CAT3200, CAT3200-5
Low Noise Regulated Charge Pump DC-DC Converter
FEATURES
■ Constant high frequency (2MHz) operation
■ Thermal overload shutdown protection
■ 100mA output current
■ Low value external capacitors (1µF)
■ Regulated output voltage (5V fixed CAT3200-5,
■ Foldback current overload protection
Adjustable CAT3200)
■ Shutdown current less than 1µA
■ Low quiescent current (1.7mA typ.)
■ CAT3200-5 in low profile (1mm thin) 6-lead
■ Input voltage operation down to 2.7V
SOT23 package
■ CAT3200 in MSOP-8 package
■ Soft start, slew rate control
APPLICATIONS
■ 3V to 5V boost conversion
■ Local 5V supply from lower rail
■ White LED driver
■ Battery backup systems
■ USB On-The-Go 5V supply
■ Handheld portable devices
DESCRIPTION
A shutdown control input allows the device to be
placed in power-down mode, reducing the supply
current to less than 1µA.
The CAT3200 and CAT3200-5 are switched capacitor
boost converters that deliver a low noise, regulated
output voltage. The CAT3200-5 gives a fixed regulated
5V output. The CAT3200 has an adjustable output
using external resistors. The constant frequency 2MHz
charge pump allows small 1µF ceramic capacitors to
be used.
In the event of short circuit or overload conditions, the
device is fully protected by both foldback current
limiting and thermal overload detection. In addition, a
soft start, slew rate control circuit limits inrush current
during power-up.
Maximum output loads of up to 100mA can be
supported over a wide range of input supply voltages
(2.7V to 4.5V) making the device ideal for batterypowered applications.
The CAT3200-5 is available in a 6-lead, 1mm max
thin SOT23 package. The CAT3200 is available in an
8-lead MSOP package.
TYPICAL APPLICATION
5V Output
CPOS
IN
CAT3200-5
+
3.3V
-
ON OFF
CNEG
5V
OUT
VIN
VOUT
100mA
OUT
+
3.3V
-
ON OFF
R1
FB
SHDN
GND
R2
(
R
VOUT = 1.27 V 1+ 1
R2
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
VOUT
100mA
CAT3200
SHDN
GND
CPOS
IN
1
(
CNEG
VIN
Adjustable Output
Doc. No. 5002, Rev. K
CAT3200/3200-5
ORDERING INFORMATION
Part Number
Output Voltage
Package
Package Marking
Quantity
per Reel
CAT3200ES6-5-TE7
5V
6-lead thin SOT23
BJ
3,000
CAT3200TDI-TE7
5V
6-lead thin SOT23, Lead Free
LN
3,000
CAT3200EMS8-TE13
Adjustable
8-lead MSOP
AATR
2,500
CAT3200ZI-TE13
Adjustable
8-lead MSOP, Lead Free
ABDA
2,500
PIN DESCRIPTIONS
Designation
Description
OUT
Regulated output voltage.
GND
Ground reference for all voltages.
SHDN
Shutdown control logic input (Active LOW)
CNEG
Negative connection for the flying capacitor.
IN
Input power supply.
CPOS
Positive connection for the flying capacitor.
FB
Feedback to set the output voltage.
PGND
Power ground.
SGND
Signal ground.
PIN CONFIGURATION
6-lead Thin SOT23
OUT
1
GND
2
SHDN
3
CAT3200-5
Doc. No. 5002, Rev. K
8-pin MSOP
6
CPOS
5
IN
4
CNEG
CPOS
1
IN
2
8
OUT
7
FB
CAT3200
CNEG
3
6
SHDN
PGND
4
5
SGND
2
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT3200/3200-5
ABSOLUTE MAXIMUM RATINGS
Power Dissipation (8-MSOP) ............................. 0.5W
VIN, VOUT, SHDN, CNEG, CPOS Voltage .. -0.6V to 6.0V
VOUT Short Circuit Duration ......................... Indefinite
RECOMMENDED OPERATING CONDITIONS
Output Current ................................................ 200mA
VIN ................................................................................... 2.7V to 4.5V
ESD Protection (HBM) ..................................... 2000V
CIN, COUT, CFLY
Junction Temperature ...................................... 150°C
..........................................................................
