ASM3P2111BG-08SR

ASM3P2111B Peak EMI Reducing Solution Features • Generates an EMI optimized clock at the output. • Input frequency: 25MHz. • Frequency outputs: o 60MHz (unmodulated) o 2 x 48MHz (unmodulated) o 66.6MHz (modulated): -1.7% down spread • Modulation rate: 30KHz. • Supply voltage range: 3.3V ± 0.3V. • Available in 8-pin SOIC Package. • RoHS Compliant number of circuit board layers and shielding that are required to pass EMI regulations. The ASM3P2111B modulates the output of PLL in order to spread the bandwidth of a synthesized clock, thereby decreasing the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most clock generators. Lowering EMI by increasing a signal’s bandwidth is called spread spectrum clock generation. Applications ASM3P2111B is targeted towards EMI management for high speed digital applications such as PC peripheral devices, consumer electronics and embedded controller systems. Product Description The ASM3P2111B is a versatile spread spectrum frequency modulator that reduces electromagnetic interference (EMI) at the clock source. The ASM3P2111B allows significant system cost savings by reducing the Block Diagram VDD XIN / CLKIN Crystal Oscillator XOUT PLL1 60MHz 48MHz_1 48MHz_2 48MHz_1 PLL2 66.6MHz Modulated VSS ©2010 SCILLC. All rights reserved. JANUARY 2010 – Rev. 1 Publication Order Number: ASM3P2111/D ASM3P2111B Pin Configuration XIN/ CLKIN XOUT VDD 60MHz 1 8 VSS 66.6MHz 48MHz_1 48MHz_2 2 7 ASM3P2111B 3 4 6 5 Pin Description Pin # 1 2 3 4 5 6 7 8 Pin Name XIN / CLKIN XOUT VDD 60MHz 48MHz_2 48MHz_1 66.6MHz VSS Type I O P O O O O P Connection to crystal Connection to crystal Description Power supply for the analog and digital blocks (+3.3V) Clock output-1 60MHz un-modulated Clock output-2 48MHz_2 un-modulated Clock output-3 48MHz_1 un-modulated Clock output-4 66.6MHz modulated Ground to entire chip. Connect to System Ground Rev. 1 | Page 2 of 7 | www.onsemi.com ASM3P2111B Absolute Maximum Ratings Symbol VDD, VIN TSTG Ts TJ TDV Storage temperature Max. Soldering Temperature (10 sec) Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B) Parameter Rating -0.5 to +4.6 -65 to +125 260 150 2 Unit V ° C ° C ° C KV Voltage on any pin with respect to Ground Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Operating Conditions Symbol VDD FXIN TA CL Supply Voltage Crystal Resonator Frequency Operating Temperature Output Driver Load Capacitance -40 Parameter Min 3 Typ 3.3 25 Max 3.6 +85 15 Unit V MHz ° C pF Rev. 1 | Page 3 of 7 | www.onsemi.com ASM3P2111B DC Electrical Characteristics Parameter Overall Supply Current, Dynamic Supply Current, Static All input pins High-Level Input Voltage Low-Level Input Voltage High-Level Input Current Low-Level Input Current (pull-up) High-Level Output Source Current Low-Level Output Sink Current Clock Outputs High-Level Output Source Current Low-Level Output Sink Current Output Impedance IOH IOL ZOH ZOL VO = 2.5V VO = 0.4V VO = 0.5 VDD; output driving high VO = 0.5 VDD; output driving low -20 23 29 27 mA mA VIH VIL IIH IIL IxOH IxOL VDD = V (XIN) = 3.3V, VO= 0.4V VDD = 3.3V, V (XIN) = VO = 2.5V VDD = 3.3V VDD =3.3V 2.0 VSS-0.3 -1 -20 -36 3 3 VDD+0.3 0.8 1 -80 V V µA µA mA mA IDD IDDL VDD = 3.3V, FCLK = 25MHz, CL = 15pF VDD = 3.3V, Clock Input = 0 41 20 48 25 62 35 mA mA Symbol Conditions / Description Min Typ Max Unit Ω AC Electrical Characteristics Parameter Rise Time Fall Time Clock Duty Cycle Symbol tr tf Conditions / Description VO = 0.8V to 2.0V; CL = 15pF VO = 2.0V to 0.8V; CL = 15pF Ratio of pulse width (as measured from rising edge to next falling edge at VDD /2) to one clock period Min 300 360 Typ 800 800 Max 900 900 Unit pS pS 45 55 % Note: 1. CL = 15pF, Input clock frequency = 25MHz. Rev. 1 | Page 4 of 7 | www.onsemi.com ASM3P2111B Typical Crystal Specifications Fundamental AT cut parallel resonant crystal Nominal frequency Frequency tolerance Operating temperature range Storage temperature Load capacitance(CP) Shunt capacitance ESR 25MHz ± 50 ppm or better at 25° C -25° to +85° C C -40° to +85° C C 18pF 7pF maximum 25 Ω Note: Note: CL is Load Capacitance and Rx is used to prevent oscillations at overtone frequency of the Fundamental frequency. Typical Crystal Interface Circuit R Crystal Rx CL CL CL = 2*(CP – CS), Where CP = Load capacitance of crystal CS = Stray capacitance due to CIN, PCB, Trace etc. Rev. 1 | Page 5 of 7 | www.onsemi.com ASM3P2111B Package Information 8-lead (150-mil) SOIC Package E H D A2 A θ e A 1 B C L D Dimensions Inches Min A1 A A2 B C D E e H L θ 0.004 0.053 0.049 0.012 0.007 Symbol Max 0.010 0.069 0.059 0.020 0.010 Millimeters Min Max 0.10 1.35 1.25 0.31 0.18 4.90 BSC 3.91 BSC 1.27 BSC 6.00 BSC 0.41 0° 1.27 8° 0.25 1.75 1.50 0.51 0.25 0.193 BSC 0.154 BSC 0.050 BSC 0.236 BSC 0.016 0° 0.050 8° Rev. 1 | Page 6 of 7 | www.onsemi.com ASM3P2111B Ordering Codes Part number ASM3P2111BG-08SR Marking AEI Package Configuration 8-pin SOIC TAPE & REEL, Green Temperature Range 0° to +70° C C A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb-free Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Note: This product utilizes US Patent #6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003. are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes ON Semiconductor and without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. 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