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ADP3121
Dual Bootstrapped, 12 V
MOSFET Driver with Output
Disable
The ADP3121 is a dual, high voltage MOSFET driver optimized for
driving two N−channel MOSFETs, the two switches in a non−isolated
synchronous buck power converter. Each driver is capable of driving a
3000 pF load with a 20 ns propagation delay and a 15 ns transition
time.
One of the drivers can be bootstrapped and is designed to handle the
high voltage slew rate associated with floating high−side gate drivers.
The ADP3121 includes overlapping drive protection to prevent
shoot−through current in the external MOSFETs.
The OD pin shuts off both the high−side and the low−side
MOSFETs to prevent rapid output capacitor discharge during system
shutdown.
The ADP3121 is specified over the commercial temperature range
of 0°C to 85°C and is available in 8−lead SOIC_N and 8−lead LFCSP
packages.
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MARKING
DIAGRAMS
8
8
SO−8
D SUFFIX
CASE 751−07
1
P3121
ALYW G
G
1
P3121A = Device Code
AL
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
Features
•
•
•
•
•
•
•
•
All−In−One Synchronous Buck Driver
Bootstrapped High−Side Drive
One PWM Signal Generates Both Drives
Anticross Conduction Protection Circuitry
Overvoltage Protection
OD for Disabling the Driver Outputs
Meets CPU VR Requirement when Used with Flex−Modet
Controller
These are Pb−Free Devices
8
LFCSP8
MN SUFFIX
CASE 932AF
1
L7Q
#
Y
WW
= Device Code
= Pb−Free Package
= Year
= Work Week
PIN ASSIGNMENT
BST
Typical Applications
• Multiphase Desktop CPU Supplies
• Single Supply Synchronous Buck Converters
L7Q
#YWW
DRVH
IN
SWN
OD
PGND
VCC
DRVL
ORDERING INFORMATION
Device
Package
Shipping†
ADP3121JRZ−RL
SOIC_N
(Pb−Free)
2500/Tape & Reel
ADP3121JCPZ−RL LFCSP_VD 5000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
February, 2010 − Rev. 1
1
Publication Order Number:
ADP3121/D
ADP3121
12 V
4
VCC
ADP3121
D1
1
LATCH
R1
Q
R2
S
IN 2
BST
CBST2
CBST1
8
DRVH
DELAY
RBST
7
CMP
CONTROL
LOGIC
5
DELAY
OD 3
Q1
TO
INDUCTOR
SW
VCC
6
CMP
1V
RG
6
DRVL
Q2
PGND
Figure 1. Block Diagram
PIN DESCRIPTION
Pin No.
Pin Name
Description
1
BST
Upper MOSFET Floating Bootstrap Supply. A capacitor connected between the BST and SW pins holds
this bootstrapped voltage for the high−side MOSFET while it is switching.
2
IN
Logic Level PWM Input. This pin has primary control of the drive outputs. In normal operation, pulling this
pin low turns on the low−side driver; pulling it high turns on the high−side driver.
3
OD
4
VCC
Input Supply. This pin should be bypassed to PGND with an ~1 mF ceramic capacitor.
5
DRVL
Synchronous Rectifier Drive. Output drive for the lower (synchronous rectifier) MOSFET.
6
PGND
Power Ground. This pin should be closely connected to the source of the lower MOSFET.
7
SW
8
DRVH
Output Disable. When low, this pin disables normal operation, forcing DRVH and DRVL low.
Switch Node Connection. This pin is connected to the buck switching node, close to the upper MOSFET
source. It is the floating return for the upper MOSFET drive signal. It is also used to monitor the switched
voltage to prevent the lower MOSFET from turning on until the voltage is below ~1 V.
Buck Drive. Output drive for the upper (buck) MOSFET.
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2
ADP3121
MAXIMUM RATINGS
Rating
Value
qJA, SOIC_N
2−Layer Board
4−Layer Board
123
90
qJA, LFCSP_VD (Note 1)
4−Layer Board
64.3
Operating Ambient Temperature Range
Unit
°C/W
°C/W
0 to 85
°C
Junction Temperature Range
0 to 150
°C
Storage Temperature Range
−65 to +150
°C
Lead Temperature
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
300
215
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Internally limited by thermal shutdown, 150°C min. 2−layer board, 1 in2 Cu, 1 oz thickness. 60−180 seconds minimum above 237°C.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
ABSOLUTE MAXIMUM RATINGS (Note 2)
Pin Name
Pin Symbol
Vmax
Vmin
VCC
Main supply voltage input
15 V
−0.3 V
GND
Ground
0V
0V
BST
Bootstrap Supply Voltage Input
DC