1µF
ILOAD ................................................................................. 0 to 100mA
Storage Temperature Range ............. -65°C to 160°C
Ambient Temperature Range ................... -40°C to 85°C
Lead Soldering Temperature (10 sec) ............. 300°C
Power Dissipation (SOT23-6) ............................ 0.3W
ELECTRICAL SPECIFICATIONS
Recommended operating conditions unless otherwise specified. CIN, COUT, CFLY are 1µF ceramic capacitors and VIN
is set to 3.6V.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VOUT
Regulated Output
ILOAD ≤ 40mA, VIN ≥ 2.7 V
ILOAD ≤ 100mA, VIN ≥ 3.1 V
4.8
5.0
5.2
V
VLINE
Line Regulation
3.1V ≤ VIN ≤ 4.5V, ILOAD = 50mA
6
mV
VLOAD
Load Regulation
ILOAD = 10mA to 100mA, VIN = 3.6V
20
mV
FOSC
Switching Frequency
1.3
2.0
2.6
MHz
VR
Output Ripple
Voltage
ILOAD = 100mA
CAT3200-5 Only
30
mVp-p
η
Efficiency
ILOAD = 50mA, VIN = 3V, CAT3200-5
80
%
IGND
Ground Current
ILOAD = 0mA, SHDN = VIN
1.6
ISHDN
Shutdown Input
Current
ILOAD = 0mA, SHDN = 0V to VIN
VFB
FB Voltage
CAT3200 Only
1.22
IFB
FB Input Current
CAT3200 Only
-50
ROL
Open-Loop
ILOAD = 100mA, VIN = 3V (Note 1)
10
Ω
ILOAD = 0mA, VIN = 3V
0.5
ms
1.27
4
mA
1
µA
1.32
V
50
nA
Resistance
TON
VOUT Turn-on time
(10% to 90%)
VIHSHDN
High Detect
Shutdown Threshold
VILSHDN
Low Detect
Shutdown Threshold
IROUT
0.8
1.3
0.4
V
V
30
µA
Reverse Leakage
into OUT pin
VOUT = 5V, Shutdown mode (Note 2)
15
ISC
Short-circuit Output
VOUT = 0V
80
mA
TSD
Thermal Shutdown
160
°C
THYST
Thermal Hysteresis
20
°C
Note 1: ROL = (2VIN - VOUT)/IOUT
Note 2: In the event of a controlled shutdown, the output will be isolated from the input, but will remain connected to the internal resistor
feedback network. This will cause a small level of reverse current to flow back into the device to ground.
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
3
Doc No. 5002, Rev. K
CAT3200/3200-5
TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200-5)
TAMB=25°C, CIN=COUT=CFLY=1µF, VIN=3.3V unless specified otherwise.
Ground Current vs. Supply Voltage (No Load)
2.2
1.2
1.1
GROUND CURRENT [mA]
SHUTDOWN THRESHOLD [V] .
Shutdown Input Threshold vs. Supply Voltage
1.0
0.9
0.8
0.7
0.6
0.5
2.0
1.8
1.6
1.4
1.2
0.4
2.7
3.0
3.3
3.6
3.9
4.2
INPUT VOLTAGE [V]
2.7
4.5
Line Regulation
4.2
4.5
5.2
OUTPUT VOLTAGE [V] .
OUTPUT VOLTAGE [V] .
