BPW38
HERMETIC SILICON PHOTODARLINGTON
PACKAGE DIMENSIONS
FEATURES
• Hermetically sealed package
• Narrow reception angle
• European “Pro Electron” registered
0.209 (5.31)
0.184 (4.67)
DESCRIPTION
0.030 (0.76)
NOM
0.255 (6.48)
• The BPW38 is a silicon photodarlington
mounted in narrow angle TO-18 package.
0.50 (12.7)
MIN
SCHEMATIC
C
0.020 (0.51) 3X
Base
B
0.100 (2.54)
0.050 (1.27)
Emitter
Collector
(Case)
E
0.040 (1.02)
Ø0.100 (2.54)
0.040 (1.02)
45°
NOTES:
1. Dimensions for all drawings are in inches (mm).
2. Tolerance of ± .010 (.25) on all non-nominal dimensions
unless otherwise specified.
ABSOLUTE MAXIMUM RATINGS
1. Derate power dissipation linearly 3.00 mW/°C above 25°C ambient.
2. Derate power dissipation linearly 6.00 mW/°C above 25°C case.
3. RMA flux is recommended.
4. Methanol or isopropyl alcohols are recommended as cleaning
agents.
5. Soldering iron tip 1/16” (1.6mm) minimum from housing.
6. As long as leads are not under any stress or spring tension.
7. Light source is a GaAs LED emitting light at a peak wavelength of
940 nm.
(TA = 25°C unless otherwise specified)
Parameter
Operating Temperature
Storage Temperature
Soldering Temperature (Iron)(3,4,5 and 6)
Soldering Temperature (Flow)(3,4 and 6)
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Power Dissipation (TA = 25°C)(1)
Power Dissipation (TC = 25°C)(2)
Symbol
TOPR
TSTG
TSOL-I
TSOL-F
VCEO
VCBO
VEBO
PD
PD
2001 Fairchild Semiconductor Corporation
DS300280
3/15/01
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Rating
-65 to +125
-65 to +150
240 for 5 sec
260 for 10 sec
25
25
12
300
600
Unit
°C
°C
°C
°C
V
V
V
mW
mW
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BPW38
HERMETIC SILICON PHOTODARLINGTON
ELECTRICAL / OPTICAL CHARACTERISTICS
(TA =25°C) (All measurements made under pulse conditions)
PARAMETER
TEST CONDITIONS
SYMBOL
MIN
TYP
MAX
UNITS
Collector-Emitter Breakdown
IC = 10 mA, Ee = 0
BVCEO
25
—
—
V
Emitter-Base Breakdown
IE = 100 µA, Ee = 0
BVEBO
12
—
—
V
Collector-Base Breakdown
IC = 100 µA, Ee = 0
BVCBO
25
—
—
V
Collector-Emitter Leakage
VCE = 12 V, Ee = 0
ICEO
—
—
100
nA
0
—
±8
—
Deg.
IC(ON)
7.5
—
—
mA
tr
—
300
—
µs
tf
—
250
—
µs
Reception Angle at 1/2 Sensitivity
Ee = 0.125 mW/cm2
On-State Collector Current
VCE = 5 V(7)
IC = 10 mA, VCC = 10 V
Rise Time
RL = 100 1
IC = 10 mA, VCC = 10 V
Fall Time
RL = 100 1
TYPICAL PERFORMANCE CURVES
IL/IL @25˚C - RELATIVE LIGHT CURRENT
IL - NORMALIZED LIGHT CURRENT
100
Ee = 5.0 mW/cm2
Ee = 2.0 mW/cm2
Ee = 1.0 mW/cm2
10
Ee = 0.5 mW/cm2
Ee = 0.2 mW/cm2
1.0
Ee = 0.1 mW/cm2
Ee = 0.05 mW/cm2
Normalized to:
VCE = 5 V
Ee = .2 mW/cm2
0.1
0
5
10
15
20
25
30
35
1.0
0.1
Normalized to:
VCE = 5 V
Ee = 0.2 mW/cm2
0.01
-50
VCE - COLLECTOR TO EMITTER (V)
-25
0
25
50
75
100
125
TA - TEMPERATURE (˚C)
Fig. 1 Light Current vs. Collector to Emitter Voltage
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10
Fig. 2 Relative Light Current vs. Ambient Temperature
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DS300280
BPW38
HERMETIC SILICON PHOTODARLINGTON
1.0
110
0.9
100
0.8
90
RELATIVE AMPLITUDE
RELATIVE SPECTRAL RESPONSE
TYPICAL PERFORMANCE CURVES
0.7
0.6
0.5
0.4
0.3
0.2
80
70
60
50
40
30
20
0.1
10
0
0
400
500
600
700
800
900
1000
1100
1200
-90˚
-70˚
-30˚
-10˚
10˚
30˚
50˚
D- WAVELENGTH - NANOMETERS
DEGREES
Fig. 3 Spectral Response Curve
Fig. 4 Angular Response
100
BPW38
Load Resistance
101
IL - LIGHT CURRENT (mA)
-50˚
1001
10
V CC
70˚
1.0 V
90 %
INPUT
LED
Normalized to:
RL = 1001
IL = 10 mA
90˚
OUTPUT
PULSE
10 %
I
RL
OUTPUT
tf
td
10001
1.0
tr
VCC = 10 V
INPUT PULSE
0.1
t ON = td + tr
0.01
0.1
ts
1.0
10
t OFF = ts + tf
100
RELATIVE SWITCHING SPEED
Fig. 5 Light Current vs. Relative Switching Speed
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3/15/01
Fig. 6 Test Circuit and Voltage Waveforms
3 OF 4
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BPW38
HERMETIC SILICON PHOTODARLINGTON
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF
OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical
implant into the body,or (b) support or sustain life,
and (c) whose failure to perform when properly
used in accordance with instructions for use provided
in labeling, can be reasonably expected to result in a
significant injury of the user.
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2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
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3/15/01
DS300280
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