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CAT3637AEVB

CAT3637AEVB

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    -

  • 描述:

    BOARD EVALUATION FOR DPP

  • 数据手册
  • 价格&库存
CAT3637AEVB 数据手册
CAT3637 6-Channel Programmable High Efficiency LED Driver Description Applications • • • • LCD Display Backlight Cellular Phones Digital Still Cameras Handheld Devices NC NC GND EN/SET 1 LED6 C2− LED5 C2+ LED4 C1− LED3 C1+ VIN High Efficiency 1.33x Charge Pump Charge Pump: 1x, 1.33x, 1.5x, 2x Drives 6 LEDs Between 30 mA and 0 mA Each 1−wire EZDimt Interface with 2 mA Step Power Efficiency up to 92% Low Noise Input Ripple in All Modes “Zero” Current Shutdown Mode Soft Start and Current Limiting Short Circuit Protection Thermal Shutdown Protection Tiny 3 mm x 3 mm, 16−pad TQFN Package These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant PIN CONNECTIONS VOUT • • • • • • • • • • • • TQFN−16 HV3 SUFFIX CASE 510AD LED1 Features http://onsemi.com LED2 The CAT3637 is a high efficiency fractional charge pump that can drive up to six LEDs programmable by a 1−wire digital interface. The inclusion of a 1.33x fractional charge pump mode increases device efficiency by up to 10% over traditional 1.5x charge pumps with no added external capacitors. Low noise input ripple is achieved by operating at a constant switching frequency which allows the use of small external ceramic capacitors. The multi−fractional charge pump supports a wide range of input voltages from 2.5 V to 5.5 V. The EN/SET logic input functions as a chip enable and a digital programming interface for setting the current in the LED channels. The 1−wire pulse−programming interface supports 15 linear steps from zero current to 30 mA full−brightness in 2 mA steps. The device is available in a tiny 16−pad TQFN 3 x 3 mm package with a maximum height of 0.8 mm. ON Semiconductor’s 1.33x, charge pump switching architecture is patented. (Top View) MARKING DIAGRAM JAAM AXXX YWW JAAM = CAT3637HV3−GT2 A = Assembly Location XXX = Last Three Digits of Assembly Lot Number Y = Production Year (Last Digit) WW = Production Week (Two Digits) ORDERING INFORMATION Device Package Shipping† CAT3637HV3−GT2 (Note 1) TQFN−16 (Pb−Free) 2000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1. NiPdAu Plated Finish (RoHS−compliant). © Semiconductor Components Industries, LLC, 2014 August, 2014 − Rev. 4 1 Publication Order Number: CAT3637/D CAT3637 1 mF VIN 2.5 V to 5.5 V CIN C1− C1+ C2− C2+ VIN VOUT 1 mF 1−Wire Programming 1 mF CAT3637 EN/SET GND VOUT LED1 LED2 LED3 LED4 LED5 LED6 COUT 1 mF Figure 1. Typical Application Circuit Table 1. ABSOLUTE MAXIMUM RATINGS Parameter VIN, LEDx, C1±, C2± voltage VOUT Voltage Rating Unit 6 V 7 V EN/SET Voltage VIN + 0.7 V V Storage Temperature Range −65 to +160 _C Junction Temperature Range (Note 2) −40 to +150 _C 300 _C Lead Temperature Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 2. RECOMMENDED OPERATING CONDITIONS Parameter Range Unit VIN 2.5 to 5.5 V Ambient Temperature Range (Note 2) −40 to +85 _C ILED per LED pin 0 to 30 mA Total Output Current 0 to 180 mA Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 2. Package thermal resistance is below 50°C/W when mounted on FR4 board. http://onsemi.com 2 CAT3637 Table 3. ELECTRICAL OPERATING CHARACTERISTICS (over recommended operating conditions unless specified otherwise) VIN = 3.6 V, EN = High, TAMB = 25°C Name Symbol Conditions IQ Quiescent Current 1x mode, VIN = 4.2 V 1.33x mode, VIN = 3.3 V 1.5x mode, VIN = 2.8 V 2x mode, VIN = 2.5 V IQSHDN Shutdown Current VEN = 0 V ILED−ACC LED Current Accuracy 2 mA ≤ ILED ≤ 30 mA ILED−DEV LED Channel Matching Min Typ Max 1.5 2.8 3.7 3.8 mA 1 I LED * I LEDAVG Units mA ±3 % ±1 % 0.5 3.5 3.5 6 W I LEDAVG ROUT Output Resistance (open loop) 1x mode, IOUT = 120 mA 1.33x mode, IOUT = 120 mA 1.5x mode, IOUT = 120 mA 2x mode, IOUT = 120 mA FOSC Charge Pump Frequency 