3.3
3.6
3.9
INPUT VOLTAGE [V]
Load Regulation
5.2
5.1
20mA Load
5.0
100mA Load
4.9
5.1
VIN = 3.2V
5.0
VIN = 3V
4.9
VIN = 2.7V
4.8
4.8
2.7
3.0
3.3
3.6
3.9
INPUT VOLTAGE [V]
4.2
0
4.5
Oscillator Frequency vs. Supply Voltage
50
100
LOAD CURRENT [mA]
Efficiency
2.6
150
vs. Load Current
100
VIN= 2.7V
90
2.4
EFFICIENCY [%]
OSCILLATOR FREQUENCY [MHz]
3.0
2.2
2.0
VIN= 3.2V
80
VIN= 3.7V
70
60
50
VIN= 4.5V
1.8
40
1.6
30
2.7
Doc. No. 5002, Rev. K
3.0
3.3
3.6
3.9
INPUT VOLTAGE [V]
4.2
4.5
1
10
100
LOAD CURRENT [mA]
4
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT3200/3200-5
TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200-5)
TAMB=25°C, CIN=COUT=CFLY=1µF, VIN=3.3V unless specified otherwise.
Soft Start Power Up (90mA Load, 3.3V Input)
Load Step Response (3.3V Input)
Short Circuit Current vs Supply Voltage
Output Ripple (100mA Load, 3.3V Input)
CURRENT LIMIT [mA] .
250
200
150
100
50
0
2.7
3.3
3.6
3.9
4.2
INPUT VOLTAGE [V]
4.5
Oscillator Frequency Change vs. Temperature
4
2
FREQUENCY CHANGE [%] .
OUTPUT VOLTAGE CHANGE [%] .
Output Voltage Change vs. Temperature
3.0
1
10mA Load
0
-1
-2
-40
-20
0
20
40
60
80
100
0
-2
-4
-40
TEMPERATURE [ C]
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
2
5
-20
0
20
40
60
TEMPERATURE [ C]
80
100
Doc No. 5002, Rev. K
CAT3200/3200-5
BLOCK DIAGRAM
CNEG CPOS
CNEG CPOS
2MHz
Voltage
Doubler
IN
2VIN
2MHz
Voltage
Doubler
IN
2VIN
SHDN
SHDN
1.25V
+
—
EN
5V/100mA
1.25V
OUT
FB
+
—
5V
100k
SGND
EN
300k
100mA
OUT
GND
PGND
CAT3200 Adjustable Output
CAT3200-5 5V Fixed Output
PIN FUNCTIONS
IN is the power supply. During normal operation the
device draws a supply current which is almost constant.
A very brief interval of non-conduction will occur at the
switching frequency. The duration of the non-conduction
interval is set by the internal non-overlapping
“break-before-make” timing. IN should be bypassed
with a 1µF to 4.7µF low ESR (Equivalent Series
Resistance) ceramic capacitor.
resistor network (400kΩ). The feedback network will
result in a reverse current of 10µA to 20µA to flow back
through the device to ground.
Whenever the device is taken out of shutdown mode, the
output voltage will experience a slew rate controlled
power-up. Full operating voltage is typically achieved in
less than 0.5 msec.
For filtering, a low ESR ceramic bypass capacitor (1µF)
in close proximity to the IN pin prevents noise from being
injected back into the power supply.
GND is the ground reference for all voltages on CAT32005 devices.
SHDN is the logic control input (Active LOW) that places
the device into shutdown mode. The internal logic is
CMOS and the pin does not use an internal pull-down
resistor. The SHDN pin should not be allowed to float.
FB (CAT3200 Only) is the feedback input pin. An output
divider should be connected from OUT to FB to program
the output voltage.
CPOS, CNEG are the positive and negative connections
respectively for the charge pump flying capacitor. A low
ESR ceramic capacitor (1µF) should be connected
between these pins. During initial power-up it may be
possible for the capacitor to experience a voltage reversal
and for this reason, avoid using a polarized (tantalum or
aluminum) flying capacitor.
PGND (CAT3200 Only). Is the same as GND for the
CAT3200-5 except for the internal reference connection
to SGND.
SGND (CAT3200 Only) Ground pin for the internal
reference. The CNEG connection is switched to this pin
during the normal charge pump operation.
OUT is the regulated output voltage to power the load.
During normal operation, the device will deliver a train of
current pulses to the pin at a frequency of 2MHz.
Adequate filtering on the pin can typically be achieved
through the use a low ESR ceramic bypass capacitor
(1µF to 4.7µF) in close proximity to the OUT pin. The
ESR of the output capacitor will directly influence the
output ripple voltage.
