CAT3643
3-Channel Ultra High
Efficiency LED Driver
Description
The CAT3643 is a high efficiency fractional charge pump that can
drive up to three LEDs programmable by a one wire digital interface.
The inclusion of a 1.33x fractional charge pump mode increases
device efficiency by up to 10% over traditional 1.5x charge pumps
with no added external capacitors.
Low noise input ripple is achieved by operating at a constant
switching frequency which allows the use of small external ceramic
capacitors. The multi−fractional charge pump supports a wide range of
input voltages from 2.4 V to 5.5 V.
The EN/DIM logic input functions as a chip enable and a digital
dimming interface for current setting of all LEDs. Six different current
ratios are available via the interface.
The device is available in the 16−pad TQFN or 12−pad TDFN 3 mm
x 3 mm package with a max height of 0.8 mm.
ON Semiconductor’s 1.33x charge pump switching architecture is
patented.
Features
•
•
•
•
•
•
•
•
•
•
•
•
High Efficiency 1.33x Charge Pump
Charge Pump: 1x, 1.33x, 1.5x, 2x
Drives up to 3 LEDs at 32 mA Each
1−wire EZDim LED Current Programming
Power Efficiency up to 92%
Low Noise Input Ripple in All Modes
“Zero” Current Shutdown Mode
Soft Start and Current Limiting
Short Circuit Protection
Thermal Shutdown Protection
12−pad TDFN and 16−pad TQFN Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
•
•
•
•
LCD Display Backlight
Cellular Phones
Digital Still Cameras
Handheld Devices
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TDFN−12
HV2 SUFFIX
CASE 511AN
TQFN−16
HV3 SUFFIX
CASE 510AD
MARKING DIAGRAMS
HABF
HABG
CAT3643HV2−T2
CAT3643HV2−GT2
JAAE
JAAF
CAT3643HV3−T2
CAT3643HV3−GT2
ORDERING INFORMATION
Device
Package
Shipping†
CAT3643HV2−T2
(Note 1)
TDFN−12
(Pb−Free)
2000 /
Tape & Reel
CAT3643HV2−GT2
(Note 2)
TDFN−12
(Pb−Free)
2000 /
Tape & Reel
CAT3643HV3−T2
(Note 1)
TQFN−16
(Pb−Free)
2000 /
Tape & Reel
CAT3643HV3−GT2
(Note 2)
TQFN−16
(Pb−Free)
2000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. Matte−Tin Plated Finish (RoHS−compliant).
2. NiPdAu Plated Finish (RoHS−compliant).
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 7
1
Publication Order Number:
CAT3643/D
CAT3643
1 mF
C1+
VIN
VIN
CIN
2.4 V
to
5.5 V
1 mF
C1− C2+
C2−
VOUT
VOUT
COUT
CAT3643
1 mF
1−Wire
EZDimt
Programming
1 mF
EN/DIM
LED1
RSET
LED2
LED3
GND
4.02 kΩ
20 mA
LED1
1
GND
NC
NC
GND
LED1
Figure 1. Typical Application Circuit
1
LED2
C2+
LED2
C2−
NC
C1−
EN/DIM
C1+
RSET
C1+
VOUT
VIN
TDFN−12
VIN
C2+
NC
LED3
C1−
VOUT
C2−
EN/DIM
LED3
RSET
TQFN−16
Figure 2. Pin Configurations (Top Views)
The CAT3643 is offered in three different packages. The 12−pad TDFN 3 mm x 3 mm with a max height of 0.8 mm is
pin−compatible to the ON Semiconductor CAT3603 LED driver. The 16−pad TQFN 3 mm x 3 mm with max height of 0.8 mm
is also offered.
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter
VIN, LEDx, C1±, C2±, EN/DIM, RSET voltage
VOUT voltage
Rating
Unit
6
V
7
V
Storage Temperature Range
−65 to +160
°C
Junction Temperature Range
−40 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 2. RECOMMENDED OPERATING CONDITIONS
Rating
Unit
VIN
Parameter
2.5 to 5.5
V
Ambient Temperature Range
−40 to +85
°C
ILED per LED pin
up to 30
mA
LED Forward Voltage Range
1.3 to 4.3
V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
NOTE: Typical application circuit with external components is shown above.
