ARRAYJ-BOB3-64P-GEVK

        ARRAYJ-BOB3-64P-GEVK: J-Array 3mm 8x8 BOB The ArrayJ-BOB3-64P is an evaluation board allowing easy access to the signals from either a SensL ArrayJ-300XX-64P (3 mm pixel 8 x 8 SiPM array) or a SensL ArrayJ-40035-64P (4mm pixel, 8 x 8 SiPM array). The Breakout Board has two Hirose 80-way connectors, type DF17(3.0)-80DS-0.5v(57). These connectors mate with the Hirose DF17(3.0)-80DP0.5v(57) board-to-board connector on the array. All signals on the array are routed via the mating connectors to header pins. These pins are formed by four 32-way (16 x 2 row) 2.54 mm pitch headers. Four additional header pin-pairs are provided for connection to the Common. Three SMA connectors and Balun transformers are provided with 4-pin headers to allow any signal to be connected directly to the SMA or via the transformer using jumper wires. Four 7 mm holes are placed on a 25 mm grid to allow mounting of the board on an optical breadboard. Evaluation/Development Tool Information Product Status ARRAYJ-BOB3-64P-GEVK Active Compliance Short Description J-Array 3mm 8x8 BOB Parts Used ARRAYJ-30020-64P-PCB , ARRAYJ-30035-64P-PCB , ARRAYJ-40035-64P-PCB             https://www.onsemi.com/PowerSolutions/evalBoard.do?id=ARRAYJ‐BOB3‐64P‐GEVK 11‐16‐18