When the shutdown mode is entered, the output is
immediately isolated from the input supply, however, the
output will remain connected to the internal feedback
Doc. No. 5002, Rev. K
6
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT3200/3200-5
DEVICE OPERATION
Typical values for total voltage divider resistance can
range from several kΩs up to 1MΩ.
The CAT3200/CAT3200-5 use a switched capacitor
charge pump to boost the voltage at IN to a regulated
output voltage. Regulation is achieved by sensing the
output voltage through an internal resistor divider
(CAT3200-5) and modulating the charge pump output
current based on the error signal. A 2-phase nonoverlapping clock activates the charge pump switches.
The flying capacitor is charged from the IN voltage on the
first phase of the clock. On the second phase of the clock
it is stacked in series with the input voltage and connected
to OUT. The charging and discharging the flying capacitor
continues at a free running frequency of typically 2MHz.
1
3
CPOS CNEG
2
IN
OUT
VOUT
8
R1
FB
6
In shutdown mode all circuitry is turned off and the
CAT3200/CAT3200-5 draw only leakage current from
the VIN supply. OUT is disconnected from IN. The SHDN
pin is a CMOS input with a threshold voltage of
approximately 0.8V. The CAT3200/CAT3200-5 is in
shutdown when a logic LOW is applied to the SHDN pin.
The SHDN pin is a high impedance CMOS input. SHDN
does not have an internal pull-down resistor and should
not be allowed to float and. It must always be driven with
a valid logic level.
SHDN
7
PGND
4
SGND
5
1.27V
(
)
1 + R1
R2
COUT
R2
Figure 1: Programming the Adjustable CAT3200
Short-Circuit and Thermal Protection
The CAT3200 and CAT3200-5 have built-in short-circuit
current limiting and over temperature protection. During
overload conditions, output current is limited to
approximately 225mA. At higher temperatures, or if the
input voltage is high enough to cause excessive chip self
heating, the thermal shutdown circuit shuts down the
charge pump as the junction temperature exceeds
approximately 160°C. Once the junction temperature
drops back to approximately 140°C, the charge pump is
enabled. The CAT3200and CAT3200-5 will cycle in and
out of thermal shutdown indefinitely without latch-up or
damage until a short-circuit on OUT is removed.
Programming the CAT3200 Output Voltage (FB Pin)
The CAT3200-5 version has an internal resistive divider
to program the output voltage. The programmable
CAT3200 may be set to an arbitrary voltage via an
external resistive divider. Since it employs a voltage
doubling charge pump, it is not possible to achieve
output voltages greater than twice the available input
voltage. Figure 1 shows the required voltage divider
connection. The voltage divider ratio is given by the
formula:
R1
VOUT
=
−1
R2 1.27V
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
7
Doc No. 5002, Rev. K
CAT3200/3200-5
APPLICATION INFORMATION
The overall junction to ambient thermal resistance (θJA)
for device power dissipation (PD) consists primarily of
two paths in series. The first path is the junction to the
case (θJC) which is defined by the package style, and the
second path is case to ambient (θCA) thermal resistance
which is dependent on board layout. The final operating
junction temperature for any set of conditions can be
estimated by the following thermal equation:
Ceramic Capacitors
Ceramic capacitors of different dielectric materials lose
their capacitance with higher temperature and voltage at
different rates. For example, a capacitor made of X5R or
X7R material will retain most of its capacitance from –
40°C to 85°C whereas a Z5U or Y5V style capacitor will
lose considerable capacitance over that range.
TJUNC = TAMB + PD (Θ JC ) + PD (Θ CA )
Z5U and Y5V capacitors may also have voltage coefficient
causing them to lose 60% or more of their capacitance
when the rated voltage is applied. When comparing
different capacitors it is often useful consider the amount
of achievable capacitance for a given case size rather
than discussing the specified capacitance value. For
example, over rated voltage and temperature conditions,
a 1µF, 10V, Y5V ceramic capacitor in an 0603 case may
not provide any more capacitance than a 0.22µF, 10V,
X7R available in the same 0603 case. For many
CAT3200/CAT3200-5 applications these capacitors can
be considered roughly equivalent.