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2
CAT3643
Table 3. ELECTRICAL OPERATING CHARACTERISTICS
(over recommended operating conditions unless specified otherwise) VIN = 3.6 V, EN = High, TAMB = 25°C.
Symbol
Name
Conditions
IQ
Quiescent Current
1x mode, no load
1.33x mode, no load
1.5x mode, no load
2x mode, no load
IQSHDN
Shutdown Current
VEN = 0 V
ILED−ACC
LED Current Accuracy
(ILEDAVG – INOMINAL) / INOMINAL
RSET = 5 kW
ILED−DEV
LED Channel Matching
(ILED − ILEDAVG) / ILEDAVG
Min
Typ
Max
1.0
1.7
2.2
2.4
mA
1
mA
±2
%
±1.5
%
VRSET
RSET Regulated Voltage
ROUT
Output Resistance (open loop)
1x mode
1.33x mode, VIN = 3 V
1.5x mode, VIN = 2.7 V
2x mode, VIN = 2.4 V
FOSC
Charge Pump Frequency
1.33x and 2x mode
1.5x mode
ISC_MAX
Output short circuit Current Limit
VOUT < 0.5 V
50
mA
IIN_MAX
Input Current Limit
VOUT > 1 V
250
mA
LEDTH
1x to 1.33x or 1.33x to 1.5x or 1.5x to 2x
Transition Thresholds at any LED pin
130
mV
1x Mode Transition Hysteresis
400
mV
Transition Filter Delay
500
ms
100
kW
V
V
VHYS
TDF
REN/DIM
VHI
VLO
0.58
Units
EN/DIM Pin
− Internal Pull−down Resistor
− Logic High Level
− Logic Low Level
0.6
0.62
0.8
5
5
10
0.8
1
1
1.3
V
W
1.3
1.6
1.3
0.4
MHz
TSD
Thermal Shutdown
150
°C
THYS
Thermal Hysteresis
20
°C
VUVLO
Undervoltage lockout (UVLO) threshold
1.6
1.8
2.0
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
CAT3643
Table 4. RECOMMENDED EN/DIM TIMING
(For 2.4 V ≤ VIN ≤ 5.5 V, over full ambient temperature range −40°C to +85°C.)
Name
Symbol
TSETUP
Conditions
Min
Typ
Max
Units
EN/DIM setup from shutdown
10
TLO
EN/DIM program low time
0.2
THI
EN/DIM program high time
0.2
ms
EN/DIM low time to shutdown
1.5
ms
TPWRDWN
TLED
LED current settling time
ms
100
40
TSETUP
ms
TPWRDWN
THI
EN/DIM
TLED
TLO
100%
100%
50%
LED
Current
Shutdown
25%
12.5% 6.25%
3.12%
Figure 3. EN/DIM Digital Dimming Timing Diagram
LED Current Setting
The nominal LED current is set by the external resistor
connected between the RSET pin and ground. Table 5 lists
standard resistor values for several LED current settings.
Table 5. RESISTOR RSET AND LED CURRENT
LED Current (mA)
RSET (kW)
2
40.0
5
15.8
10
7.87
15
5.23
20
4.02
25
3.16
30
2.67
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4
ms
Shutdown
CAT3643
TYPICAL PERFORMANCE CHARACTERISTICS
(VIN = 3.6 V, IOUT = 60 mA (3 LEDs at 20 mA), CIN = COUT = C1 = C2 = 1 mF, TAMB = 25°C unless otherwise specified.)
100
100
1.33x
VF = 3.3 V
1.5x
1x
80
2x
70
60
50
40
4.5
4.0
3.5
3.0
2.5
60
4.2
4.0
3.8
3.6
3.4
3.2
INPUT VOLTAGE (V)
Figure 4. Efficiency vs. Input Voltage
Figure 5. Efficiency vs. Li−Ion Voltage
3.0
4
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
70
INPUT VOLTAGE (V)
3
2
1
LEDs Off
5.5
5.0
4.5
4.0
3.5
3.0
2.5
3
2x
1.5x
1.33x
2
1x
1
0
−40
2.0
0
40
80
120
INPUT VOLTAGE (V)
TEMPERATURE (°C)
Figure 6. Quiescent Current vs. Input Voltage
Figure 7. Quiescent Current vs. Temperature
10
10
VF = 3.3 V
8
LED CURRENT VARIATION (%)
LED CURRENT VARIATION (%)
1.33x
80
40
2.0
VF = 3.3 V
6
4
2
0
−2
−4
−6
−8
−10
1x
50
4
0
VF = 3.3 V
90
EFFICIENCY (%)
EFFICIENCY (%)
90
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
8
VF = 3.3 V
6
4
2
0
−2
−4
−6
−8
−10
−40
0
40
80
INPUT VOLTAGE (V)
TEMPERATURE (°C)
Figure 8. LED Current Change vs. Input
Voltage
Figure 9. LED Current Change vs.
