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CAT24C04LI

CAT24C04LI

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    DIP8

  • 描述:

    CAT24C04 - 4-KBIT I2C SERIAL EEP

  • 数据手册
  • 价格&库存
CAT24C04LI 数据手册
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 1-Kb, 2-Kb, 4-Kb, 8-Kb and 16-Kb I2C CMOS Serial EEPROM http://onsemi.com SOIC−8 W SUFFIX CASE 751BD Description The CAT24C01/02/04/08/16 are 1−Kb, 2−Kb, 4−Kb, 8−Kb and 16−Kb respectively CMOS Serial EEPROM devices organized internally as 8/16/32/64 and 128 pages respectively of 16 bytes each. All devices support both the Standard (100 kHz) as well as Fast (400 kHz) I2C protocol. Data is written by providing a starting address, then loading 1 to 16 contiguous bytes into a Page Write Buffer, and then writing all data to non−volatile memory in one internal write cycle. Data is read by providing a starting address and then shifting out data serially while automatically incrementing the internal address count. External address pins make it possible to address up to eight CAT24C01 or CAT24C02, four CAT24C04, two CAT24C08 and one CAT24C16 device on the same bus. PDIP−8 L SUFFIX CASE 646AA TSOT−23 TD SUFFIX CASE 419AE MSOP−8 Z SUFFIX CASE 846AD TDFN−8 VP2 SUFFIX CASE 511AK TSSOP−8 Y SUFFIX CASE 948AL UDFN8−EP HU4 SUFFIX CASE 517AZ WLCSP−4* C4A SUFFIX CASE 567DC WLCSP−5* C5A SUFFIX CASE 567DD Features • • • • • • • • • • Supports Standard and Fast I2C Protocol 1.7 V to 5.5 V Supply Voltage Range 16−Byte Page Write Buffer Hardware Write Protection for Entire Memory Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs (SCL and SDA) Low power CMOS Technology 1,000,000 Program/Erase Cycles 100 Year Data Retention Industrial and Extended Temperature Range These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant PIN CONFIGURATIONS TSOT−23 (TD) (Top View) SCL 1 VSS 2 SDA 3 5 WP 4 VCC PDIP (L), SOIC (W), TSSOP (Y), MSOP (Z), TDFN, (VP2), UDFN−EP (HU4) (Top View) CAT24C__ 16 / 08 / 04 / 02 / 01 VCC 8 NC / NC / NC / A0 / A0 1 NC / NC / A1 / A1 / A1 2 7 WP NC / A2 / A2 / A2 / A2 3 6 SCL VSS 4 5 SDA WLCSP−4* (Bottom View) B D C E WLCSP−5* (Bottom View) A = WP B = SCL C = SDA D = VCC E = VSS A B C D E * WLCSP are available upon request for the CAT24C04, CAT24C08 and CAT24C16 only. For availability, please contact factory. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 18 of this data sheet. © Semiconductor Components Industries, LLC, 2011 May, 2011 − Rev. 15 1 Publication Order Number: CAT24C01/D CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 VCC Table 1. PIN FUNCTION Pin Name Function A0, A1, A2 SCL A2, A1, A0 CAT24Cxx SDA WP Device Address Input SDA Serial Data Input/Output SCL Serial Clock Input WP Write Protect Input VCC Power Supply VSS Ground NC No Connect VSS Figure 1. Functional Symbol Table 2. ABSOLUTE MAXIMUM RATINGS Parameters Ratings Units Storage Temperature −65 to +150 °C Voltage on any pin with respect to Ground (Note 1) −0.5 to +6.5 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. During input transitions, voltage undershoot on any pin should not exceed −1 V for more than 20 ns. Voltage overshoot on pins A0, A1, A2 and WP should not exceed VCC + 1 V for more than 20 ns, while voltage on the I2C bus pins, SCL and SDA, should not exceed the absolute maximum ratings, irrespective of VCC. Table 3. RELIABILITY CHARACTERISTICS (Note 2) Parameter Symbol NEND (Note 3) TDR Endurance Min Units 1,000,000 Program / Erase Cycles 100 Years Data Retention 2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100 and JEDEC test methods. 