symbol VIH Parameter Test Conditions VCC V 3.0 4.5 5.5 3.0 4.5 5.5 5.5 5.5 Guaranteed Limit v 85_C 1.2 2.0 2.0 – 55 to 25_C 1.2 2.0 2.0 v 125_C 1.2 2.0 2.0 Unit V Minimum High−Level Voltage ON/OFF Control Inputs (Note 1) Ron = Per Spec VIL Maximum Low−Level Voltage ON/OFF Control Inputs (Note 1) Ron = Per Spec 0.53 0.8 0.8 0.53 0.8 0.8 0.53 0.8 0.8 V Iin Maximum Input Leakage Current ON/OFF Control Inputs Maximum Quiescent Supply Current (per Package) Vin = VCC or GND ± 0.1 4.0 ± 1.0 40 ± 1.0 160 mA mA ICC Vin = VCC or GND VIO = 0 V 1. Specifications are for design target only. Not final specification limits. http://onsemi.com 3 MC74LVXT4066 DC ELECTRICAL CHARACTERISTICS Analog Section (Voltages Referenced to GND) ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ ÎÎ Î ÎÎÎÎ ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î Î Î Î ÎÎ ÎÎ Î ÎÎ ÎÎ Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎ Î ÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î Î Î Î ÎÎ Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎ Î ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î Î Î Î Î ÎÎ Î Î ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î Î Î Î ÎÎ ÎÎ Î Î ÎÎ ÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î ÎÎ ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î Î Î ÎÎÎ Î Î Î Î Î Î ÎÎ ÎÎ Î Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î Î ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î ÎÎÎ Î Î Î Î Î ÎÎ Î Î Î ÎÎ Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î Î Î Î Î ÎÎ Î Î ÎÎ Î Î ÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î ÎÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ Î Î Î Î Î ÎÎ Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î Î ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î ÎÎÎ Î Î Î Î Î ÎÎ Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î Î Î Guaranteed Limit v 85_C — 45 28 25 — 35 28 25 Symbol Ron Parameter Test Conditions VCC V – 55 to 25_C — 40 25 20 — 30 25 20 v 125_C — 50 35 30 — 40 35 30 Unit W Maximum “ON” Resistance Vin = VIH VIS = VCC to GND IS v 2.0 mA (Figures 1, 2) 2.0† 3.0 4.5 5.5 2.0 3.0 4.5 5.5 3.0 4.5 5.5 5.5 Vin = VIH VIS = VCC or GND (Endpoints) IS v 2.0 mA (Figures 1, 2) Vin = VIH VIS = 1/2 (VCC − GND) IS v 2.0 mA Vin = VIL VIO = VCC or GND Switch Off (Figure 3) DRon Maximum Difference in “ON” Resistance Between Any Two Channels in the Same Package 15 10 10 20 12 12 25 15 15 W Ioff Maximum Off−Channel Leakage Current, Any One Channel 0.1 0.5 1.0 mA Ion Maximum On−Channel Leakage Current, Any One Channel Vin = VIH VIS = VCC or GND (Figure 4) 5.5 0.1 0.5 1.0 mA †At supply voltage (VCC) approaching 2 V the analog switch−on resistance becomes extremely non−linear. Therefore, for low−voltage operation, it is recommended that these devices only be used to control digital signals. AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, ON/OFF Control Inputs: tr = tf = 6 ns) Symbol tPLH, tPHL Parameter VCC V 2.0 3.0 4.5 5.5 2.0 3.0 4.5 5.5 2.0 3.0 4.5 5.5 — — — Guaranteed Limit v 85_C 6.0 