Temperature
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5
120
CAT3643
TYPICAL PERFORMANCE CHARACTERISTICS
(VIN = 3.6 V, IOUT = 60 mA (3 LEDs at 20 mA), CIN = COUT = C1 = C2 = 1 mF, TAMB = 25°C unless otherwise specified.)
12
1.2
OUTPUT RESISTANCE (W)
SWITCHING FREQUENCY (MHz)
1.3
1.5x Mode
1.1
1.0
0.9
1.33x, 2x Mode
0.8
0.7
−40
0
40
80
10
8
6
1.33x
1.5x
4
2
0
120
2x
1x
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
TEMPERATURE (°C)
INPUT VOLTAGE (V)
Figure 10. Switching Frequency vs.
Temperature
Figure 11. Output Resistance vs. Input Voltage
Figure 12. Power Up in 1x Mode
Figure 13. Power Up in 1.33x Mode
Figure 14. Power Up in 1.5x Mode
Figure 15. Power Up in 2x Mode
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CAT3643
TYPICAL PERFORMANCE CHARACTERISTICS
(VIN = 3.6 V, IOUT = 60 mA (3 LEDs at 20 mA), CIN = COUT = C1 = C2 = 1 mF, TAMB = 25°C unless otherwise specified.)
Figure 16. Power Up Delay (1x Mode)
Figure 17. Power Down Delay (1x Mode)
Figure 18. Operating Waveforms in 1x Mode
Figure 19. Switching Waveforms in
1.33x Mode
Figure 20. Switching Waveforms in
1.5x Mode
Figure 21. Switching Waveforms in
2x Mode
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CAT3643
TYPICAL PERFORMANCE CHARACTERISTICS
(VIN = 3.6 V, IOUT = 60 mA (3 LEDs at 20 mA), CIN = COUT = C1 = C2 = 1 mF, TAMB = 25°C unless otherwise specified.)
4.0
40
1x Mode
LED CURRENT (mA)
3.0
2.5
2.0
1.5
1.0
30
20
10
0.5
0
0
100
200
300
0
400
0
50
100
150
200
250
OUTPUT CURRENT (mA)
LED PIN VOLTAGE (mV)
Figure 22. Foldback Current Limit
Figure 23. LED Current vs. LED Pin Voltage
Figure 24. Dimming Waveform
Figure 25. Line Transient Response
300
50
LED CURRENT (mA)
OUTPUT VOLTAGE (V)
3.5
40
30
20
10
0
1
10
RSET RESISTANCE (kW)
Figure 26. Disconnecting a Single LED
Figure 27. LED Current vs. RSET
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100
CAT3643
Table 6. PIN DESCRIPTION
Name
Function
LED1
LED1 cathode terminal.
LED2
LED2 cathode terminal.
LED3
LED3 cathode terminal.
RSET
Connect resistor RSET to set the LED current.
EN/DIM
VOUT
Device enable (active high) and Dimming Control.
Charge pump output connected to the LED anodes.
VIN
Charge pump input, connect to battery or supply.
C1+
Bucket capacitor 1 Positive terminal
C1−
Bucket capacitor 1 Negative terminal
C2+
Bucket capacitor 2 Positive terminal
C2−
Bucket capacitor 2 Negative terminal
GND
Ground Reference
NC
GND
Not connected inside package.
Connect to GND on the PCB.
Pin Function
VIN is the supply pin for the charge pump. A small 1 mF
ceramic bypass capacitor is required between the VIN pin
and ground near the device. The operating input voltage
range is from 2.5 V to 5.5 V. Whenever the input supply falls
below the under−voltage threshold (1.8 V), all the LED
channels are disabled and the device enters shutdown mode.
