ON Semiconductor
Is Now
To learn more about onsemi™, please visit our website at
www.onsemi.com
onsemi and and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or
subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi
product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without
notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality,
or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws,
regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/
or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for
implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative
Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.
Translating Bus Exchange
Switch
7WBD383
The 7WBD383 is an advanced high−speed low−power translating
bus exchange switch in ultra−small footprints.
Features
•
•
•
•
•
•
•
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High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V
3 W Switch Connection Between 2 Ports
Power Down Protection Provided on Inputs
Zero Bounce
TTL−Compatible Control Inputs
Ultra−Small Pb−Free Packages
These are Pb−Free Devices
MARKING
DIAGRAMS
8
1
UDFN8
MU SUFFIX
CASE 517AJ
UDFN8
1.95 x 1.0
CASE 517CA
ALM
G
XM
1
8
Micro8
DM SUFFIX
CASE 846A
D383
AYWG
G
1
1
8
UQFN8
MU SUFFIX
CASE 523AN
1
US8
US SUFFIX
CASE 493
AJ M*G
G
AG
ALYW
Commercial
AL, X, D383, AJ, AG
M
A
L
Y
W
G
= Specific Device Code
= Date Code
= Assembly Location
= Lot Code
= Year Code
= Week Code
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
January, 2021 − Rev. 4
1
Publication Order Number:
7WBD383/D
7WBD383
OE
A
1
8
2
7
VCC
GND
3
6
4
5
A
B
7
6
5
OE
1
8
VCC
A
2
7
C
B
3
6
D
GND
4
5
EX
C
VCC
B
OE
8
4
GND
D
EX
1
2
3
C
D
EX
Figure 3. US8/Micro8
Figure 2. UQFN8
Figure 1. UDFN8
(Top View)
(Top Thru−View)
(Top Thru−View)
A
C
B
D
EX
OE
Figure 4. Logic Diagram
FUNCTION TABLE
Input OE
Input EX
Function
L
L
A = C; B = D
L
H
A = D; B = C
H
X
Disconnect
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2
7WBD383
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
Parameter
−0.5 to +7.0
V
VIN
Control Pin Input Voltage
−0.5 to +7.0
V
VI/O
Switch Input / Output Voltage
−0.5 to +7.0
V
IIK
Control Pin DC Input Diode Current
VIN < GND
−50
mA
IOK
Switch I/O Port DC Diode Current
VI/O < GND
−50
mA
IO
ON−State Switch Current
$128
mA
Continuous Current Through VCC or GND
$150
mA
ICC
DC Supply Current Per Supply Pin
$150
mA
IGND
DC Ground Current per Ground Pin
$150
mA
TSTG
Storage Temperature Range
−65 to +150
°C
260
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85°C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ILATCHUP
ESD Withstand Voltage
150
°C
US8 (Note 1)
UDFN8
UQFN8
Micro8
251
111
208
392
°C/W
US8
UDFN8
UQFN8
Micro8
498
1127
601
319
mW
Level 1
Oxygen Index: 28 to 34
Human Body Mode (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Latchup Performance Above VCC and Below GND at 125 °C (Note 5)
UL 94 V−0 @ 0.125 in
> 2000
> 200
N/A
V
$200
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD22−A114−A.