5.0 2.0 2.0 35 25 18 18 25 14 10 10 10 – 55 to 25_C 4.0 3.0 1.0 1.0 30 20 15 15 v 125_C 8.0 6.0 2.0 2.0 40 30 22 20 30 15 12 12 10 Unit ns Maximum Propagation Delay, Analog Input to Analog Output (Figures 8 and 9) tPLZ, tPHZ Maximum Propagation Delay, ON/OFF Control to Analog Output (Figures 10 and 11) ns tPZL, tPZH Maximum Propagation Delay, ON/OFF Control to Analog Output (Figures 10 and 1 1) 20 12 8.0 8.0 10 ns C Maximum Capacitance ON/OFF Control Input pF Control Input = GND Analog I/O Feedthrough 35 1.0 35 1.0 35 1.0 Typical @ 25°C, VCC = 5.0 V 15 CPD Power Dissipation Capacitance (Per Switch) (Figure 13)* pF * Used to determine the no−load dynamic power consumption: P D = CPD VCC2 f + ICC VCC . http://onsemi.com 4 MC74LVXT4066 ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted) ÎÎÎ Î Î Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ ÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î Î ÎÎ Î ÎÎ Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î Î ÎÎ Î ÎÎ Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ Î Î Î ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î ÎÎÎ Î Î Î ÎÎ Î Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ ÎÎ ÎÎ Î ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î ÎÎ Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ Î Î ÎÎÎ Î Î Î ÎÎ Î ÎÎ Î Î Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎ ÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol BW Parameter Test Conditions VCC V 4.5 5.5 Limit* 25_C 150 160 Unit Maximum On−Channel Bandwidth or Minimum Frequency Response (Figure 5) Off−Channel Feedthrough Isolation (Figure 6) fin = 1 MHz Sine Wave Adjust fin Voltage to Obtain 0 dBm at VOS Increase fin Frequency Until dB Meter Reads – 3 dB RL = 50 W, CL = 10 pF fin  Sine Wave Adjust fin Voltage to Obtain 0 dBm at VIS fin = 10 kHz, RL = 600 W, CL = 50 pF fin = 1.0 MHz, RL = 50 W, CL = 10 pF MHz − 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 − 50 − 50 − 37 − 37 100 200 dB − Feedthrough Noise, Control to Switch (Figure 7) Vin v 1 MHz Square Wave (tr = tf = 3 ns) Adjust RL at Setup so that IS = 0 A RL = 600 W, CL = 50 pF RL = 10 kW, CL = 10 pF mVPP 50 100 − Crosstalk Between Any Two Switches (Figure 12) fin  Sine Wave Adjust fin Voltage to Obtain 0 dBm at VIS fin = 10 kHz, RL = 600 W, CL = 50 pF fin = 1.0 MHz, RL = 50 W, CL = 10 pF – 70 – 70 – 80 – 80 dB THD Total Harmonic Distortion (Figure 14) fin = 1 kHz, RL = 10 kW, CL = 50 pF THD = THDMeasured − THDSource VIS = 4.0 VPP sine wave VIS = 5.0 VPP sine wave % 4.5 5.5 0.10 0.06 *Guaranteed limits not tested. Determined by design and verified by qualification. http://onsemi.com 5 MC74LVXT4066 250 Is = 1mA 400 350 300 Ron (Ohms) 250 200 150 100 50 0 Is = 15mA 0 0.5 1 Vin (Volts) 1.5 2 2.5 0 0 0.5 1 Vin (Volts) 1.5 2 2.5 −55°C 25°C 85°C 125°C 200 Ron (Ohms) 150 Is = 5mA Is = 9mA 50 100 Figure 1a. Typical On Resistance, VCC = 2.0 V, T = 25°C Figure 1b. Typical On Resistance, VCC = 2.0 V 35 30 25 20 25 20 15 10 5 0 0 1 2 Vin (Volts) 3 4 125°C 85°C 25°C −55°C 15 125°C 