1.33x and 2x mode 1.5x mode Output short circuit Current Limit VOUT < 0.5 V ISC_MAX LEDTH VHYS TDF 0.6 0.8 1x to 1.33x or 1.33x to 1.5x or 1.5x to 2x Transition Thresholds at any LEDx pin 1.33x to 1x Transition Hysteresis VIN − Highest LED VF Mode Transition Filter Delay IIN_MAX Input Current Limit REN/DIM VHI VLO EN/DIM Pin − Internal Pull−down Resistor − Logic High Level − Logic Low Level VOUT > 1 V 0.8 1.1 1.1 1.4 MHz 80 mA 150 mV 400 mV 120 ms 450 mA 100 kW V V 1.3 0.4 TSD Thermal Shutdown 150 °C THYS Thermal Hysteresis 20 °C VUVLO Undervoltage lockout (UVLO) threshold 2 V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. NOTE: Typical application circuit with external components is shown on page 2. http://onsemi.com 3 CAT3637 Table 4. RECOMMENDED EN/SET TIMING (For 2.5 ≤ VIN ≤ 5.5 V, over full ambient temperature range −40° to +85°C.) Name Symbol Conditions Min Typ Max Units 100 ms TLO EN/SET program low time 0.2 THI EN/SET program high time 0.2 ms EN/SET low time to shutdown 1.5 ms TOFF TD LED current settling time 10 ms THI EN/SET TLO TD LED Current Shutdown 0 mA TOFF 28 mA 2 mA 4 mA 30 mA 6 mA 0 mA 2 mA Figure 2. EN/SET One Wire Addressable Timing Diagram http://onsemi.com 4 Shutdown CAT3637 TYPICAL PERFORMANCE CHARACTERISTICS (VIN = 3.6 V, IOUT = 120 mA (6 LEDs at 20 mA), CIN = COUT = C1 = C2 = 1 mF, TAMB = 25°C unless otherwise specified.) 100 100 VF = 3.3 V VF = 3.3 V 1.33x 1.5x 1x 80 2x 70 60 80 70 60 4.5 4.0 3.5 3.0 2.5 40 2.0 4.0 3.8 3.6 3.4 3.2 INPUT VOLTAGE (V) Figure 3. Efficiency vs. Input Voltage Figure 4. Efficiency vs. Li−Ion Voltage 3.0 10 8 LED CURRENT VARIATION (%) VF = 3.3 V 6 4 2 0 −2 −4 −6 5.5 5.0 4.5 4.0 3.5 3.0 2.5 8 6 4 2 0 −2 −4 −6 −8 −10 −40 −20 0 20 40 60 INPUT VOLTAGE (V) TEMPERATURE (°C) Figure 5. LED Current Change vs. Input Voltage Figure 6. LED Current Change vs. Temperature 6 QUIESCENT CURRENT (mA) LED CURRENT VARIATION (%) 4.2 INPUT VOLTAGE (V) 10 −8 −10 Traditional 1.5x Charge Pump 50 50 40 VF = 3.0 V 90 EFFICIENCY (%) EFFICIENCY (%) 90 VF = 3.3 V 5 4 3 2 1 0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 INPUT VOLTAGE (V) Figure 7. Quiescent Current vs. Input Voltage http://onsemi.com 5 2.0 80 CAT3637 TYPICAL PERFORMANCE CHARACTERISTICS (VIN = 3.6 V, IOUT = 120 mA (6 LEDs at 20 mA), CIN = COUT = C1 = C2 = 1 mF, TAMB = 25°C unless otherwise specified.) 10 VF = 3.3 V 1.1 OUTPUT RESISTANCE (W) SWITCHING FREQUENCY (MHz) 1.2 1.5x Mode 1.0 0.9 0.8 1.33x, 2x Mode 0.7 0.6 −40 −20 0 20 40 60 8 6 1.33x 1.5x 4 2 0 80 2x 1x 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 TEMPERATURE (°C) INPUT VOLTAGE (V) Figure 8. Switching Frequency vs. Temperature Figure 9. Output Resistance vs. Input Voltage Figure 10. Power Up in 1x Mode Figure 11. Power Up in 1.33x Mode Figure 12. Power Up in 1.5x Mode Figure 13. Power Up in 2x Mode http://onsemi.com 6 CAT3637 TYPICAL PERFORMANCE CHARACTERISTICS (VIN = 3.6 V, IOUT = 120 mA (6 LEDs at 20 mA), CIN = COUT = C1 = C2 = 1 mF, TAMB = 25°C unless otherwise specified.) Figure 14. Power Up Delay (1x Mode) Figure 15. Power Down Delay (1x Mode) Figure 16. Operating Waveforms in 1x Mode Figure 17. Switching Waveforms in 1.33x Mode Figure 18. Switching Waveforms in 1.5x Mode Figure 19. Switching Waveforms in 2x Mode http://onsemi.com 7 CAT3637 TYPICAL PERFORMANCE CHARACTERISTICS (VIN = 3.6 V, IOUT = 120 mA (6 LEDs at 20 mA), CIN = COUT = C1 = C2 = 1 mF, TAMB = 25°C unless otherwise specified.) 