DATA SHEET
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PNP Epitaxial Silicon
Transistor
TO−92−3
CASE 135AN
BC556, BC557, BC558,
BC559, BC560
12
Straight Lead
Bulk Packing
3
Features
•
•
•
•
•
Switching and Amplifier
High−Voltage: BC556, VCEO = −65 V
Low−Noise: BC559, BC560
Complement to BC546, BC547, BC548, BC549, and BC550
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
TO−92−3
CASE 135AR
1
2
Bent Lead
Tape & Reel
Fan−Fold
3
1. Collector
2. Base
3. Emitter
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Parameter
Symbol
Collector - Base Voltage
Value
Unit
VCBO
BC556
BC557 / BC560
BC558 / BC559
−80
−50
−30
Collector - Emitter Voltage
VCEO
BC556
BC557 / BC560
BC558 / BC559
MARKING DIAGRAM
V
V
ABC
5xxx
YWW
−65
−45
−30
Emitter - Base Voltage
VEBO
−5
V
Collector Current (DC)
IC
−100
mA
Peak Collector Current (Pulse)
ICP
−200
mA
Peak Base Current (Pulse)
IBP
−200
mA
Junction Temperature
TJ
150
°C
TSTG
−65 to +150
°C
Storage Temperature Range
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
A
= Assembly Location
BC5xxx = Specific Device Code
xxx
= 56A, 56B, 57A, 57B,
58B, 59B, 59C, 60C
Y
= Year
WW
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
THERMAL CHARACTERISTICS (Note 1)
(TA = 25°C unless otherwise noted)
Parameter
Total Device Dissipation
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Symbol
Max.
Unit
PD
500
4.0
mW
mW/°C
RqJA
250
°C/W
1. PCB size: FR−4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch)
with minimum land pattern size.
© Semiconductor Components Industries, LLC, 2002
December, 2021 − Rev. 2
1
Publication Order Number:
BC556BTA/D
BC556, BC557, BC558, BC559, BC560
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
−15
nA
ICBO
Collector Cut−Off Current
VCB = −30 V, IE = 0
hFE
DC Current Gain
VCE = −5 V, IC = −2 mA
Collector−Emitter Saturation Voltage
IC = −10 mA, IB = −0.5 mA
−90
−300
IC = −100 mA, IB = −5 mA
−250
−650
IC = −10 mA, IB = −0.5 mA
−700
IC = −100 mA, IB = −5 mA
−900
VCE(sat)
VBE(sat)
VBE(on)
Collector−Base Saturation Voltage
Base−Emitter On Voltage
110
VCE = −5 V, IC = −2 mA
−600
800
−660
VCE = −5 V, IC = −10 mA
fT
mV
mV
−750
mV
−800
Current Gain Bandwidth Product
VCE = −5 V, IC = −10 mA, f = 10 MHz
Cob
Output Capacitance
VCB = −10 V, IE = 0, f = 1 MHz
6
pF
NF
Noise Figure
VCE = −5 V, IC = −200 mA, f = 1 kHz,
RG = 2 kW
2
10
dB
1
4
VCE = −5 V, IC = −200 mA, RG = 2 kW,
f = 30 to 15000 MHz
1.2
4.0
1.2
2.0
BC556 / BC557 / BC558
BC559 / BC560
BC559
BC560
150
MHz
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
hFE CLASSIFICATION
Classification
A
B
C
hFE2
110 ~ 220
200 ~ 450
420 ~ 800
ORDERING INFORMATION
Marking
Package
Shipping†
BC556ABU
BC556A
TO−92−3, case 135AN (Pb−Free)
10,000 Units/ Bulk Box
BC556ATA
BC556A
TO−92−3, case 135AR (Pb−Free)
2,000 Units/ Fan−Fold
BC556BTA
BC556B
TO−92−3, case 135AR (Pb−Free)
2,000 Units/ Fan−Fold
BC556BTF
BC556B
TO−92−3, case 135AR (Pb−Free)
2,000 Units/ Tape & Reel
BC556BTFR
BC556B
TO−92−3, case 135AR (Pb−Free)
2,000 Units/ Tape & Reel
BC557ATA
BC557A