= TAMB + PD (Θ JA )
The CAT3200 in SOT23 package, when mounted on
printed circuit board with two square inches of copper
allocated for “heat spreading”, will result with an overall
θJA of less than 150°C/W.
For a typical application operating from a 3.8V input
supply, the maximum power dissipation is 260mW
(100mA x 3V). This would result if a maximum junction
temperature of :
The capacitor manufacturer’s data sheet should be
consulted to determine what value of capacitor is needed
to ensure the desired capacitance at all temperatures
and voltages. Below is a list of ceramic capacitor
manufacturers and how to contact them:
Capacitor
Manufacturer Web
Phone
Murata
www.murata.com
814.237.1431
AVX/Kemet
www.avxcorp.com
843.448.9411
Vishay
www.vishay.com
Kemet
www.kemet.com
408.986.0424
Taiyo Yuden
www.t-yuden.com
408.573.4150
TJUNC = TAMB + PD (θJA)
= 85°C + 0.26W (150°C/W)
= 85°C + 39°C = 124°C
The use of multi-layer board construction with power
planes will further enhance the overall thermal
performance. In the event of no dedicated copper area
being used for heat spreading, a multi-layer board will
typically provide the CAT3200 with an overall θJA of
200°C/W. This level of thermal conduction would allow
up to 200mW be safely dissipated within the device.
Thermal Management
For higher input voltages and maximum output current
there can be substantial power dissipation in the
CAT3200/CAT3200-5. If the junction temperature
increases to 160°C, the thermal shutdown circuitry will
automatically turn off the output.
A good thermal connection to the PC board is
recommended to reduce the chip temperature.
Connecting the GND pin (Pins 4/5 for CAT3200, Pin 2 for
CAT3200-5) to a ground plane, and maintaining a solid
ground plane under the device reduces the overall
thermal resistance.
Doc. No. 5002, Rev. K
8
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT3200/3200-5
TYPICAL APPLICATIONS
3.3 V Supply to 5 V
4
5
USB Port to Regulated 5V Power Supply
6
IN
OUT
4
1
5
6
IN
OUT
1
3.3 V + 10%
3
SHDN
3
VOUT
5V + 4%
100mA
CAT3200-5
SHDN
VOUT
5V + 4%
CAT3200-5
GND
2
GND
2
Lithium-Ion Battery to 5V White or Blue LED Driver
4
C5
6
C+
OUT
IN
3V to 4.4V +
Li-ion
Battery
Drive up to 5 LEDs
1
100Ω
CAT3200-5
3
ON OFF
Apply PWM Waveform for
Adjustable Brightness Control
SHDN
SGND
100Ω
100Ω
100Ω
100Ω
2
VSHDN
t
White or Blue LED Driver with LED Current Control
1
C+
2
3
C-
IN
3V to 4.4V +
Li-ion
Battery
OUT
CAT3200
FB
PGND
ON OFF
Apply PWM Waveform for
Adjustable Brightness Control
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
6
SHDN
VSHDN
SGND
Up to 6 LEDs
8
7
5
82Ω
4
82Ω
82Ω
82Ω
82Ω
t
9
Doc No. 5002, Rev. K
CAT3200/3200-5
MECHANICAL PACKAGE DRAWINGS
3
6-LEAD THIN
SOT-23
4
aaa C 2X
D
H
e1
A
B
D
5
N/2
+1
N
B
VIEW A-A
SEE VIEW C
E/2
E1/2
3
R1
E1
4
E
R
GAUGE
PLANE
L2
aaa C D
L
SEATING
C PLANE
2X
(L1)
1
2
N/2
bbb C
2X N/2 TIPS
e
5
B
NX b
ddd
M
VIEW C
(b)
WITH METAL
b1
CA BD
c
c1
BASE METAL
SECTION B - B
b 5
8
7
A
5
e/2
X
X=A &/or B
A
X
X=A &/or B
ODD LEAD SIDES
TOP VIEW
A2
ccc C
NX
A1
EVEN LEAD SIDES
TOP VIEW
SEATING
C PLANE
A
All Dimensions are in Millimeters
4.