3. Page Mode, VCC = 5 V, 25°C. Table 4. D.C. OPERATING CHARACTERISTICS (VCC = 1.8 V to 5.5 V, TA = −40°C to +125°C and VCC = 1.7 V to 5.5 V, TA = −40°C to +85°C, unless otherwise specified.) Symbol Parameter ICCR Read Current ICCW Write Current ISB IL Standby Current I/O Pin Leakage VIL Input Low Voltage VIH Input High Voltage VOL Output Low Voltage Test Conditions Min Read, fSCL = 400 kHz Write, fSCL = 400 kHz All I/O Pins at GND or VCC Max Units 1 mA 2 mA TA = −40°C to +85°C VCC ≤ 3.3 V 1 mA TA = −40°C to +85°C VCC > 3.3 V 3 TA = −40°C to +125°C 5 Pin at GND or VCC 2 mA −0.5 0.3 x VCC V A0, A1, A2 and WP 0.7 x VCC VCC + 0.5 V SCL and SDA 0.7 x VCC 5.5 VCC > 2.5 V, IOL = 3 mA 0.4 VCC < 2.5 V, IOL = 1 mA 0.2 http://onsemi.com 2 CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 Table 5. PIN IMPEDANCE CHARACTERISTICS (VCC = 1.8 V to 5.5 V, TA = −40°C to +125°C and VCC = 1.7 V to 5.5 V, TA = −40°C to +85°C, unless otherwise specified.) Symbol CIN (Note 4) Parameter SDA Pin Capacitance Conditions Max Units VIN = 0 V, f = 1.0 MHz, VCC = 5.0 V 8 pF 6 pF VIN < VIH, VCC = 5.5 V 130 mA VIN < VIH, VCC = 3.3 V 120 VIN < VIH, VCC = 1.7 V 80 VIN > VIH 2 VIN < VIH, VCC = 5.5 V 50 VIN < VIH, VCC = 3.3 V 35 VIN < VIH, VCC = 1.7 V 25 VIN > VIH 2 Other Pins IWP (Note 5) IA (Note 5) WP Input Current Address Input Current (A0, A1, A2) Product Rev H mA 4. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100 and JEDEC test methods. 5. When not driven, the WP, A0, A1 and A2 pins are pulled down to GND internally. For improved noise immunity, the internal pull−down is relatively strong; therefore the external driver must be able to supply the pull−down current when attempting to drive the input HIGH. To conserve power, as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x VCC), the strong pull−down reverts to a weak current source. Table 6. A.C. CHARACTERISTICS (Note 6) (VCC = 1.8 V to 5.5 V, TA = −40°C to +125°C and VCC = 1.7 V to 5.5 V, TA = −40°C to +85°C, unless otherwise specified.) Standard FSCL tHD:STA Min Parameter Symbol Clock Frequency Max Fast Min 100 START Condition Hold Time Max Units 400 kHz 4 0.6 ms tLOW Low Period of SCL Clock 4.7 1.3 ms tHIGH High Period of SCL Clock 4 0.6 ms 4.7 0.6 ms tSU:STA START Condition Setup Time tHD:DAT Data In Hold Time 0 0 ms tSU:DAT Data In Setup Time 250 100 ns tR SDA and SCL Rise Time 1000 300 ns tF (Note 6) SDA and SCL Fall Time 300 300 ns tSU:STO STOP Condition Setup Time tBUF Bus Free Time Between STOP and START tAA SCL Low to Data Out Valid tDH Data Out Hold Time Ti (Note 6) 4 0.6 ms 4.7 1.3 ms 3.5 100 Noise Pulse Filtered at SCL and SDA Inputs 0.9 100 100 ms ns 100 ns tSU:WP WP Setup Time 0 0 ms tHD:WP WP Hold Time 2.5 2.5 ms tWR tPU (Notes 7, 8) Write Cycle Time 5 5 ms Power−up to Ready Mode 1 1 ms 6. Test conditions according to “AC Test Conditions” table. 7. Tested initially and after a design or process change that affects this parameter. 