BTA30H-600CW3G, BTA30H-800CW3G Triacs
Silicon Bidirectional Thyristors
Designed for high performance full-wave ac control applications where high noise immunity and high commutating di/dt are required.
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Blocking Voltage to 800 V On-State Current Rating of 30 Amperes RMS at 95°C Uniform Gate Trigger Currents in Three Quadrants High Immunity to dV/dt − 500 V/ms minimum at 150°C Minimizes Snubber Networks for Protection Industry Standard TO-220AB Package − Internally Isolated High Commutating dI/dt − 4.0 A/ms minimum at 150°C Internally Isolated (2500 VRMS) These are Pb−Free Devices
Rating Symbol VDRM, VRRM 600 800 IT(RMS) ITSM 30 400 A A Value Unit V 1 2 3
TRIACS 30 AMPERES RMS 600 thru 800 VOLTS
MT2 G 4 MT1
MARKING DIAGRAM
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Peak Repetitive Off−State Voltage (Note 1) (TJ = −40 to 150°C, Sine Wave, 50 to 60 Hz, Gate Open) BTA30H−600CW3G BTA30H−800CW3G On-State RMS Current (Full Cycle Sine Wave, 60 Hz, TC = 95°C) Peak Non-Repetitive Surge Current (One Full Cycle Sine Wave, 60 Hz, TC = 25°C) Circuit Fusing Consideration (t = 8.3 ms) Non−Repetitive Surge Peak Off−State Voltage (TJ = 25°C, t = 8.3 ms) Peak Gate Current (TJ = 150°C, t ≤ 20 ms) Average Gate Power (TJ = 150°C) Operating Junction Temperature Range Storage Temperature Range RMS Isolation Voltage (t = 300 ms, R.H. ≤ 30%, TA = 25°C) HT BTA30−xCWG AYWW
TO−220AB CASE 221A STYLE 12 = 6 or 8 = Assembly Location = Year = Work Week = Pb−Free Package
x A Y WW G
I2t VDSM/ VRSM IGM PG(AV) TJ Tstg Viso
667 VDRM/VRRM +100 4.0 0.5 − 40 to +150 − 40 to +150 2500
A2sec V A W °C °C V 1 2 3 4
PIN ASSIGNMENT
Main Terminal 1 Main Terminal 2 Gate No Connection
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. VDRM and VRRM for all types can be applied on a continuous basis. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
ORDERING INFORMATION
Device BTA30H−600CW3G BTA30H−800CW3G Package TO−220AB (Pb−Free) TO−220AB (Pb−Free) Shipping 50 Units / Rail 50 Units / Rail
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2009
April, 2009 − Rev. 0
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Publication Order Number: BTA30H−600CW3/D
BTA30H−600CW3G, BTA30H−800CW3G
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction−to−Case (AC) Junction−to−Ambient Symbol RqJC RqJA TL Value 1.8 60 260 Unit °C/W °C
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 seconds
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted; Electricals apply in both directions)
Characteristic OFF CHARACTERISTICS Peak Repetitive Blocking Current (VD = Rated VDRM, VRRM; Gate Open) ON CHARACTERISTICS Peak On-State Voltage (Notes 2 and 3) (ITM = ± 42 A Peak) Threshold Voltage, TJ = 150°C (Note 2) Dynamic Resistance, TJ = 150°C (Note 2) Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 30 W) MT2(+), G(+) MT2(+), G(−) MT2(−), G(−) Holding Current (VD = 12 V, Gate Open, Initiating Current = ±100 mA) Latching Current (VD = 12 V, IG = 42 mA) MT2(+), G(+) MT2(+), G(−) MT2(−), G(−) Gate Trigger Voltage (VD = 12 V, RL = 30 W) MT2(+), G(+) MT2(+), G(−) MT2(−), G(−) Gate Non−Trigger Voltage (TJ = 150°C) MT2(+), G(+) MT2(+), G(−) MT2(−), G(−) DYNAMIC CHARACTERISTICS Rate of Change of Commutating Current, See Figure 10. (Gate Open, TJ = 150°C, No Snubber) (Note 4) Critical Rate of Rise of On−State Current (TJ = 150°C, f = 120 Hz, IG = 2 x IGT, tr ≤ 100 ns) Critical Rate of Rise of Off-State Voltage (VD = 0.66 x VDRM, Exponential Waveform, Gate Open, TJ = 150°C) 2. Indicates Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%. 3. For both polarities. 4. dv/dt(c) = 35 V/ms (exponential to 200 Vpk) (dI/dt)c dI/dt dV/dt 4.0 − 500 − − − − 50 − A/ms A/ms V/ms VTM Vto Rd IGT − − − 8.0 8.0 8.0 − − − − − − − − 1.55 0.85 16 35 35 35 50 mA mA − − − − − − 0.15 0.15 0.15 − − − − − − − − − 75 75 75 V 1.3 1.3 1.3 V − − − V V mW mA TJ = 25°C TJ = 150°C IDRM, IRRM mA − − − − 0.005 15 Symbol Min Typ Max Unit