EN/DIM is the enable and one wire dimming input for all
LED channels. Levels of logic high and logic low are set at
1.3 V and 0.4 V respectively. When EN/DIM is initially
taken high, the device becomes enabled and all LED
currents are set to the full scale according to the resistor
RSET. To place the device into “zero current” shutdown
mode, the EN/DIM pin must be held low for at least 1.5 ms.
VOUT is the charge pump output that is connected to the
LED anodes. A small 1 mF ceramic bypass capacitor is
required between the VOUT pin and ground near the device.
GND is the ground reference for the charge pump. The pin
must be connected to the ground plane on the PCB.
C1+, C1− are connected to each side of the ceramic bucket
capacitor C1.
C2+, C2− are connected to each side of the ceramic bucket
capacitor C2.
LED1, LED2, LED3 provide the internal regulated current
sources for each of the LED cathodes. These pins enter
high−impedance zero current state whenever the device is
placed in shutdown mode.
TAB is the exposed pad underneath the package. For best
thermal performance, the tab should be soldered to the PCB
and connected to the ground plane.
RSET is connected to the resistor (RSET) to set the full scale
current for the LEDs. The voltage at this pin regulated to
0.6 V. The ground side of the external resistor should be star
connected back to the GND of the PCB. In shutdown mode,
RSET becomes high impedance.
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CAT3643
Block Diagram
C1−
VIN
C1+
C2−
C2+
VOUT
1x mode (LDO)
1.33x, 1.5x, 2x Charge Pump
Mode Control
1, 1.3 MHz
Oscillator
EN/DIM
LED1
100 kΩ
LED2
Serial
Interface
Reference
Voltage
Registers
Current
Setting DAC
LED3
LED Channel
Current Regulators
GND
RSET
Figure 28. CAT3643 Functional Block Diagram
Basic Operation
At power−up, the CAT3643 starts operating in 1x mode
where the output will be approximately equal to the input
supply voltage (less any internal voltage losses). If the
output voltage is sufficient to regulate all LED currents, the
device remains in 1x operating mode.
If the input voltage is insufficient or falls to a level where
the regulated currents cannot be maintained, the device
automatically switches into 1.33x mode (after a fixed delay
time of about 400 ms). In 1.33x mode, the output voltage is
approximately equal to 1.33 times the input supply voltage
(less any internal voltage losses).
The above sequence repeats in the 1.33x and 1.5x mode
until the driver enters the 2x mode. In 1.5x mode, the output
voltage is approximately equal to 1.5 times the input supply
voltage. While in 2x mode, the output is approximately
equal to 2 times the input supply voltage.
If the device detects a sufficient input voltage is present to
drive all LED currents in 1x mode, it will change
automatically back to 1x mode. This only applies for
changing back to the 1x mode. The difference between the
input voltage when exiting 1x mode and returning to 1x
mode is called the 1x mode transition hysteresis (VHYS) and
is about 500 mV.
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10
CAT3643
LED Current Selection
input signal, as shown on Figure 29. On each consecutive
pulse rising edge, the LED current is divided by half to 50%,
then 25%, 12.5%, 6.25% and 3.125% dimming levels.
Pulses faster than the minimum TLO may be ignored and
filtered by the device. Pulses longer than the maximum TLO
may shutdown the device.
The LED driver enters a “zero current” shutdown mode if
EN/DIM is held low for 1.5 ms or more.
At power−up, the initial LED current is set to full scale
(100% brightness) by the external resistor RSET as follows:
LED current + 132
0.6 V
R SET
The EN/DIM pin has two primary functions. One function
enables and disables the device. The other function is LED
current dimming with six different levels by pulsing the
THI
TSETUP
TPWRDWN
EN/DIM
TLED
TLO
100%
100%
50%
LED
Current
Shutdown
25%
12.5% 6.25%
3.12%
Shutdown
Figure 29. EN/DIM Digital Dimming Timing Diagram
Table 7. LED CURRENT DIMMING LEVELS
EN/DIM # of Pulses *
RSET Gain
LED Current
EN = High
132
132 x 0.6 V / RSET
1st
66
66 x 0.6 V / RSET
2nd
33
33 x 0.6 V / RSET
3rd
16.5
16.5 x 0.6 V / RSET
4th
8.25
8.25 x 0.6 V / RSET
5th
4.125
4.125 x 0.6 V / RSET
6th
132
132 x 0.6 V / RSET
xth
Device cycling through gain selection
GAIN x 0.6 V / RSET
* The gain is changed on the rising edges of the EN/DIM input.