8. tPU is the delay between the time VCC is stable and the device is ready to accept commands. http://onsemi.com 3 CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 Table 7. A.C. TEST CONDITIONS Input Drive Levels 0.2 x VCC to 0.8 x VCC Input Rise and Fall Time v 50 ns Input Reference Levels 0.3 x VCC, 0.7 x VCC Output Reference Level 0.5 x VCC Output Test Load Current Source IOL = 3 mA (VCC w 2.5 V); IOL = 1 mA (VCC < 2.5 V); CL = 100 pF Power−On Reset (POR) Each CAT24Cxx* incorporates Power−On Reset (POR) circuitry which protects the internal logic against powering up in the wrong state. A CAT24Cxx device will power up into Standby mode after VCC exceeds the POR trigger level and will power down into Reset mode when VCC drops below the POR trigger level. This bi−directional POR feature protects the device against ‘brown−out’ failure following a temporary loss of power. *For common features, the CAT24C01/02/04/08/16 will be referred to as CAT24Cxx. bus via their respective SCL and SDA pins. The transmitting device pulls down the SDA line to ‘transmit’ a ‘0’ and releases it to ‘transmit’ a ‘1’. Data transfer may be initiated only when the bus is not busy (see AC Characteristics). During data transfer, the SDA line must remain stable while the SCL line is high. An SDA transition while SCL is high will be interpreted as a START or STOP condition (Figure 2). The START condition precedes all commands. It consists of a HIGH to LOW transition on SDA while SCL is HIGH. The START acts as a ‘wake−up’ call to all receivers. Absent a START, a Slave will not respond to commands. The STOP condition completes all commands. It consists of a LOW to HIGH transition on SDA while SCL is HIGH. Pin Description SCL: The Serial Clock input pin accepts the Serial Clock generated by the Master. SDA: The Serial Data I/O pin receives input data and transmits data stored in EEPROM. In transmit mode, this pin is open drain. Data is acquired on the positive edge, and is delivered on the negative edge of SCL. A0, A1 and A2: The Address inputs set the device address when cascading multiple devices. When not driven, these pins are pulled LOW internally. WP: The Write Protect input pin inhibits all write operations, when pulled HIGH. When not driven, this pin is pulled LOW internally. Device Addressing The Master initiates data transfer by creating a START condition on the bus. The Master then broadcasts an 8−bit serial Slave address. For normal Read/Write operations, the first 4 bits of the Slave address are fixed at 1010 (Ah). The next 3 bits are used as programmable address bits when cascading multiple devices and/or as internal address bits. The last bit of the slave address, R/W, specifies whether a Read (1) or Write (0) operation is to be performed. The 3 address space extension bits are assigned as illustrated in Figure 3. A2, A1 and A0 must match the state of the external address pins, and a10, a9 and a8 are internal address bits. Functional Description The CAT24Cxx supports the Inter−Integrated Circuit (I2C) Bus data transmission protocol, which defines a device that sends data to the bus as a transmitter and a device receiving data as a receiver. Data flow is controlled by a Master device, which generates the serial clock and all START and STOP conditions. The CAT24Cxx acts as a Slave device. Master and Slave alternate as either transmitter or receiver. Acknowledge After processing the Slave address, the Slave responds with an acknowledge (ACK) by pulling down the SDA line during the 9th clock cycle (Figure 4). The Slave will also