85°C 25°C −55°C Ron (Ohms) Ron (Ohms) 10 5 0 0 1 2 Vin (Volts) 3 4 5 Figure 1c. Typical On Resistance, VCC = 3.0 V Figure 1d. Typical On Resistance, VCC = 4.5 V 18 16 14 Ron (Ohms) 12 10 8 6 4 2 0 0 1 2 3 Vin (Volts) 4 5 6 ANALOG IN 125°C 85°C 25°C −55°C PROGRAMMABLE POWER SUPPLY − + PLOTTER MINI COMPUTER DC ANALYZER VCC DEVICE UNDER TEST COMMON OUT GND Figure 1e. Typical On Resistance, VCC = 5.5 V Figure 2. On Resistance Test Set−Up http://onsemi.com 6 MC74LVXT4066 VCC VCC GND VCC A OFF 14 VCC A GND ON 14 N/C VCC 7 SELECTED CONTROL INPUT VIL 7 SELECTED CONTROL INPUT VIH Figure 3. Maximum Off Channel Leakage Current, Any One Channel, Test Set−Up Figure 4. Maximum On Channel Leakage Current, Test Set−Up VCC 14 fin 0.1mF ON VOS fin 0.1mF VIS OFF RL SELECTED CONTROL INPUT 7 VCC 14 VOS CL* dB METER CL* dB METER 7 SELECTED CONTROL INPUT VCC *Includes all probe and jig capacitance. *Includes all probe and jig capacitance. Figure 5. Maximum On−Channel Bandwidth Test Set−Up Figure 6. Off−Channel Feedthrough Isolation, Test Set−Up VCC/2 14 RL OFF/ON VCC VCC/2 RL IS VOS CL* VCC ANALOG IN tPLH 50% 50% GND tPHL VIH VIL Vin ≤ 1 MHz tr = tf = 3 ns CONTROL 7 SELECTED CONTROL INPUT ANALOG OUT *Includes all probe and jig capacitance. Figure 7. Feedthrough Noise, ON/OFF Control to Analog Out, Test Set−Up Figure 8. Propagation Delays, Analog In to Analog Out http://onsemi.com 7 MC74LVXT4066 VCC 14 ANALOG IN ON ANALOG OUT CL* 50% ANALOG OUT 50% *Includes all probe and jig capacitance. tPZH tPHZ 90% VOH HIGH IMPEDANCE TEST POINT CONTROL 90% 50% 10% tPZL tPLZ tr tf VCC GND HIGH IMPEDANCE 10% VOL 7 SELECTED CONTROL INPUT VIH Figure 9. Propagation Delay Test Set−Up Figure 10. Propagation Delay, ON/OFF Control to Analog Out VIS VCC fin RL ON 0.1 mF TEST POINT OFF VIH OR VIL RL SELECTED CONTROL INPUT 7 VCC/2 RL CL* RL CL* 14 VOS POSITION 1 WHEN TESTING tPHZ AND tPZH 1 2 VCC 1 2 VIH VIL ON/OFF CL* SELECTED CONTROL INPUT 7 POSITION 2 WHEN TESTING tPLZ AND tPZL VCC 14 1 kW VCC/2 VCC/2 *Includes all probe and jig capacitance. *Includes all probe and jig capacitance. Figure 11. Propagation Delay Test Set−Up Figure 12. Crosstalk Between Any Two Switches, Test Set−Up VCC A 14 N/C OFF/ON N/C 0.1 mF fin ON RL SELECTED CONTROL INPUT VCC/2 7 SELECTED CONTROL INPUT VIH CL* VIS VCC VOS TO DISTORTION METER 7 VIH VIL ON/OFF CONTROL *Includes all probe and jig capacitance. Figure 13. Power Dissipation Capacitance Test Set−Up Figure 14. Total Harmonic Distortion, Test Set−Up http://onsemi.com 8 MC74LVXT4066 0 −10 −20 −30 dBm −40 −50 −60 −70 −80 −90 1.0 2.0 FREQUENCY (kHz) 3.0 DEVICE SOURCE FUNDAMENTAL FREQUENCY Figure 15. Plot, Harmonic Distortion APPLICATION INFORMATION The ON/OFF Control pins should be at VIH or VIL logic levels, VIH being recognized as logic high and VIL being recognized as a logic low. Unused analog inputs/outputs may be left floating (not connected). However, it is advisable to tie unused analog inputs and outputs to VCC or GND through a low value resistor. This minimizes crosstalk and feedthrough