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CAT24AA16WI-GT3

CAT24AA16WI-GT3

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOIC8

  • 描述:

    IC EEPROM 16KBIT I2C 1MHZ 8SOIC

  • 数据手册
  • 价格&库存
CAT24AA16WI-GT3 数据手册
DATA SHEET www.onsemi.com EEPROM Serial 16-Kb I2C CAT24AA16 TSOT−23 TB SUFFIX CASE 419AE Description The CAT24AA16 is a EEPROM Serial 16−Kb I2C device internally organized as 2048x8 bits. The device features a 16−byte page write buffer and supports 100 kHz, 400 kHz and 1 MHz I2C protocols. Data is written by providing a starting address, then loading 1 to 16 contiguous bytes into a Page Write Buffer, and then writing all data to non−volatile memory in one internal write cycle. Data is read by providing a starting address and then shifting out data serially while automatically incrementing the internal address count. Features • • • • • • • • • • • Standard and Fast I2C Protocol Compatible Supports 1 MHz Clock Frequency 1.7 V to 5.5 V Supply Voltage Range 16−Byte Page Write Buffer Hardware Write Protection for Entire Memory Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs (SCL and SDA) Low Power CMOS Technology 1,000,000 Program/Erase Cycles 100 Year Data Retention Industrial Temperature Range This Device is Pb−Free, Halogen Free/BFR Free and are RoHS Compliant PIN CONFIGURATIONS TSOT−23 SCL 1 VSS 2 SDA 3 5 WP 4 VCC (Top View) PIN FUNCTION Pin Name Function SDA Serial Data Input/Output SCL Clock Input WP Write Protect VCC Power Supply VSS Ground NC No Connect ORDERING INFORMATION VCC See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. SCL CAT24AA16 SDA WP VSS Figure 1. Functional Symbol © Semiconductor Components Industries, LLC, 2009 September, 2021 − Rev. 3 1 Publication Order Number: CAT24AA16/D CAT24AA16 Table 1. ABSOLUTE MAXIMUM RATINGS Ratings Units Storage Temperature Parameters −65 to +150 °C Voltage on any Pin with Respect to Ground (Note 1) −0.5 to +6.5 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The DC input voltage on any pin should not be lower than −0.5 V or higher than VCC + 0.5 V. During transitions, the voltage on any pin may undershoot to no less than −1.5 V or overshoot to no more than VCC + 1.5 V, for periods of less than 20 ns. Table 2. REABILITY CHARACTERISTICS (Note 2) Symbol NEND (Note 3) TDR Parameter Endurance Min Units 1,000,000 Program/Erase Cycles 100 Years Data Retention 2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100 and JEDEC test methods. 3. Page Mode @ 25°C Table 3. DC OPERATING CHARACTERISTICS (VCC = 1.7 V to 5.5 V, TA = −40°C to 85°C, unless otherwise specified.) Symbol Parameter Test Conditions Min Max Units ICCR Read Current Read, fSCL = 400 kHz 0.5 mA ICCW Write Current Write, fSCL = 400 kHz 1 mA ISB Standby Current All I/O Pins at GND or VCC 1 mA IL I/O Pin Leakage Pin at GND or VCC 1 mA VIL Input Low Voltage −0.5 VCC x 0.3 V VIH Input High Voltage VCC x 0.7 VCC + 0.5 V VOL1 Output Low Voltage VCC w 2.5 V, IOL = 3.0 mA 0.4 V VOL2 Output Low Voltage VCC < 2.5 V, IOL = 1.0 mA 0.2 V Table 4. PIN IMPEDANCE CHARACTERISTICS (VCC = 1.7 V to 5.5 V, TA = −40°C to 85°C, unless otherwise specified.) Max Units CIN (Note 4) Symbol SDA I/O Pin Capacitance Parameter VIN = 0 V Conditions 8 pF CIN (Note 4) Input Capacitance (Other Pins) VIN = 0 V 6 pF IWP (Note 5) WP Input Current VIN < 0.5 x VCC, VCC = 5.5 V 200 mA VIN < 0.5 x VCC, VCC = 3.3 V 150 VIN < 0.5 x VCC, VCC = 1.8 V 100 VIN > 0.5 x VCC 1 4. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100 and JEDEC test methods. 