acknowledge the address byte and every data byte presented in Write mode. In Read mode the Slave shifts out a data byte, and then releases the SDA line during the 9th clock cycle. As long as the Master acknowledges the data, the Slave will continue transmitting. The Master terminates the session by not acknowledging the last data byte (NoACK) and by issuing a STOP condition. Bus timing is illustrated in Figure 5. I2C Bus Protocol The I2C bus consists of two ‘wires’, SCL and SDA. The two wires are connected to the VCC supply via pull−up resistors. Master and Slave devices connect to the 2−wire http://onsemi.com 4 CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 SCL SDA START CONDITION STOP CONDITION Figure 2. Start/Stop Timing 1 0 1 0 A2 A1 A0 R/W CAT24C01 and CAT24C02 1 0 1 0 A2 A1 a8 R/W CAT24C04 1 0 1 0 A2 a9 a8 R/W CAT24C08 1 0 1 0 a10 a9 a8 R/W CAT24C16 Figure 3. Slave Address Bits BUS RELEASE DELAY (TRANSMITTER) SCL FROM MASTER 1 BUS RELEASE DELAY (RECEIVER) 8 9 DATA OUTPUT FROM TRANSMITTER DATA OUTPUT FROM RECEIVER ACK SETUP (w tSU:DAT) ACK DELAY (v tAA) START Figure 4. Acknowledge Timing tF tHIGH tR tLOW tLOW SCL tSU:STA tHD:DAT tHD:SDA tSU:DAT tSU:STO SDA IN tAA tDH SDA OUT Figure 5. Bus Timing http://onsemi.com 5 tBUF CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 WRITE OPERATIONS Byte Write sixteen bytes are received and the STOP condition has been sent by the Master, the internal Write cycle begins. At this point all received data is written to the CAT24Cxx in a single write cycle. In Byte Write mode, the Master sends the START condition and the Slave address with the R/W bit set to zero to the Slave. After the Slave generates an acknowledge, the Master sends the byte address that is to be written into the address pointer of the CAT24Cxx. After receiving another acknowledge from the Slave, the Master transmits the data byte to be written into the addressed memory location. The CAT24Cxx device will acknowledge the data byte and the Master generates the STOP condition, at which time the device begins its internal Write cycle to nonvolatile memory (Figure 6). While this internal cycle is in progress (tWR), the SDA output will be tri−stated and the CAT24Cxx will not respond to any request from the Master device (Figure 7). Acknowledge Polling The acknowledge (ACK) polling routine can be used to take advantage of the typical write cycle time. Once the stop condition is issued to indicate the end of the host’s write operation, the CAT24Cxx initiates the internal write cycle. The ACK polling can be initiated immediately. This involves issuing the start condition followed by the slave address for a write operation. If the CAT24Cxx is still busy with the write operation, NoACK will be returned. If the CAT24Cxx has completed the internal write operation, an ACK will be returned and the host can then proceed with the next read or write operation. Page Write The CAT24Cxx writes up to 16 bytes of data in a single write cycle, using the Page Write operation (Figure 8). The Page Write operation is initiated in the same manner as the Byte Write operation, however instead of terminating after the data byte is transmitted, the Master is allowed to send up to fifteen additional bytes. After each byte has been transmitted the CAT24Cxx will respond with an acknowledge and internally increments the four