4.0 OUTPUT VOLTAGE (V) 3.5 3.0 2.5 1x Mode 2.0 1.5 1.0 0.5 0 0 100 200 300 400 500 OUTPUT CURRENT (mA) Figure 20. Foldback Current Limit Figure 21. LED Brightness Levels Figure 22. LED Settling Time http://onsemi.com 8 CAT3637 Table 5. PIN DESCRIPTION Pin # Name Function 1 LED6 LED6 cathode terminal 2 LED5 LED5 cathode terminal 3 LED4 LED4 cathode terminal 4 LED3 LED3 cathode terminal 5 LED2 LED2 cathode terminal 6 LED1 LED1 cathode terminal 7 VOUT Charge pump output, connect to LED anodes 8 VIN Charge pump input, connect to battery or supply 9 C1+ Bucket capacitor 1, positive terminal 10 C1− Bucket capacitor 1, negative terminal 11 C2+ Bucket capacitor 2, positive terminal 12 C2− Bucket capacitor 2, negative terminal 13/14 NC No connect 15 GND 16 EN/SET TAB TAB Ground reference Device enable (active high) and 1 wire control input Connect to GND on the PCB Pin Function VIN is the supply pin for the charge pump. A small 1 mF ceramic bypass capacitor is required between the VIN pin and ground near the device. The operating input voltage range is from 2.5 V to 5.5 V. Whenever the input supply falls below the under−voltage threshold (2 V) all the LED channels will be automatically disabled and the device register are reset to default values. EN/SET is the enable and one wire addressable control logic input for all LED channels. Guaranteed levels of logic high and logic low are set at 1.3 V and 0.4 V respectively. When EN/SET is initially taken high, the device becomes enabled and all LED currents remain at 0 mA. To place the device into zero current mode, the EN/SET pin must be held low for more than 1.5 ms. VOUT is the charge pump output that is connected to the LED anodes. A small 1 mF ceramic bypass capacitor is required between the VOUT pin and ground near the device. GND is the ground reference for the charge pump. The pin must be connected to the ground plane on the PCB. C1+, C1− are connected to each side of the ceramic bucket capacitor C1. C2+, C2− are connected to each side of the ceramic bucket capacitor C2. LED1 to LED6 provide the internal regulated current for each of the LED cathodes. These pins enter high−impedance zero current state whenever the device is placed in shutdown mode. TAB is the exposed pad underneath the package. For best thermal performance, the tab should be soldered to the PCB and connected to the ground plane. http://onsemi.com 9 CAT3637 Simplified Block Diagram C1− VIN C1+ C2− C2+ VOUT 1x mode (LDO) 1.33x, 1.5x, 2x Charge Pump 0.8, 1.1 MHz Oscillator EN/SET Mode Control LED1 LED2 LED3 LED4 100 kΩ Serial Interface Reference Voltage Registers Current Setting DAC LED5 LED6 6 Current Regulators GND Figure 23. CAT3637 Functional Block Diagram Basic Operation At power−up, the CAT3637 starts operating in 1x mode where the output will be approximately equal to the input supply voltage (less any internal voltage losses). If the output voltage is sufficient to regulate all LED currents, the device remains in 1x operating mode. If the output voltage is insufficient or falls to a level where the regulated current cannot be maintained, the device automatically switches into 1.33x mode (after a fixed delay time of about 120 ms). In 1.33x mode, the output voltage is approximately equal to 1.33 times the input supply voltage (less any internal voltage losses). If the output voltage is still insufficient or falls to a level where the regulated currents cannot be maintained, the device will automatically switch to the 1.5x mode (after a fixed delay time of about 400 ms). In 1.5x mode, the output is approximately equal to 1.5 times the input supply voltage (less any internal voltage losses). If the output voltage is still insufficient to drive the LEDs, it will automatically switch into 2x mode where the output is approximately equal to 2 times the input supply voltage (less any internal voltage losses). If the device detects a sufficient output voltage to drive all LED currents in 1x mode, it will revert back to 1x mode. This only applies for changing back to the 1x mode. http://onsemi.com 10 CAT3637 LED Current Setting The current in each of the six LED channels is programmed through the 1−wire EN/SET digital control input. At the initial power−up and once the EN/SET is set high, the LED current remains at zero in all channels. On the first EN/SET pulse (positive edge), the current