noise that may be picked−up by the unused I/O pins. The maximum analog voltage swings are determined by the supply voltages VCC and GND. The positive peak analog voltage should not exceed VCC. Similarly, the negative peak analog voltage should not go below GND. In the example below, the difference between VCC and GND is six volts. Therefore, using the configuration in Figure 16, a maximum analog signal of six volts peak−to−peak can be controlled. When voltage transients above VCC and/or below GND are anticipated on the analog channels, external diodes (Dx) are recommended as shown in Figure 17. These diodes should be small signal, fast turn−on types able to absorb the maximum anticipated current surges during clipping. An alternate method would be to replace the Dx diodes with Mosorbs (Mosorb™ is an acronym for high current surge protectors). Mosorbs are fast turn−on devices ideally suited for precise DC protection with no inherent wear out mechanism. VCC = 6.0 V + 6.0 V 0V SELECTED CONTROL INPUT 7 ANALOG I/O 14 ON ANALOG O/I + 6.0 V 0V Dx VCC 16 ON Dx VIH SELECTED CONTROL INPUT 7 VCC Dx Dx VIH OTHER CONTROL INPUTS (VIH OR VIL) OTHER CONTROL INPUTS (VIH OR VIL) Figure 16. 6.0 V Application Figure 17. Transient Suppressor Application http://onsemi.com 9 MC74LVXT4066 +3 V +5 V +3V GND ANALOG SIGNALS 14 ANALOG SIGNALS +3V GND LSTTL/ NMOS/ ABT/ ALS ANALOG SIGNALS 14 ANALOG SIGNALS LVXT4066 1.8 − 2.5V CIRCUITRY 5 6 14 15 R* = 2 TO 10 kW CONTROL INPUTS 7 LVXT4066 5 6 14 15 CONTROL INPUTS 7 a. Low Voltage Logic Level Shifting Control Figure 18. Low Voltage CMOS Interface b. Using LVXT4066 CHANNEL 4 1 OF 4 SWITCHES 1 OF 4 SWITCHES COMMON I/O 1 OF 4 SWITCHES 1 OF 4 SWITCHES − INPUT 1 OF 4 SWITCHES + 0.01 mF 1 2 34 CONTROL INPUTS LF356 OR EQUIVALENT OUTPUT CHANNEL 3 CHANNEL 2 CHANNEL 1 Figure 19. 4−Input Multiplexer Figure 20. Sample/Hold Amplifier http://onsemi.com 10 MC74LVXT4066 PACKAGE DIMENSIONS SOIC−14 D SUFFIX CASE 751A−03 ISSUE G −A− 14 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 −B− P 7 PL 0.25 (0.010) M B M 1 7 G C R X 45 _ F −T− SEATING PLANE D 14 PL 0.25 (0.010) K M M S J TB A S DIM A B C D F G J K M P R TSSOP−14 DT SUFFIX CASE 948G−01 ISSUE A 14X K REF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 −−− 1.20 −−− 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ 0.10 (0.004) 0.15 (0.006) T U S M TU S V S N 2X L/2 14 8 0.25 (0.010) M L PIN 1 IDENT. 1 7 B −U− N F DETAIL E K K1 J J1 0.15 (0.006) T U S A −V− SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D G H DETAIL E DIM A B C D F G H J J1 K K1 L M http://onsemi.com 11 ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ MC74LVXT4066 PACKAGE DIMENSIONS SOEIAJ−14 M SUFFIX CASE 965−01 ISSUE O 14 8 LE Q1 E HE M_ L DETAIL P 1 7 Z D e A VIEW P c NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 1.42 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.056 b 0.13 (0.005) M A1 0.10 (0.004) ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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