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CAT3643
Unused LED Channels
LED Selection
For applications not requiring all the channels, it is
recommended the unused LED pins be tied directly to VOUT
(see Figure 30).
LEDs with forward voltages (VF) ranging from 1.3 V to
4.3 V may be used. Selecting LEDs with lower VF is
recommended in order to improve the efficiency by keeping
the driver in 1x mode longer as the battery voltage decreases.
For example, if a white LED with a VF of 3.3 V is selected
over one with VF of 3.5 V, the driver will stay in 1x mode for
lower supply voltage of 0.2 V. This helps improve the
efficiency and extends battery life.
1 mF
C1+
VIN
CIN
C2−
VOUT
VIN
COUT
CAT3643
1 mF
ENABLE
DIMMING
C1− C2+
1 mF
EN/DIM
RSET
GND
RSET
External Components
The driver requires four external 1 mF ceramic capacitors
for decoupling input, output, and for the charge pump. Both
capacitors type X5R and X7R are recommended for the
LED driver application. In all charge pump modes, the input
current ripple is kept very low by design and an input bypass
capacitor of 1 mF is sufficient.
In 1x mode, the device operates in linear mode and does
not introduce switching noise back onto the supply.
1 mF
LED1
LED2
LED3
Figure 30. Application with 2 LEDs
Recommended Layout
In charge pump mode, the driver switches internally at a
high frequency. It is recommended to minimize trace length
to all four capacitors. A ground plane should cover the area
under the driver IC as well as the bypass capacitors. Short
connection to ground on capacitors CIN and COUT can be
implemented with the use of multiple via. A copper area
matching the TQFN exposed pad (TAB) must be connected
to the ground plane underneath. The use of multiple via
improves the package heat dissipation.
Protection Mode
If an LED is disconnected, the driver senses that and
automatically ignores that channel. When all LEDs are
disconnected, the driver goes to 1x mode where the output
is equal to the input voltage.
As soon as the output exceeds about 6 V, the driver resets
itself and reevaluate the mode.
If the die temperature exceeds +150°C, the driver will
enter a thermal protection shutdown mode. When the device
temperature drops by about 20°C, the device will resume
normal operation.
C2
Pin1
RSET
EN/DIM
C1
COUT
CIN
GND
VIN
GND
VOUT
Figure 31. TDFN−12 Recommended Layout
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TQFN16, 3x3
CASE 510AD−01
ISSUE A
DATE 19 MAR 2008
A
D
e
b
L
E2
E
PIN#1 ID
PIN#1 INDEX AREA
A1
TOP VIEW
SYMBOL
MIN
SIDE VIEW
NOM
A
0.70
0.75
0.80
0.00
0.02
0.05
0.20 REF
b
0.18
0.25
0.30
D
2.90
3.00
3.10
D2
1.40
−−−
1.80
E
2.90
3.00
3.10
E2
1.40
−−−
1.80
e
L
BOTTOM VIEW
MAX
A1
A3
D2
A
A3
A1
FRONT VIEW
0.50 BSC
0.30
0.40
0.50
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC MO-220.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34373E
TQFN16, 3X3
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TDFN12, 3x3
CASE 511AN−01
ISSUE A
D
DATE 18 MAR 2009
A
e
b
L
E
E2
PIN#1 ID
PIN#1 INDEX AREA
A1
TOP VIEW
BOTTOM VIEW
SIDE VIEW
SYMBOL
MIN
NOM
MAX
A
0.70
0.75
0.80
A1
0.00
0.02
0.05
A3
0.178
0.203
0.228
b
0.18
0.23
0.30
D
2.90
3.00
3.10
D2
2.30
2.40
2.50
E
2.90
3.00
3.10
E2
1.55
1.70
1.75
e
D2
A
A3
A1
FRONT VIEW
RECOMMENDED LAND PATTERN
R
e
M
0.45 BSC
L
0.30
0.40
0.50
M
0.25
0.30
0.35
N
0.60
0.70
0.80
P
2.70
3.00
3.10
R
2.25 TYP
N
P
E2
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC MO-229.
D2
DOCUMENT NUMBER:
DESCRIPTION:
98AON34357E
TDFN12, 3X3
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
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