IH IL
VGT
VGD
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BTA30H−600CW3G, BTA30H−800CW3G
Voltage Current Characteristic of Triacs (Bidirectional Device)
+ Current Quadrant 1 MainTerminal 2 +
Symbol
VDRM IDRM VRRM IRRM VTM IH
Parameter
Peak Repetitive Forward Off State Voltage Peak Forward Blocking Current Peak Repetitive Reverse Off State Voltage Peak Reverse Blocking Current Maximum On State Voltage Holding Current Quadrant 3 MainTerminal 2 − IH VTM IRRM at VRRM on state IH
VTM
off state
+ Voltage IDRM at VDRM
Quadrant Definitions for a Triac
MT2 POSITIVE (Positive Half Cycle) + (+) MT2 (+) MT2
Quadrant II
(−) IGT GATE MT1 REF
(+) IGT GATE MT1 REF
Quadrant I
IGT − (−) MT2 (−) MT2
+ IGT
Quadrant III
(−) IGT GATE MT1 REF
(+) IGT GATE MT1 REF − MT2 NEGATIVE (Negative Half Cycle)
Quadrant IV
All polarities are referenced to MT1. With in−phase signals (using standard AC lines) quadrants I and III are used.
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BTA30H−600CW3G, BTA30H−800CW3G
150 145 140 135 130 125 120 115 110 105 100 95 90 85 80 40 PAV, AVERAGE POWER (W) 35 30 25 20 15 10 5 0 0 5 10 15 20 25 30
TC, CASE TEMPERATURE (°C)
0
5
10
15
20
25
30
IT(RMS), RMS ON-STATE CURRENT (A)
IT(RMS), ON-STATE CURRENT (A)
Figure 1. RMS Current Derating
1000
Figure 2. On-State Power Dissipation
35 100 IT, INSTANTANEOUS ON−STATE CURRENT (A) IH, HOLDING CURRENT (mA) 30 25 20 15 10 5 0 −40 −20 0 20 40 60 80 100 120 140 160 MT2 NEGATIVE MT2 POSITIVE
10 TJ = 125°C
TJ, JUNCTION TEMPERATURE (°C) TJ = 25°C 1
Figure 4. Hold Current Variation
0.1 0.0
0.5
1.0
1.5
2.0
2.5
3.0
VT, INSTANTANEOUS ON-STATE VOLTAGE (V)
Figure 3. On-State Characteristics
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BTA30H−600CW3G, BTA30H−800CW3G
25 IGT, GATE TRIGGER CURRENT (mA) 20 15 Q2 10 5 0 −40 −20 VD = 12 V RI = 30 W Q3 Q1 1.30 VGT, GATE TRIGGER VOLTAGE (V) 1.10 0.90 0.70 0.50 0.30 0.10 −40 −20 Q3 Q1 VD = 12 V RI = 30 W
Q2
0
20
40
60
80
100 120 140 160
0
20
40
60
80
100 120 140 160
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 5. Gate Trigger Current Variation
75 65 55 45 35 25 15 −40 −20 Q2
Figure 6. Gate Trigger Voltage Variation
VD = 12 V RI = 30 W
Q1 Q3
0
20
40
60
80
100 120 140 160
TJ, JUNCTION TEMPERATURE (°C)
Figure 7. Critical Rate of Rise of Commutating Voltage
LL 200 VRMS ADJUST FOR ITM, 60 Hz VAC TRIGGER CHARGE CONTROL TRIGGER CONTROL MEASURE I
1N4007
+ MT2 1N914 51 W G MT1
CHARGE
200 V
NON‐POLAR CL
Note: Component values are for verification of rated (di/dt)c. See AN1048 for additional information.
Figure 8. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Current (di/dt)c
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BTA30H−600CW3G, BTA30H−800CW3G
PACKAGE DIMENSIONS
TO−220 CASE 221A−07 ISSUE AA
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM A B C D F G H J K L N Q R S T U V Z INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.014 0.022 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 ----0.080 MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.36 0.55 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 ----2.04
−T− B F T C
SEATING PLANE
S
Q H Z L V G
4
A U K
123
R J D N
STYLE 12: PIN 1. 2. 3. 4.
MAIN TERMINAL 1 MAIN TERMINAL 2 GATE NOT CONNECTED
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BTA30H−600CW3/D