3. Tested to EIA / JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
4.0
5.5
V
VCC
Positive DC Supply Voltage
VIN
Control Pin Input Voltage
0
5.5
V
VI/O
Switch Input / Output Voltage
0
5.5
V
−55
+125
°C
0
0
5
DC
nS/V
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
Control Input
Switch I/O
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
7WBD383
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
VCC
(V)
Conditions
Min
Typ
4.5
Max
Min
Unit
−1.2
V
Clamp Diode Voltage
VIH
High−Level Input Voltage
(Control)
4.0 to
5.5
VIL
Low−Level Input Voltage
(Control)
4.0 to
5.5
0.8
0.8
V
VOH
Output Voltage High
See Figure 5
Input Leakage Current
0 v VIN v 5.5 V
5.5
±0.1
±1.0
mA
IOFF
Power Off Leakage Current
VI/O = 0 to 5.5 V
0
±0.1
±1.0
mA
ICC
Quiescent Supply Current
IO = 0,
VIN = VCC or 0 V
OE = GND
OE = VCC
5.5
±1.0
±0.1
±1.0
±1.0
mA
mA
2.5
mA
DICC
Increase in Supply Current
(Control Pin)
One input at 3.4 V;
Other inputs at VCC
or GND
5.5
RON
Switch ON Resistance
VI/O = 0,
II/O = 64 mA
II/O = 30 mA
4.5
−1.2
Max
VIK
IIN
II/O = −18 mA
TA =
−555C to +1255C
TA = 255C
2.0
VI/O = 2.4,
II/O = 15 mA
VI/O = 2.4,
II/O = 15 mA
4.0
2.0
V
3
3
7
7
7
7
15
50
50
50
70
70
W
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS
VCC
(V)
Min
Typ
Max
Max
Unit
0.25
0.25
ns
4.5
4.5
ns
0.8
4.2
ns
4.6
0.8
4.6
3.0
4.8
0.8
4.8
2.9
4.4
0.8
4.4
Symbol
Parameter
tPD
Propagation Delay, Bus to Bus
See Figure 6
4.0 to
5.5
tPD−EX
Propagation Delay, EX to Bus
See Figure 6 and
Figure 7
4.0 to
5.5
Output Enable Time
See Figure 6
4.5 to
5.5
0.8
2.5
4.2
4.0
0.8
3.0
4.5 to
5.5
0.8
4.0
0.8
tEN
tDIS
CIN
Test Condition
TA =
−555C to +1255C
TA = 25 5C
Output Disable Time
Min
ns
Control Input Capacitance
VIN = 5 or 0 V
5.0
2.5
pF
CIO(ON)
Switch On Capacitance
Switch ON
5.0
10
pF
CIO(OFF)
Switch Off Capacitance
Switch OFF
5.0
5
pF
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4
7WBD383
TYPICAL DC CHARACTERISTICS
VOH, HIGH LEVEL OUTPUT VOLTAGE (V)
3.75
IOH =
−0.1 mA
3.50
−6 mA
−12 mA
−24 mA
3.25
3.00
2.75
2.50
TA = +85°C
VIN = VCC
2.25
2.00
4.50
4.75
5.00
5.25
5.50
5.75
VCC, SUPPLY VOLTAGE (V)
VOH, HIGH LEVEL OUTPUT VOLTAGE (V)
3.75
3.50
IOH =
−0.1 mA
3.25
−6 mA
−12 mA
−24 mA
3.00
2.75
2.50
TA = +25°C
VIN = VCC
2.25
2.00
4.50
4.75
5.00
5.25
5.50
5.75
VCC, SUPPLY VOLTAGE (V)
VOH, HIGH LEVEL OUTPUT VOLTAGE (V)
3.75
3.50
IOH =
−0.1 mA
3.25
−6 mA
−12 mA
−24 mA
3.00
2.75
2.50
TA = −40°C
VIN = VCC
2.25
2.00
4.50
4.75
5.00
5.25
5.50
5.75
VCC, SUPPLY VOLTAGE (V)
Figure 5. Output Voltage High vs Supply Voltage
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5
7WBD383
AC LOADING AND WAVEFORMS
From Output
Under Test
500 W
7V
S1
Open
GND
CL = 50 pF*
500 W
Test
S1
tPD
Open
tPLZ/tPZL
7V
tPHZ/tPZH
Open
*CL includes probes and jig capacitance.
1.5 V
1.5 V
Output
Control
tPZL
Output
Waveform 1
S1 at 7 V
(Note 6)
3V
Input
0V
tPLH
tPHL
VOH
Output
1.5 V
1.5 V
1.5 V
Output
Waveform 2
S1 at Open
(Note 6)
VOL
Voltage Waveforms
Propagation Delay Times
3V
0V
tPLZ
tPZH
1.5 V
1.5 V
1.5 V
3.5 V
VOL + 0.3 V
VOL
tPHZ
VOH
VOH − 0.3 V
0V
Voltage Waveforms
Enable and Disable Times
6. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control
7. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, ZO = 50 W, tr v 2.5 ns, tf v 2.5 ns.
8. The outputs are measured one at a time, with one transition per measurement.
9. tPLZ and tPHZ are the same as tDIS.
10. tPZL and tPZH are the same as tEN.
11. tPHL and tPLH are the same as tPD.