low order address bits. The high order bits that define the page address remain unchanged. If the Master transmits more than sixteen bytes prior to sending the STOP condition, the address counter ‘wraps around’ to the beginning of page and previously transmitted data will be overwritten. Once all BUS ACTIVITY: MASTER S T A R T Hardware Write Protection With the WP pin held HIGH, the entire memory is protected against Write operations. If the WP pin is left floating or is grounded, it has no impact on the operation of the CAT24Cxx. The state of the WP pin is strobed on the last falling edge of SCL immediately preceding the first data byte (Figure 9). If the WP pin is HIGH during the strobe interval, the CAT24Cxx will not acknowledge the data byte and the Write request will be rejected. Delivery State The CAT24Cxx is shipped erased, i.e., all bytes are FFh. SLAVE ADDRESS ADDRESS BYTE DATA BYTE a7 − a 0 d7 − d 0 S T O P P S SLAVE * For the CAT24C01 a7 = 0 A C K A C K Figure 6. Byte Write Sequence http://onsemi.com 6 A C K CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 SCL 8th Bit SDA ACK Byte n tWR STOP CONDITION START CONDITION ADDRESS Figure 7. Write Cycle Timing BUS ACTIVITY: MASTER S T A R T DATA BYTE n ADDRESS BYTE SLAVE ADDRESS DATA BYTE n+1 S T O P DATA BYTE n+P S P A C K SLAVE n=1 P v 15 A C K A C K A C K Figure 8. Page Write Sequence ADDRESS BYTE DATA BYTE 1 8 9 a7 a0 1 8 d7 d0 SCL SDA tSU:WP WP tHD:WP Figure 9. WP Timing http://onsemi.com 7 A C K CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 READ OPERATIONS Immediate Read CAT24Cxx acknowledges the byte address, the Master device resends the START condition and the slave address, this time with the R/W bit set to one. The CAT24Cxx then responds with its acknowledge and sends the requested data byte. The Master device does not acknowledge the data (NoACK) but will generate a STOP condition (Figure 11). Upon receiving a Slave address with the R/W bit set to ‘1’, the CAT24Cxx will interpret this as a request for data residing at the current byte address in memory. The CAT24Cxx will acknowledge the Slave address, will immediately shift out the data residing at the current address, and will then wait for the Master to respond. If the Master does not acknowledge the data (NoACK) and then follows up with a STOP condition (Figure 10), the CAT24Cxx returns to Standby mode. Sequential Read If during a Read session, the Master acknowledges the 1st data byte, then the CAT24Cxx will continue transmitting data residing at subsequent locations until the Master responds with a NoACK, followed by a STOP (Figure 12). In contrast to Page Write, during Sequential Read the address count will automatically increment to and then wrap−around at end of memory (rather than end of page). In the CAT24C01, the internal address count will not wrap around at the end of the 128 byte memory space. Selective Read Selective Read operations allow the Master device to select at random any memory location for a read operation. The Master device first performs a ‘dummy’ write operation by sending the START condition, slave address and byte address of the location it wishes to read. After the BUS ACTIVITY: MASTER N O S T A R T S AT CO KP SLAVE ADDRESS P S A C K SLAVE SCL D ATA BYTE 8 9 8th Bit SDA DATA OUT NO ACK STOP Figure 10. Immediate Read Sequence and Timing BUS