5. When not driven, the WP pin is pulled down to GND internally. For improved noise immunity, the internal pull−down is relatively strong; therefore the external driver must be able to supply the pull−down current when attempting to drive the input HIGH. To conserve power, as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x VCC), the strong pull−down reverts to a weak current source. www.onsemi.com 2 CAT24AA16 Table 5. AC CHARACTERISTICS (Note 6) (VCC = 1.7 V to 5.5 V, TA = −40°C to 85°C, unless otherwise specified.) Standard VCC = 1.7 V − 5.5 V FSCL tHD:STA Max Clock Frequency Min 100 START Condition Hold Time Max 1 MHz VCC = 2.5 V − 5.5 V Min 400 Max Units 1000 kHz 4 0.6 0.25 ms tLOW Low Period of SCL Clock 4.7 1.3 0.4 ms tHIGH High Period of SCL Clock 4 0.6 0.4 ms 4.7 0.6 0.25 ms tSU:STA START Condition Setup Time tHD:DAT Data In Hold Time 0 0 0 ns tSU:DAT Data In Setup Time 250 100 100 ns tR (Note 7) SDA and SCL Rise Time tF (Note 7) SDA and SCL Fall Time tSU:STO 1000 Bus Free Time Between STOP and START tAA SCL Low to Data Out Valid tDH Data Out Hold Time 300 300 STOP Condition Setup Time tBUF Ti (Note 7) 300 300 ns 100 ns 4 0.6 0.25 ms 4.7 1.3 0.5 ms 3.5 100 0.9 50 Noise Pulse Filtered at SCL and SDA Inputs 100 0.4 50 100 ms ns 100 ns tSU:WP WP Setup Time 0 0 0 ms tHD:WP WP Hold Time 2.5 2.5 1 ms tWR tPU (Notes 7, 8) 6. 7. 8. Min Parameter Symbol Fast VCC = 1.7 V − 5.5 V Write Cycle Time 5 5 5 ms Power−up to Ready Mode 1 1 1 ms Test conditions according to “AC Test Conditions” table. Tested initially and after a design or process change that affects this parameter. tPU is the delay between the time VCC is stable and the device is ready to accept commands. Table 6. A.C. TEST CONDITIONS Input Levels 0.2 x VCC to 0.8 x VCC Input Rise and Fall Times v 50 ns Input Reference Levels 0.3 x VCC, 0.7 x VCC Output Reference Levels 0.5 x VCC Output Load Current Source: IOL = 3 mA (VCC w 2.5 V); IOL = 1 mA (VCC < 2.5 V); CL = 100 pF www.onsemi.com 3 CAT24AA16 I2C Bus Protocol Power−On Reset (POR) Each CAT24AA16 incorporates Power−On Reset (POR) circuitry which protects the internal logic against powering up in the wrong state. The device will power up into Standby mode after VCC exceeds the POR trigger level and will power down into Reset mode when VCC drops below the POR trigger level. This bi−directional POR behavior protects the device against brown−out failure, following a temporary loss of power. The 2−wire I2C bus consists of two lines, SCL and SDA, connected to the VCC supply via pullup resistors. The Master provides the clock to the SCL line, and the Master and Slaves drive the SDA line. A ‘0’ is transmitted by pulling a line LOW and a ‘1’ by releasing it HIGH. Data transfer may be initiated only when the bus is not busy (see AC Characteristics). During data transfer, SDA must remain stable while SCL is HIGH. START/STOP Condition An SDA transition while SCL is HIGH creates a START or STOP condition (Figure 2). A START is generated by a HIGH to LOW transition, while a STOP is generated by a LOW to HIGH transition. The START acts like a wake−up call. Absent a START, no Slave will respond to the Master. The STOP completes all commands. Pin Description SCL: The Serial Clock input pin accepts the clock signal generated by the Master. SDA: The Serial Data I/O pin accepts input data and delivers output data. In transmit mode, this pin is open drain. Data is acquired on the positive edge, and delivered on the negative edge of SCL. WP: When the Write Protect input pin is forced HIGH by an external source, all write operations are inhibited. When the pin is not driven by an external source, it is pulled LOW internally. Device Addressing The Master addresses a Slave by creating a START condition and then broadcasting an 8−bit Slave address (Figure 3). The four most significant bits of the Slave address are 1010 (Ah). The next three bits are internal address bits, a10, a9, a8. The last