7WB3126CMX1TCG

ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. 7WB3126 2-Bit Bus Switch The 7WB3126 is an advanced high−speed low−power 2−bit bus switch in ultra−small footprints. Features • • • • • • • High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V 3 W Switch Connection Between 2 Ports Power Down Protection Provided on Inputs Zero Bounce TTL−Compatible Control Inputs Ultra−Small Pb−Free Packages These are Pb−Free Devices http://onsemi.com MARKING DIAGRAMS 8 1 UDFN8 MU SUFFIX CASE 517AJ ALM G 8 Micro8] DM SUFFIX CASE 846A 3126 AYWG G 1 UDFN8 1.95 x 1.0 CASE 517CA XM 1 A = Assembly Location Y = Year W = Work Week M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2014 October, 2014 − Rev. 1 1 Publication Order Number: 7WB3126/D 7WB3126 OE1 A1 1 8 2 7 VCC OE2 B2 3 6 B1 GND 4 5 A2 OE1 1 8 VCC A1 2 7 OE2 B2 3 6 B1 GND 4 5 A2 Figure 2. Micro8 (Top View) Figure 1. UDFN8 (Top Thru−View) A1 B1 FUNCTION TABLE OE1 A2 B2 OE2 Figure 3. Logic Diagram http://onsemi.com 2 Input OEn Function L Disconnect H Bn = An 7WB3126 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage Parameter −0.5 to +7.0 V VIN Control Pin Input Voltage −0.5 to +7.0 V VI/O Switch Input / Output Voltage −0.5 to +7.0 V IIK Control Pin DC Input Diode Current VIN < GND −50 mA IOK Switch I/O Port DC Diode Current VI/O < GND −50 mA IO ON−State Switch Current $128 mA Continuous Current Through VCC or GND $150 mA ICC DC Supply Current Per Supply Pin $150 mA IGND DC Ground Current per Ground Pin $150 mA TSTG Storage Temperature Range −65 to +150 °C 260 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL FR VESD ILATCHUP 150 °C UDFN8 (Note 1) Micro8 111 392 °C/W UDFN8 Micro8 1127 319 mW Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Mode (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V $200 mA Latchup Performance Above VCC and Below GND at 125°C (Note 5) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD22−A114−A. 3. Tested to EIA / JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 4.0 5.5 V VCC Positive DC Supply Voltage VIN Control Pin Input Voltage 0 5.5 V VI/O Switch Input / Output Voltage 0 5.5 V −55 +125 °C 0 0 5 DC nS/V TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Control Input Switch I/O Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. http://onsemi.com 3 7WB3126 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VCC (V) Conditions Min Typ 4.5 Max Min −1.2 Max Unit −1.2 V VIK Clamp Diode Voltage VIH High−Level Input Voltage (Control) 4.0 to 5.5 VIL Low−Level Input Voltage (Control) 4.0 to 5.5 0.8 0.8 V VOH Output Voltage High See Figure 4 Input Leakage Current 0 v VIN v 5.5 V 5.5 $0.1 $1.0 mA IOFF Power Off Leakage Current VI/O = 0 to 5.5 V 0 $0.1 $1.0 mA ICC Quiescent Supply Current IO = 0, VIN = VCC or 0 V 5.5 $0.1 $1.0 mA DICC Increase in Supply Current (Control Pin) One input at 3.4 V; Other inputs at VCC or GND 5.5 2.5 mA RON Switch ON Resistance VI/O = 0, II/O = 64 mA II/O = 30 mA 4.5 IIN II/O = −18 mA TA = −555C to +1255C TA = 255C 2.0 V W VI/O = 2.4, II/O = 15 mA VI/O = 2.4, II/O = 15 mA 2.0 3 3 7 7 7 7 6 15 15 10 20 20 4.0 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. AC ELECTRICAL CHARACTERISTICS Symbol Parameter VCC (V) Test Condition TA = −555C to +1255C TA = 25 5C Min Typ Max Min Unit 0.25 ns ns tPD Propagation Delay, Bus to Bus See Figure 5 4.0 to 5.5 tEN Output Enable Time See Figure 5 4.5 to 5.5 0.8 2.5 4.2 0.8 4.2 4.0 0.8 3.0 4.6 0.8 4.6 4.5 to 5.5 0.8 3.0 4.8 0.8 4.8 4.0 0.8 2.9 4.4 0.8 4.4 tDIS CIN Output Disable Time 0.25 Max ns Control Input Capacitance VIN = 5 or 0 V 5.0 2.5 pF CIO(ON) Switch On Capacitance Switch ON 5.0 10 pF CIO(OFF) Switch Off Capacitance Switch OFF 5.0 5 pF http://onsemi.com 4 7WB3126 TYPICAL DC CHARACTERISTICS VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 4.50 4.25 −6 mA 4.00 −12 mA 3.75 IOH = −0.1 mA 3.50 3.25 −24 mA 3.00 2.75 TA = +85°C VIN = VCC 2.50 2.25 4.00 4.25 4.75 5.25 5.00 5.50 5.75 5.60 VCC, SUPPLY VOLTAGE (V) VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 4.50 4.25 −6 mA −12 mA 4.00 3.75 IOH = −0.1 mA 3.50 3.25 −24 mA 3.00 2.75 TA = +25°C VIN = VCC 2.50 2.25 4.00 4.25 4.75 5.25 5.00 5.50 5.75 5.60 VCC, SUPPLY VOLTAGE (V) VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 4.50 4.25 −6 mA 4.00 −12 mA 3.75 IOH = −0.1 mA 3.50 3.25 −24 mA 3.00 2.75 TA = −40°C VIN = VCC 2.50 2.25 4.00 4.25 4.75 5.25 5.00 5.50 5.75 5.60 VCC, SUPPLY VOLTAGE (V) Figure 4. Output Voltage High vs Supply Voltage http://onsemi.com 5 7WB3126 AC LOADING AND WAVEFORMS Parameter Measurement Information From Output Under Test 500 W S1 7V Test S1 tPD Open tPLZ/tPZL 7V tPHZ/tPZH Open Open GND CL = 50 pF* 500 W *CL includes probes and jig capacitance. 1.5 V 1.5 V Output Control 3V Input tPHL VOH 1.5 V 1.5 V Output 1.5 V Output Waveform 2 S1 at Open (Note 6) VOL Voltage Waveforms Propagation Delay Times 1.5 V 3V 0V tPLZ tPZL Output Waveform 1 S1 at 7 V (Note 6) tPZH 0V tPLH 1.5 V 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ VOH VOH − 0.3 V 0V Voltage Waveforms Enable and Disable Times 6. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control 7. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, ZO = 50 W, tr v 2.5 ns, tf v 2.5 ns. 8. The outputs are measured one at a time, with one transition per measurement. 9. tPLZ and tPHZ are the same as tDIS. 10. tPZL and tPZH are the same as tEN. 11. tPHL and tPLH are the same as tPD. Figure 5. tPD, tEN, tDIS Loading and Waveforms http://onsemi.com 6 7WB3126 ORDERING INFORMATION Package Shipping† 7WB3126MUTAG UDFN8 (Pb−Free) 3000 / Tape & Reel 7WB3126DMR2G Micro8 (Pb−Free) 4000 / Tape & Reel UDFN8, 1.95 x 1.0, 0.5 mm Pitch (Pb−Free) 3000 / Tape & Reel Device 7WB3126DMUTCG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 7 7WB3126 PACKAGE DIMENSIONS UDFN8 1.8 x 1.2, 0.4P CASE 517AJ ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. A B D 0.10 C PIN ONE REFERENCE ÉÉ ÉÉ L1 E DETAIL A NOTE 5 0.10 C TOP VIEW (A3) 0.05 C DIM A A1 A3 b b2 D E e L L1 L2 A 0.05 C SIDE VIEW A1 e/2 e (b2) C DETAIL A 8X 1 SEATING PLANE L 4 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 0.30 REF 1.80 BSC 1.20 BSC 0.40 BSC 0.45 0.55 0.00 0.03 0.40 REF MOUNTING FOOTPRINT* SOLDERMASK DEFINED (L2) 8 5 BOTTOM VIEW 8X 8X b 0.10 M C A B 0.05 M C 0.66 7X 0.22 NOTE 3 1.50 1 0.32 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 7WB3126 PACKAGE DIMENSIONS UDFN8 1.95x1.0, 0.5P CASE 517CA ISSUE O PIN ONE REFERENCE 0.10 C 2X 2X ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 L 8X 0.30 4 1 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.54 NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 1 PKG OUTLINE 7WB3126 PACKAGE DIMENSIONS Micro8t CASE 846A ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A-01 OBSOLETE, NEW STANDARD 846A-02. D HE PIN 1 ID E e b 8 PL 0.08 (0.003) −T− M T B S A MILLIMETERS NOM MAX −− 1.10 0.08 0.15 0.33 0.40 0.18 0.23 3.00 3.10 3.00 3.10 0.65 BSC 0.40 0.55 0.70 4.75 4.90 5.05 DIM A A1 b c D E e L HE S SEATING PLANE MIN −− 0.05 0.25 0.13 2.90 2.90 INCHES NOM −− 0.003 0.013 0.007 0.118 0.118 0.026 BSC 0.016 0.021 0.187 0.193 MIN −− 0.002 0.010 0.005 0.114 0.114 MAX 0.043 0.006 0.016 0.009 0.122 0.122 0.028 0.199 A 0.038 (0.0015) A1 L c SOLDERING FOOTPRINT* 8X 1.04 0.041 0.38 0.015 3.20 0.126 6X 8X 4.24 0.167 0.65 0.0256 5.28 0.208 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Micro8 is a trademark of International Rectifier. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 10 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative 7WB3126/D