Figure 6. tPD, tEN, tDIS Loading and Waveforms
tr 2.5 ns
tf 2.5 ns
3V
Exchange
(EX)
90%
1.5 V
10%
tPLH
GND
tPHL
Output
(A, B, C, D)
1.5 V
VOH
Output
(A, B, C, D)
VOL
1.5 V
tPHL
tPLH
Figure 7. tPD−EX Waveforms
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6
7WBD383
ORDERING INFORMATION
Package
Shipping†
7WBD383USG
US8
(Pb−Free)
3000 / Tape & Reel
7WBD383MUTAG
UDFN8
(Pb−Free)
3000 / Tape & Reel
7WBD383AMUTCG
UQFN8
(Pb−Free)
3000 / Tape & Reel
7WBD383DMR2G
Micro8
(Pb−Free)
4000 / Tape & Reel
UDFN8, 1.95 x 1.0, 0.5 mm Pitch
(Pb−Free)
3000 / Tape & Reel
Device
7WBD383DMUTCG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
7
7WBD383
PACKAGE DIMENSIONS
UDFN8 1.8 x 1.2, 0.4P
CASE 517AJ
ISSUE O
PIN ONE
REFERENCE
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
D
0.10 C
L1
E
DETAIL A
NOTE 5
TOP VIEW
(A3)
0.05 C
DIM
A
A1
A3
b
b2
D
E
e
L
L1
L2
A
0.05 C
SIDE VIEW
e/2
A1
e
(b2)
1
C
SEATING
PLANE
DETAIL A
8X
L
4
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
0.30 REF
1.80 BSC
1.20 BSC
0.40 BSC
0.45
0.55
0.00
0.03
0.40 REF
MOUNTING FOOTPRINT*
SOLDERMASK DEFINED
(L2)
8
5
BOTTOM VIEW
8X
8X b
0.10
M
C A B
0.05
M
C
0.66
7X
0.22
NOTE 3
1.50
1
0.32
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
8
7WBD383
PACKAGE DIMENSIONS
UDFN8 1.95x1.0, 0.5P
CASE 517CA
ISSUE A
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9
7WBD383
PACKAGE DIMENSIONS
UQFN8, 1.6x1.6, 0.5P
CASE 523AN
ISSUE O
A
B
D
ÉÉ
ÉÉ
PIN ONE
REFERENCE
2X
0.10 C
EXPOSED Cu
E
A1
ÇÇ
ÉÉ
ÉÉ
MOLD CMPD
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
DETAIL B
DIM
A
A1
A3
b
D
E
e
L
L1
L3
OPTIONAL
CONSTRUCTION
2X
0.10 C
TOP VIEW
L1
(A3)
DETAIL B
L3
A
0.05 C
b
0.05 C
SIDE VIEW
(0.10)
C
A1
SEATING
PLANE
(0.15)
DETAIL A
SOLDERING FOOTPRINT*
OPTIONAL
CONSTRUCTION
1.70
8X
8X
L3
L
0.50
PITCH
1
e
5
3
1
DETAIL A
MILLIMETERS
MIN
MAX
0.45
0.60
0.00
0.05
0.13 REF
0.15
0.25
1.60 BSC
1.60 BSC
0.50 BSC
0.35
0.45
−−−
0.15
0.25
0.35
0.35
7
8
8X
b
0.10 C A B
BOTTOM VIEW
1.70
0.05 C
7X
NOTE 3
0.25
8X
0.53
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
10
7WBD383
PACKAGE DIMENSIONS
US8
CASE 493
ISSUE D
X Y
A
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR. MOLD
FLASH. PROTRUSION AND GATE BURR SHALL
NOT EXCEED 0.14MM (0.0055”) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
AND PROTRUSION SHALL NOT EXCEED 0.14MM
(0.0055”) PER SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203MM (0.003−0.008”).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508MM (0.0002”).
J
5
DETAIL E
B
L
1
4
R
S
G
P
U
C
SEATING
PLANE
T
D
H
0.10 (0.004) T
K
0.10 (0.004)
M
N
R 0.10 TYP
T X Y
V
M
F
DETAIL E
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
RECOMMENDED
SOLDERING FOOTPRINT*
8X
0.30
8X
0.68
3.40
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
11
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0_
6_
0_
10 _
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.128
0_
6_
0_
10 _
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
7WBD383
PACKAGE DIMENSIONS
Micro8
CASE 846A
ISSUE K
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
www.onsemi.com
12
Europe, Middle East and Africa Technical Support:
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For additional information, please contact your local Sales Representative
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