ACTIVITY: MASTER S T A R T S T A R T ADDRESS BYTE SLAVE ADDRESS S N O S AT CO KP SLAVE ADDRESS P S A C K SLAVE A C K A C K D ATA BYTE Figure 11. Selective Read Sequence N O BUS ACTIVITY: MASTER A C K SLAVE ADDRESS A C K S AT CO KP A C K P SLAVE A C K D ATA BYTE n D ATA BYTE n+1 D ATA BYTE n+2 Figure 12. Sequential Read Sequence http://onsemi.com 8 D ATA BYTE n+x CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 PACKAGE DIMENSIONS PDIP−8, 300 mils CASE 646AA−01 ISSUE A SYMBOL MIN NOM A E1 5.33 A1 0.38 A2 2.92 3.30 4.95 b 0.36 0.46 0.56 b2 1.14 1.52 1.78 c 0.20 0.25 0.36 D 9.02 9.27 10.16 E 7.62 7.87 8.25 E1 6.10 6.35 7.11 e PIN # 1 IDENTIFICATION MAX 2.54 BSC eB 7.87 L 2.92 10.92 3.30 3.80 D TOP VIEW E A2 A A1 c b2 L e eB b SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC MS-001. http://onsemi.com 9 CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O SYMBOL E1 E MIN MAX A 1.35 1.75 A1 0.10 0.25 b 0.33 0.51 c 0.19 0.25 D 4.80 5.00 E 5.80 6.20 E1 3.80 4.00 1.27 BSC e PIN # 1 IDENTIFICATION NOM h 0.25 0.50 L 0.40 1.27 θ 0º 8º TOP VIEW D h A1 θ A c e b L SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. http://onsemi.com 10 CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O b SYMBOL MIN NOM A E1 E MAX 1.20 A1 0.05 A2 0.80 b 0.19 0.15 0.90 1.05 0.30 c 0.09 D 2.90 3.00 3.10 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 e 0.20 0.65 BSC L 1.00 REF L1 0.50 θ 0º 0.60 0.75 8º e TOP VIEW D A2 c q1 A A1 L1 SIDE VIEW L END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. http://onsemi.com 11 CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 PACKAGE DIMENSIONS MSOP 8, 3x3 CASE 846AD−01 ISSUE O SYMBOL MIN NOM MAX 1.10 A E A1 0.05 0.10 0.15 A2 0.75 0.85 0.95 b 0.22 0.38 c 0.13 0.23 D 2.90 3.00 3.10 E 4.80 4.90 5.00 E1 2.90 3.00 3.10 E1 0.65 BSC e L 0.60 0.40 0.80 L1 0.95 REF L2 0.25 BSC θ 0º 6º TOP VIEW D A A2 A1 DETAIL A e b c SIDE VIEW END VIEW q L2 Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-187. L L1 DETAIL A http://onsemi.com 12 CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 PACKAGE DIMENSIONS TDFN8, 2x3 CASE 511AK−01 ISSUE A D e A b E2 E PIN#1 IDENTIFICATION A1 PIN#1 INDEX AREA D2 TOP VIEW SYMBOL MIN SIDE VIEW NOM A 0.70 0.75 0.80 0.00 0.02 0.05 A2 0.45 0.55 0.65 A2 0.20 REF A3 b 0.20 0.25 0.30 D 1.90 2.00 2.10 D2 1.30 1.40 1.50 E 2.90 3.00 3.10 E2 1.20 1.30 1.40 e L BOTTOM VIEW MAX A1 A3 FRONT VIEW 0.50 TYP 0.20 0.30 L 0.40 Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC MO-229. http://onsemi.com 13 CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 PACKAGE DIMENSIONS TSOT−23, 5 LEAD CASE 419AE−01 ISSUE O SYMBOL D MIN NOM A e E1 MAX 1.00 A1 0.01 0.05 0.10 A2 0.80 0.87 0.90 b 0.30 c 0.12 0.45 0.15 D 2.90 BSC E 2.80 BSC E1 1.60 BSC E e 0.20 0.95 TYP L 0.30 0.40 L1 0.60 REF L2 0.25 BSC 0º θ 0.50 8º TOP VIEW A2 A b q L A1 c L1 SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-193. http://onsemi.com 14 L2 CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 PACKAGE DIMENSIONS UDFN8, 2x3 EXTENDED PAD CASE 517AZ−01 ISSUE O D b A e L DAP SIZE 1.8 x 1.8 E2 E PIN #1 IDENTIFICATION A1 PIN #1 INDEX AREA D2 TOP VIEW SYMBOL MIN SIDE VIEW NOM MAX A 0.45 0.50 0.55 A1 0.00 0.02 0.05 A3 0.127 REF b 0.20 0.25 0.30 D 1.95 2.00 2.05 D2 1.35 1.40 1.45 E 2.95 3.00 3.05 E2 1.25 1.30 1.35 e L BOTTOM VIEW DETAIL A 0.065 REF A3 A FRONT VIEW 0.50 REF 0.25 0.30 0.35 A3 Notes: (1) All dimensions are in millimeters. (2) Refer JEDEC MO-236/MO-252. 