bit, R/W, instructs the Slave to either provide (1) or accept (0) data, i.e. it specifies a Read (1) or a Write (0) operation. Functional Description The CAT24AA16 supports the Inter−Integrated Circuit (I2C) Bus protocol. The protocol relies on the use of a Master device, which provides the clock and directs bus traffic, and Slave devices which execute requests. The CAT24AA16 operates as a Slave device. Both Master and Slave can transmit or receive, but only the Master can assign those roles. Acknowledge During the 9th clock cycle following every byte sent onto the bus, the transmitter releases the SDA line, allowing the receiver to respond. The receiver then either acknowledges (ACK) by pulling SDA LOW, or does not acknowledge (NoACK) by letting SDA stay HIGH (Figure 4). Bus timing is illustrated in Figure 5. SCL SDA START CONDITION STOP CONDITION Figure 2. Start/Stop Timing 1 0 1 0 a10 a9 Figure 3. Slave Address Bits www.onsemi.com 4 a8 R/W CAT24AA16 BUS RELEASE DELAY (TRANSMITTER) SCL FROM MASTER 1 BUS RELEASE DELAY (RECEIVER) 8 9 DATA OUTPUT FROM TRANSMITTER DATA OUTPUT FROM RECEIVER START ACK SETUP (w tSU:DAT) ACK DELAY (v tAA) Figure 4. Acknowledge Timing tF tHIGH tLOW tR tLOW SCL tSU:STA tHD:DAT tHD:STA tSU:DAT tSU:STO SDA IN tAA tDH tBUF SDA OUT Figure 5. Bus Timing WRITE OPERATIONS Byte Write Acknowledge Polling To write data to memory, the Master creates a START condition on the bus and then broadcasts a Slave address with the R/W bit set to ‘0’. The Master then sends an address byte and a data byte and concludes the session by creating a STOP condition on the bus. The Slave responds with ACK after every byte sent by the Master (Figure 6). The STOP starts the internal Write cycle, and while this operation is in progress (tWR), the SDA output is tri−stated and the Slave does not acknowledge the Master (Figure 7). The acknowledge (ACK) polling routine can be used to take advantage of the typical write cycle time. Once the stop condition is issued to indicate the end of the host’s write operation, the CAT24AA16 initiates the internal write cycle. The ACK polling can be initiated immediately. This involves issuing the start condition followed by the slave address for a write operation. If the CAT24AA16 is still busy with the write operation, NoACK will be returned. If the CAT24AA16 device has completed the internal write operation, an ACK will be returned and the host can then proceed with the next read or write operation. Page Write The Byte Write operation can be expanded to Page Write, by sending more than one data byte to the Slave before issuing the STOP condition (Figure 8). Up to 16 distinct data bytes can be loaded into the internal Page Write Buffer starting at the address provided by the Master. The page address is latched, and as long as the Master keeps sending data, the internal byte address is incremented up to the end of page, where it then wraps around (within the page). New data can therefore replace data loaded earlier. Following the STOP, data loaded during the Page Write session will be written to memory in a single internal Write cycle (tWR). Hardware Write Protection With the WP pin held HIGH, the entire memory is protected against Write operations. If the WP pin is left floating or is grounded, it has no impact on the Write operation. The state of the WP pin is strobed on the last falling edge of SCL immediately preceding the 1st data byte (Figure 9). If the WP pin is HIGH during the strobe interval, the Slave will not acknowledge the data byte and the Write request will be rejected. Delivery State The CAT24AA16 is shipped erased, i.e., all bytes are FFh. www.onsemi.com 5 CAT24AA16 BUS ACTIVITY: MASTER S T A R T SLAVE ADDRESS ADDRESS BYTE DATA BYTE a7 B