CAT25C08V

CAT25C08, CAT25C16 8K/16K SPI Serial CMOS EEPROM FEATURES DESCRIPTION ■ 10 MHz SPI compatible The CAT25C08/16 is a 8K/16K Bit SPI Serial CMOS EEPROM internally organized as 1024x8/2048x8 bits. Catalyst’s advanced CMOS Technology substantially reduces device power requirements. The CAT25C08/ 16 features a 32-byte page write buffer. The device operates via the SPI bus serial interface and is enabled though a Chip Select (CS). In addition to the Chip Select, the clock input (SCK), data in (SI) and data out (SO) are required to access the device. The HOLD pin may be used to suspend any serial communication without resetting the serial sequence. The CAT25C08/16 is designed with software and hardware write protection features including Block Write protection. The device is available in 8-pin DIP, 8-pin SOIC and 8-pin TSSOP packages. ■ 1.8 to 5.5 volt operation ■ 32-byte page write buffer ■ Hardware and software protection ■ Block write protection – Protect 1/4, 1/2 or all of EEPROM array ■ Low power CMOS technology ■ SPI modes (0,0 & 1,1) ■ Industrial temperature range ■ 1,000,000 program/erase cycles ■ 100 year data retention ■ Self-timed write cycle ■ RoHS compliant “ ”&“ ” 8-pin PDIP, SOIC and TSSOP packages available PIN CONFIGURATION FUNCTIONAL SYMBOL PDIP (P, L) SOIC (S, V) TSSOP (U, Y) CS 1 8 VCC SO 2 7 HOLD WP 3 6 SCK VSS 4 5 SI VCC SI CS WP CAT25C08 CAT25C16 SO HOLD SCK PIN FUNCTIONS Pin Name Function SO Serial Data Output SCK Serial Clock WP Write Protect VCC +1.8V to +5.5V Power Supply VSS Ground CS Chip Select SI Serial Data Input HOLD Suspends Serial Input © 2006 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice VSS 1 Doc. No. 1016, Rev. A CAT25C08/16 ABSOLUTE MAXIMUM RATINGS* *COMMENT Temperature Under Bias ................. –55°C to +125°C Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. Storage Temperature ....................... –65°C to +150°C Voltage on any Pin with Respect to VSS(1) .................. –2.0V to +VCC +2.0V VCC with Respect to VSS ................................ –2.0V to +7.0V Package Power Dissipation Capability (Ta = 25°C) ................................... 1.0W Lead Soldering Temperature (10 secs) ............ 300°C Output Short Circuit Current(2) ........................ 100 mA RELIABILITY CHARACTERISTICS Symbol Parameter NEND(3) Endurance TDR(3) VZAP (3) ILTH(3)(4) Min. Typ. Max. Units 1,000,000 Cycles/Byte Data Retention 100 Years ESD Susceptibility 2000 Volts Latch-up 100 mA D.C. OPERATING CHARACTERISTICS VCC = +1.8V to +6.0V, unless otherwise specified. Limits Symbol Parameter Min. Typ. Max. Units Test Conditions ICC1 Power Supply Current (Operating Write) 5 mA VCC = 5V @ 5MHz SO=open; CS=Vss ICC2 Power Supply Current (Operating Read) 3 mA VCC = 5.5V FCLK = 5MHz ISB(6) Power Supply Current (Standby) 1 µA CS = VCC VIN = VSS or VCC ILI Input Leakage Current 2 µA ILO Output Leakage Current 3 µA VIL(5) Input Low Voltage -1 VCC x 0.3 V (5) Input High Voltage VCC x 0.7 VCC + 0.5 V 0.4 V VIH VOL1 Output Low Voltage VOH1 Output High Voltage VOL2 Output Low Voltage VOH2 Output High Voltage VCC - 0.8 V 0.2 VCC-0.2 VOUT = 0V to VCC, CS = 0V 2.7V≤VCC