TO−92−3, case 135AR (Pb−Free)
2,000 Units/ Fan−Fold
BC557BTA
BC557B
TO−92−3, case 135AR (Pb−Free)
2,000 Units/ Fan−Fold
BC557BTF
BC557B
TO−92−3, case 135AR (Pb−Free)
2,000 Units/ Tape & Reel
BC558BTA
BC558B
TO−92−3, case 135AR (Pb−Free)
2,000 Units/ Fan−Fold
BC559BTA
BC559B
TO−92−3, case 135AR (Pb−Free)
2,000 Units/ Fan−Fold
BC559CTA
BC559C
TO−92−3, case 135AR (Pb−Free)
2,000 Units/ Fan−Fold
BC560CTA
BC560C
TO−92−3, case 135AR (Pb−Free)
2,000 Units/ Fan−Fold
Part Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
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2
BC556, BC557, BC558, BC559, BC560
TYPICAL PERFORMANCE CHARACTERISTICS
1000
IB = −400 mA
−45
−40
IB = −300 mA
−35
IB = −250 mA
−30
IB = −200 mA
−25
−20
IB = −150 mA
−15
IB = −100 mA
−10
TA = 150 C
o
TA = 25 C
o
TA = −55 C
100
IB = −50 mA
−5
−0
−2
−4
−6
−8
10
−10 −12 −14 −16 −18 −20
−1
VCE, COLLECTOR−EMITTER VOLTAGE [V]
−10
−100
−1000
IC, COLLECTOR CURRENT [mA]
Figure 1. Static Characteristic
VCE(sat), COLLECTOR−EMITTER SATURATION
VOLTAGE [V]
VCE = −5 V
o
IB = −350 mA
hFE, DC CURRENT GAIN
IC, COLLECTOR CURRENT [mA]
−50
Figure 2. DC Current Gain
−1000
−10
IC, COLLECTOR CURRENT [mA]
IC = 20 I B
−1
o
o
TA = 150 C
TA = 25 C
−0.1
o
TA = −55 C
IC = 20 I B
−100
−10
−100
−1000
IC, COLLECTOR CURRENT [mA]
o
o
−0.2
o
TA = 25 C
TA = 150 C
−1
−0.0
−0.01
−1
−10
−0.4
−0.6
TA = −55 C
−0.8
−1.0
−1.2
VBE(sat), BASE−EMITTER SATURATION VOLTAGE [V]
Figure 4. Base−Emitter Saturation Voltage
Figure 3. Collector−Emitter Saturation Voltage
VCE = −5 V
Cob, CAPACITANCE [pF]
IC, COLLECTOR CURRENT [mA]
−1000
−100
−10
o
TA = 150 C
0
−0.2
−0.4
o
TA = 25 C
−0.6
f=1MHz
IE = 0
10
o
TA = −55 C
−0.8
−1.0
1
−1
−1.2
−10
−100
VBE(on), BASE−EMITTER ON VOLTAGE [V]
VCB, COLLECTOR−BASE VOLTAGE [V]
Figure 5. Base−Emitter On Voltage
Figure 6. Collector Output Capacitance
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3
BC556, BC557, BC558, BC559, BC560
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
1000
V CE = −5 V
PD, POWER DISSIPATION [mW]
fT, CURRENT GAIN BANDWIDTH
PRODUCT [MHz]
1000
100
100
10
1
10
−1
−10
0
IC, COLLECTOR CURRENT [mA]
r(t), NORMALIZED TRANSIENT THERMAL
RESISTANCE
Figure 8. Power Deration
1000
50%
30%
10%
10
Rthja(t)=r(t)*Rthja
o
Rthja=250 C/W
5%
2%
1
0.1
D=1%
Single Pulse
0.01
1E−5 1E−4 1E−3
0.01
0.1
1
10
100
100
TA, AMBIENT TEMPERATURE [°C]
Figure 7. Current Gain Bandwidth Product
100
50
1000
t1, TIME [s]
Figure 9. Normalized Transient Thermal
Resistance
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4
150
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−92 3 4.825x4.76
CASE 135AN
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13880G
TO−92 3 4.825X4.76
DATE 31 JUL 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−92 3 4.83x4.76 LEADFORMED
CASE 135AR
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13879G
DATE 30 SEP 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
TO−92 3 4.83X4.76 LEADFORMED
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
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