BYW29-200

BYW29−200 SWITCHMODEt Power Rectifiers This state−of−the−art device is designed for use in switching power supplies, inverters and as free wheeling diodes. Features http://onsemi.com • • • • • • • 175°C Operating Junction Temperature Popular TO−220 Package Epoxy Meets UL 94 V−0 @ 0.125 in Low Forward Voltage Low Leakage Current High Temperature Glass Passivated Junction Pb−Free Package is Available* ULTRAFAST RECTIFIERS 8.0 AMPERES 200 VOLTS 1 4 3 Mechanical Characteristics • Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 • Weight: 1.9 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • • Leads are Readily Solderable Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Ratings: Machine Model, C (> 400 V) Human Body Model, 3B (> 8000 V) Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current Total Device, (Rated VR), TC = 150°C Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz), TC = 150°C Nonrepetitive Peak Surge Current (Surge Applied at Rated Load Conditions Half−wave, Single Phase, 60 Hz) Operating Junction Temperature and Storage Temperature Range Symbol VRRM VRWM VR IF(AV) Value 200 Unit V 1 3 8.0 A 4 MARKING DIAGRAM MAXIMUM RATINGS CASE 221B TO−220B PLASTIC AY WWG BYW29−200 KA IFM 16 A A Y WW BYW80−200 G KA = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity IFSM 100 A TJ, Tstg −65 to +175 °C THERMAL CHARACTERISTICS Maximum Thermal Resistance, Junction−to−Case RqJC 3.0 °C/W ORDERING INFORMATION Device BYW29−200 BYW29−200G Package TO−220 TO−220 (Pb−Free) Shipping 50 Units/Rail 50 Units/Rail Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005 1 August, 2005 − Rev. 1 Publication Order Number: BYW29/D BYW29−200 ELECTRICAL CHARACTERISTICS Rating Maximum Instantaneous Forward Voltage (Note 1) (iF = 5.0 A, TC = 100°C) (iF = 20 A, TC = 25°C) Maximum Instantaneous Reverse Current (Note 1) (Rated Dc Voltage, TJ = 100°C) (Rated Dc Voltage, TJ = 25°C) Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/ms) (IF = 0.5 A, iR = 1.0 A, IREC = 0.25 A) 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. Symbol vF 0.85 1.3 iR 600 5.0 trr 35 25 ns mA Value Unit V 100 IR, REVERSE CURRENT (m A) 70 50 1000 TJ = 175°C 100 10 30 i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 20 100°C 25°C 1.0 0.1 0.01 0 20 40 80 100 120 140 60 VR, REVERSE VOLTAGE (V) 160 180 200 10 7.0 5.0 Figure 2. Typical Reverse Current* 3.0 2.0 TJ = 175°C 1.0 0.7 0.5 100°C 25°C IF(AV) , AVERAGE FORWARD CURRENT (AMPS) 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 140 150 160 170 180 TC, CASE TEMPERATURE (°C) SQUARE WAVE dc RATED VR APPLIED * The curves shown are typical for the highest voltage device in the grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if VR is sufficiently below rated VR. 0.3 0.2 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 vF, INSTANTANEOUS VOLTAGE (V) Figure 1. Typical Forward Voltage Figure 3. Current Derating, Case http://onsemi.com 2 BYW29−200 PF(AV), AVERAGE POWER DISSIPATION (WATTS IF(AV) , AVERAGE FORWARD CURRENT (AMPS) 14 12 dc 10 8.0 6.0 4.0 2.0 0 0 20 40 60 80 100 120 140 160 180 200 TA, AMBIENT TEMPERATURE (°C) dc SQUARE WAVE SQUARE WAVE RqJA = 16°C/W RqJA = 60°C/W (NO HEAT SINK) 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 IF(AV), AVERAGE FORWARD CURRENT (AMPS) SQUARE WAVE dc TJ = 175°C Figure 4. Current Derating, Ambient Figure 5. Power Dissipation r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1.0 D = 0.5 0.5 0.1 0.05 0.01 ZqJC(t) = r(t) RqJC RqJC = 1.5 °C/W MAX 0.2 0.1 0.05 P(pk) t1 t2 DUTY CYCLE, D = t1/t2 SINGLE PULSE 0.02 0.01 0.01 D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT T1 TJ(pk) − TC = P(pk) ZqJC(t) 0.02 0.05 0.1 0.2 0.5 1.0 2.0 t, TIME (ms) 5.0 10 20 50 100 200 500 1000 Figure 6. Thermal Response 1000 C, CAPACITANCE (pF) 300 TJ = 25°C 100 30 10 1.0 10 VR, REVERSE VOLTAGE (V) 100 Figure 7. Typical Capacitance http://onsemi.com 3 BYW29−200 PACKAGE DIMENSIONS TO−220 CASE 221B−04 ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L Q R S T U INCHES MIN MAX 0.595 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.190 0.210 0.110 0.130 0.018 0.025 0.500 0.562 0.045 0.060 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 MILLIMETERS MIN MAX 15.11 15.75 9.65 10.29 4.06 4.82 0.64 0.89 3.61 3.73 4.83 5.33 2.79 3.30 0.46 0.64 12.70 14.27 1.14 1.52 2.54 3.04 2.04 2.79 1.14 1.39 5.97 6.48 0.000 1.27 C Q B F T S 4 A 1 3 U H K L G D J R ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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