a0 d7 B d0 S T O P P S A C K A C K SLAVE A C K Figure 6. Byte Write Sequence SCL 8th Bit SDA ACK Byte n tWR STOP CONDITION START CONDITION ADDRESS Figure 7. Write Cycle Timing BUS ACTIVITY: MASTER S T A R T S T O P DATA BYTE n+x DATA BYTE n+1 DATA BYTE n ADDRESS BYTE SLAVE ADDRESS S P A C K SLAVE A C K A C K A C K n=1 x v 15 Figure 8. Page Write Sequence ADDRESS BYTE DATA BYTE 1 8 9 a7 a0 1 8 SCL SDA d7 tSU:WP WP tHD:WP Figure 9. WP Timing www.onsemi.com 6 d0 A C K CAT24AA16 READ OPERATIONS Immediate Read sequence by sending data, the Master then creates a START condition and broadcasts a Slave address with the R/W bit set to ‘1’. The Slave responds with ACK after every byte sent by the Master and then sends out data residing at the selected address. After receiving the data, the Master responds with NoACK and then terminates the session by creating a STOP condition on the bus (Figure 11). To read data from memory, the Master creates a START condition on the bus and then broadcasts a Slave address with the R/W bit set to ‘1’. The Slave responds with ACK and starts shifting out data residing at the current address. After receiving the data, the Master responds with NoACK and terminates the session by creating a STOP condition on the bus (Figure 10). The Slave then returns to Standby mode. Sequential Read Selective Read If, after receiving data sent by the Slave, the Master responds with ACK, then the Slave will continue transmitting until the Master responds with NoACK followed by STOP (Figure 12). During Sequential Read the internal byte address is automatically incremented up to the end of memory, where it then wraps around to the beginning of memory. To read data residing at a specific address, the selected address must first be loaded into the internal address register. This is done by starting a Byte Write sequence, whereby the Master creates a START condition, then broadcasts a Slave address with the R/W bit set to ‘0’ and then sends an address byte to the Slave. Rather than completing the Byte Write BUS ACTIVITY: MASTER N O S T A R T S A T CO K P SLAVE ADDRESS P S SLAVE A C K SCL 8 9 SDA 8th Bit DATA BYTE NO ACK DATA OUT STOP Figure 10. Immediate Read Sequence and Timing BUS ACTIVITY: MASTER S T A R T ADDRESS BYTE SLAVE ADDRESS N O S T A R T S A T CO K P SLAVE ADDRESS S S A C K A C K SLAVE P A C K DATA BYTE Figure 11. Selective Read Sequence N O BUS ACTIVITY: MASTER A C K SLAVE ADDRESS A C K S AT CO KP A C K P SLAVE A C K DATA BYTE n DATA BYTE n+1 DATA BYTE n+2 Figure 12. Sequential Read Sequence www.onsemi.com 7 DATA BYTE n+x CAT24AA16 DEVICE ORDERING INFORMATION Device Order Number CAT24AA16TDI−GT3 Specific Device Marking Package Type Temperature Range Lead Finish Shipping† UK TSOT−23−5 Industrial NiPdAu Tape & Reel, 3,000 Units / Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 9. All packages are RoHS−compliant (Lead−free, Halogen−free). 10. The standard lead finish is NiPdAu. 11. For additional package and temperature options, please contact your nearest onsemi Sales office. 12. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. onsemi is licensed by the Philips Corporation to carry the I2C bus protocol. www.onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOT−23, 5 LEAD CASE 419AE−01 ISSUE O DATE 19 DEC 2008 SYMBOL D MIN NOM A e E1 MAX 1.00 A1 0.01 0.05 0.10 A2 0.80 0.87 0.90 b 0.30 c 0.12 E 0.45 0.15 D 2.90 BSC E 2.80 BSC E1 1.60 BSC e 0.95 TYP L 0.30 L1 0.40 0.20 0.50 0.60 REF L2 0.25 BSC 0º θ 8º TOP VIEW A2 A b q L A1 c L2 L1 SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-193. DOCUMENT NUMBER: DESCRIPTION: 98AON34392E TSOT−23, 5 LEAD Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
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