is set to 2 mA in all channels. On each consecutive pulse, the current is incremented by 2 mA. On the 15th pulse, the current is equal to the full scale of 30 mA. On the following pulse (16th pulse), the current goes back to zero and the previous sequence can be repeated. The EN/SET pin can be pulsed at high frequency 15 times to decrement the current by 2 mA or to program the current from 0 mA to 30 mA. The maximum EN/SET signal frequency for programming the LED current is 2.5 MHz. To power−down the device and turn−off all current sources, the EN/SET input should be kept low for a duration TOFF of 1.5 ms or more. The driver typically powers−down with a delay of about 1 ms. THI EN/SET TLO TD LED Current Shutdown 0 mA TOFF 28 mA 30 mA 2 mA 4 mA 6 mA 0 mA 2 mA Figure 24. EN/SET One Wire Addressable Timing Diagram Figure 25. EN/SET Program Increasing / Decreasing LED Current by 2 mA http://onsemi.com 11 Shutdown CAT3637 Unused LED Channels VOUT, then the channel is switched off and a 200 mA test current is placed in the channel to sense when the channel moves below VOUT – 1 V. For applications with 5 LEDs or less, unused LEDs can be disabled by connecting the LED pin directly to VOUT, as shown on Figure 26. If LED pin voltage is within 1 V of 1 mF 2.5 V to 5.5 V VIN CIN 1 mF 1−Wire Programming 1 mF C1− C1+ C2− C2+ VIN VOUT CAT3637 EN/SET GND VOUT COUT LED1 LED2 LED3 LED4 LED5 LED6 1 mF Figure 26. Five LED Application Protection Mode Recommended Layout If an LED is disconnected, the output voltage VOUT automatically limits at about 5.5 V. This is to prevent the output pin from exceeding its absolute maximum rating. If the die temperature exceeds +150°C the driver will enter a thermal protection shutdown mode. When the device temperature drops by about 20°C the device will resume normal operation. In charge pump mode, the driver switches internally at a high frequency. It is recommended to minimize trace length to all four capacitors. A ground plane should cover the area under the driver IC as well as the bypass capacitors. Short connection to ground on capacitors CIN and COUT can be implemented with the use of multiple via. A copper area matching the TQFN exposed pad (TAB) must be connected to the ground plane underneath. The use of multiple via improves the package heat dissipation. LED Selection LEDs with forward voltages (VF) ranging from 1.3 V to 5.0 V may be used with the CAT3637. Selecting LEDs with lower VF is recommended in order to improve the efficiency by keeping the driver in 1x mode longer as the battery voltage decreases. For example, if a white LED with a VF of 3.3 V is selected over one with VF of 3.5 V, the CAT3637 will stay in 1x mode for lower supply voltage of 0.2 V. This helps improve the efficiency and extends battery life. External Components The driver requires two external 1 mF ceramic capacitors for decoupling input, output, and for the charge pump. Both capacitors type X5R and X7R are recommended for the LED driver application. In all charge pump modes, the input current ripple is kept very low by design and an input bypass capacitor of 1 mF is sufficient. In 1x mode, the device operates in linear mode and does not introduce switching noise back onto the supply. Figure 27. Recommended Layout http://onsemi.com 12 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TQFN16, 3x3 CASE 510AD−01 ISSUE A DATE 19 MAR 2008 A D e b L E2 E PIN#1 ID PIN#1 INDEX AREA A1 TOP VIEW SYMBOL MIN SIDE VIEW NOM A 0.70 0.75 0.80 0.00 0.02 0.05 0.20 REF b 0.18 0.25 0.30 D 2.90 3.00 3.10 D2 1.40 −−− 1.80 E 2.90 3.00 3.10 E2 1.40 −−− 1.80 e L BOTTOM VIEW MAX A1 A3 D2 A A3 A1 FRONT VIEW 0.50 BSC 0.30 0.40 0.50 Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC MO-220. DOCUMENT NUMBER: DESCRIPTION: 98AON34373E TQFN16, 3X3 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
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