0.0 - 0.05 DETAIL A http://onsemi.com 15 0.065 REF Copper Exposed CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 PACKAGE DIMENSIONS WLCSP4, 0.856x0.832 CASE 567DC−01 ISSUE O ÈÈ ÈÈ 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE CONTACT BALLS. 4. COPLANARITY APPLIES TO SPHERICAL CROWNS OF THE CONTACT BALLS. 5. DIMENSION b IS MEASURED AT THE MAXIMUM CONTACT BALL DIAMETER PARALLEL TO DATUM C. A B E PIN A1 REFERENCE D TOP VIEW A2 A2 0.10 C 0.05 C e 4X 0.10 M C A1 SIDE VIEW NOTE 4 b C A B NOTE 5 DIM A A1 A2 b D E e SEATING PLANE NOTE 3 e B A 1 2 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* A1 0.40 PITCH PACKAGE OUTLINE 4X 0.40 PITCH 0.23 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 16 MILLIMETERS MIN MAX 0.35 0.27 0.09 0.13 0.20 REF 0.22 0.28 0.856 BSC 0.832 BSC 0.40 BSC CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 PACKAGE DIMENSIONS WLCSP5, 0.832x0.856 CASE 567DD−01 ISSUE O ÈÈ ÈÈ 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE CONTACT BALLS. 4. COPLANARITY APPLIES TO SPHERICAL CROWNS OF THE CONTACT BALLS. 5. DIMENSION b IS MEASURED AT THE MAXIMUM CONTACT BALL DIAMETER PARALLEL TO DATUM C. A B D PIN A1 REFERENCE E TOP VIEW A2 A2 0.10 C 0.05 C M NOTE 5 SEATING PLANE NOTE 3 e 5X 0.10 C A1 SIDE VIEW NOTE 4 b C A B DIM A A1 A2 b D E e e1 e1 B A 1 2 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* A1 0.52 PITCH PACKAGE OUTLINE 5X 0.30 PITCH 0.16 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 17 MILLIMETERS MIN MAX 0.35 0.27 0.09 0.13 0.20 REF 0.14 0.18 0.832 BSC 0.856 BSC 0.300 BSC 0.520 BSC CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16 Example of Ordering Information CAT24C01/02/04/08/16 (Note 11) Prefix Device # CAT 24C16 Suffix Y I −G Temperature Range Company ID Product Number 24C01 24C02 24C04 24C08 24C16 I = Industrial (−40°C to +85°C) E = Extended (−40°C to +125°C) Lead Finish G: NiPdAu Blank: Matte−Tin T3 Tape & Reel (Note 16) T: Tape & Reel 3: 3000 Units / Reel Package L: PDIP W: SOIC, JEDEC Y: TSSOP Z: MSOP (Note 12) VP2: TDFN (2 x 3 mm) (Note 13) TD: TSOT−23 HU4: UDFN (2 x 3 mm) C4A: WLCSP − 4 balls (Note 15) C5A: WLCSP − 5 balls (Note 15) 9. All packages are RoHS−compliant (Lead−free, Halogen−free). 10. The standard lead finish is NiPdAu. 11. The device used in the above example is a CAT24C16YI−GT3 (TSSOP, Industrial Temperature, NiPdAu, Tape & Reel, 3,000/Reel). 12. For availability, please contact your nearest ON Semiconductor Sales Office. 13. Not recommended for new designs. Please replace with UDFN 2 x 3 mm (HU4) package. 14. For CAT24C02 Gresham only die, please use the following OPNs: CAT24C02LI-GA, CAT24C02WI-GT3A, CAT24C02YI-GT3A, CAT24C02ZI-GT3A, CAT24C02VP2IGT3A, CAT24C02TDI-GT3A, CAT24C02HU4IGT3A, CAT24C02LE-GA, CAT24C02WE-GT3A, CAT24C02YE-GT3A, CAT24C02ZE-GT3A, CAT24C02VP2EGT3A, CAT24C02TDE-GT3A or CAT24C02HU4EGT3A. 15. WLCSP 4 balls and 5 balls configurations are available upon request for the CAT24C04, CAT24C08 and CAT24C16 only. For availability, please contact your nearest ON Semiconductor Sales office. 16. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ON Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 18 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CAT24C01/D
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