5.
6.
7.
8.
Min
Nom
Max
A
—
—
1.00
aaa
A1
0.01
0.05
0.10
bbb
0.25
1,2
A2
0.84
0.87
0.90
ccc
0.10
1,2
c
0.12
0.15
0.20
7
c1
0.08
0.13
0.16
7
D
2.80
2.90
3.00
3,4
Min
Nom
Max
Min
Nom
Max
Min
Nom
Max
Notes
E
2.60
2.80
3.00
3,4
b
0.30
—
0.45
0.30
—
0.45
0.22
—
0.36
7,8
3,4
b1
0.31
0.35
0.39
0.31
0.35
0.39
0.22
0.26
0.30
E1
1.50
1.60
1.75
L
0.30
0.40
0.50
Notes
Tolerances of Form and Position
Notes
0.15
1,2
Variations
AA
6 AB
BA
e
0.95BSC
0.95BSC
0.65BSC
L1
0.60REF
e1
1.90BSC
1.90BSC
1.95BSC
L2
0.25BSC
N
6
5
8
R
0.10
—
—
R1
0.10
—
0.25
Tolerances of Form and Position
ddd
0.20
0.20
0.13
1,2
Notes:
θ
0°
4°
8°
1. Dimensions and tolerancing per ASME Y14.5M - 1994
2. Dimension are in mm.
θ1
4°
10°
12°
3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.15mm per side. D and E1 dimensions are determined at Datum H.
The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, the bar
burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. D and E1 dimensions are determined at Datum H.
Datums A & B to be determined at Datum H.
Package varation "AB" is a 5 lead version of the 6 lead variation "AA" where lead #5 has been removed from the 6 lead "AA" variation.
These dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip.
Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition. The dambar
cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07mm.
Doc. No. 5002, Rev. K
10
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT3200/3200-5
MECHANICAL PACKAGE DRAWINGS
8-LEAD MSOP
0.38
0.28
0.0150
0.0110
0.1970
0.1890
5.00
4.80
S
0.0256 [0.65] BSC
0.1220
0.1142
3.10
2.90
0.0374
0.0295
0.0433 [1.10] MAX.
0.039 [0.10] MAX.
S
0.0059
0.0020
0.15
0.05
0.95
0.75
S
0.0150
0.0110
0.38
0.28
WITH PLATING
0.0276
0.0157
0.70
0.40
0.1220
0.1142
3.10
2.90
0.0091
0.0051
0.23
0.13
0.0050 [0.127]
0˚ - 6˚
WITH
PLATING
BASE METAL
0.0118 [0.30] REF.
SECTION A - A
Notes:
(1) All dimensions are in mm Angles in degrees.
2 Does not include Mold Flash, Protrusion or Gate Burrs. Mold Flash, Protrusions or Gate Burrs shall not exceed 0.15 mm. per side.
3 Does not include Interlead Flash orProtrusion. Interlead Flash or Protrusion shall not exceed 0.25 mm per side.
4 Does not include Dambar Protrusion, allowable Dambar Protrusion shall be 0.08 mm.
(5) This part is compliant with JEDEC Specification MO-187 Variations AA.
(6) Lead span/stand off height/coplanarity are considered as special characteristics. (S)
(7) Controlling dimensions in inches. [mm]
© 2005 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
11
Doc No. 5002, Rev. K
REVISION HISTORY
Date
Rev.
Reason
06/17/2004
A
Initial Release
09/3/2004
B
Update Ordering Information
09/23/2004
C
Minor change
10/26/2004
D
Removed TDFN package, minor changes
10/29/2004
E
Added Green Packages
02/1/2005
F
Update 6-lead SOT-23 mechanical package drawing
02/28/2005
G
Update Ordering Information
03/18/2005
H
Update Ordering Information
09/22/2005
I
Update Ordering Information
01/11/2006
J
Update Ordering Information
08/01/2006
K
Change MSOP Tape&Reel
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K
08/01/06
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