DATA SHEET
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Constant Current LED
Driver with 32 Dimming
Levels and Rset
UDFN−8
HU2G SUFFIX
CASE 517AW
CAT4002A, CAT4004A
SC70−6
SD SUFFIX
CASE 419AD
Description
The CAT4002A and CAT4004A provide respectively two and four
matched low dropout current sources to drive LEDs. The CAT400XA
uses an external resistor RSET to set the current in the LED channels.
Each LED channel includes an individual control loop allowing the
device to handle a wide range of LED forward voltages while still
maintaining tight current matching.
The EN/DIM logic inputs supports device enable and a digital
dimming interface for setting the LED channel current with 32 linear
dimming levels.
LEDs can be powered directly from a Lithium−ion battery due to the
low dropout (50 mV at 20 mA) current sinks. The device is available
in the tiny 8−pad UDFN 2 mm x 2 mm package with a max height of
0.55 mm, as well as the 6−lead SC−70.
1
2 and 4 LED Current Sinks with Tight Matching
32 Dimming Levels
Low Dropout Driver 50 mV at 20 mA
No Switching Noise
Shutdown Current less than 1 mA
LED Current set by External Resistor
Dimming via 1−wire EZDim Interface
Thermal Shutdown Protection
6−lead SC−70, and 8−pad UDFN 2 mm x 2 mm Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• LCD Display Backlight
• Cellular Phones
VIN
RSET
LED4
LED3
EN/DIM
GND
LED1
LED2
CAT4004A
UDFN−8
EN/DIM
Features
•
•
•
•
•
•
•
•
•
•
PIN CONNECTIONS
1
LED1
RSET
GND
VIN
LED2
CAT4002A
SC70−6
(Top Views)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
• Digital Still Cameras
• Handheld Devices
VIN
2.4 V
to
5.5 V
20 mA
CIN
1 mF
LED1 LED2 LED3 LED4
VIN
One wire
programming
EN/DIM
CAT4004A
RSET
RSET
3.74 kW
GND
Figure 1. Typical Application Circuit
© Semiconductor Components Industries, LLC, 2011
October, 2021 − Rev. 3
1
Publication Order Number:
CAT4002A/D
CAT4002A, CAT4004A
MARKING DIAGRAMS
BG
A
Y
M
BGA
YM
VJA
UDFN8 (2 x 2 mm)
SC70−6
= CAT4004A Device Code
= Assembly Location Code
= Production Year (last digit)
= Production Month: 1 − 9, A, B, C
VJ
A
= CAT4002A Device Code
= Assembly Location Code
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter
VIN, LEDx, RSET
EN/DIM Voltage
Rating
Unit
6
V
6
V
Storage Temperature Range
−65 to +160
°C
Junction Temperature Range
−40 to +125
°C
300
°C
Lead Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 2. ELECTRICAL OPERATING CHARACTERISTICS (Min and Max values are over recommended operating conditions
unless specified otherwise. Typical values are at VIN = 4.0 V, EN/DIM = High, and TAMB = 25°C.)
Name
Symbol
Conditions
IQ
Quiescent Current
No load, RSET = Float
No load, RSET = 4.8 kW
IQSHDN
Shutdown Current
VEN/DIM = 0 V
ILED
LED Current Setting
ILED−ACC
LED Current Accuracy
ILED−DEV
LED Channel Matching (Note 1)
Min
Typ
0.2
0.5
25
RSET = 4.99 kW
15
1 mA ≤ ILED ≤ 40 mA
±1
Units
mA
1
RSET = 3.0 kW
I LED * I LEDAVG
Max
mA
mA
%
−5
±1
+5
0.57
0.6
0.63
%
I LEDAVG
VRSET
RSET pin regulated voltage
VDOUT
Dropout Voltage
(90% of nominal LED current)
REN/DIM
VHI
VLO
ILED = 20 mA
ILED = 1 mA
EN/DIM Pin
− Internal pull−down resistor
− Logic High Level
− Logic Low Level
V
50
25
mV
200
kW
V
V
1.3
0.4
TSD
Thermal Shutdown
150
°C
THYS
Thermal Hysteresis
20
°C
VUVLO
Undervoltage lockout (UVLO) threshold
2.0
V
1. For CAT4004A, ILEDAVG = (ILED,CH1 + ILED,CH2 + ILED,CH3 + ILED,CH4) / 4
For CAT4002A, ILEDAVG = (ILED,CH1 + ILED,CH2) / 2
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2
CAT4002A, CAT4004A
Table 3. RECOMMENDED OPERATING CONDITIONS
Parameter
Rating
Unit
VIN
2.4 to 5.5
V
Ambient Temperature Range
−40 to +85
°C
0 to 40
mA
ILED per LED pin
NOTE:
Typical application circuit with external components is shown on page 1.
Table 4. RECOMMENDED EN/DIM TIMING (For 2.4 V ≤ VIN ≤ 5.5 V, over full ambient temperature range −40°C to +85°C.)
Symbol
Name
Conditions
Min
TLO
EN/DIM program low time
0.2
THI
EN/DIM program high time
0.2
TLED
TPWRDWN
Typ
Max
Units
100
ms
ms
LED current settling time
10
EN/DIM low time to shutdown
3
ms
5
THI
EN/DIM
TLO
TPWRDWN
TLED
100%
LED
Current
100%
97% 94%
32 Levels
Shutdown
3%
Shutdown
0%
Figure 2. CAT400XA EN/DIM Dimming Timing Diagram
LED Current Setting
Table 5. RSET RESISTOR AND LED CURRENT
On the CAT400XA, the full scale LED current is set by the
external resistor connected between the RSET pin and
ground. Table 5 lists standard resistor values for several
LED current settings.
When the EN/DIM is initially taken high, the CAT400XA
becomes enabled and the LED channel current is set to the
full scale current according to the resistor RSET.
LED current ≅ 125 x VRSET / RSET
Full Scale
LED Current [mA]
RSET [kW]
2
40.2
5
15.4
10
7.68
15
4.99
20
3.74
25
3.00
30
2.49
40
1.87
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3
ms
CAT4002A, CAT4004A
TYPICAL PERFORMANCE CHARACTERISTICS
(CAT4002A, VIN = 4 V, VF = 3.3 V, IOUT = 50 mA (2 LEDs at 25 mA), CIN = 1 mF, TAMB = 25°C unless otherwise specified.)
QUIESCENT CURRENT (mA)
1.6
1.2
0.8
0.4
0
LED CURRENT CHANGE (%)
1.4
0
20
40
1.0
0.8
3.5
4.0
4.5
5.0
5.5
Figure 3. Quiescent Current vs. RSET Input
Voltage
Figure 4. Quiescent Current vs. Input Voltage
(Full Load)
1.0
10
8
0.6
0.4
0.2
0
−0.2
−0.4
−0.6
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6
4
2
0
−2
−4
−6
−8
−10
−40
0
40
80
INPUT VOLTAGE (V)
TEMPERATURE (°C)
Figure 5. LED Current Change vs. Input
Voltage
Figure 6. LED Current Change vs.
Temperature
120
40
25°C
1.0
0.8
LED CURRENT (mA)
1.2
−40°C
80°C
0.6
0.4
3.0
INPUT VOLTAGE (V)
0.8
−0.8
−1.0
2.5
RSET (kW)
1.4
ENABLE HIGH THRESHOLD (V)
1.2
0.6
60
LED CURRENT CHANGE (%)
QUIESCENT CURRENT (mA)
2.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
30
20
10
0
5.5
1
10
INPUT VOLTAGE (V)
RSET (kW)
Figure 7. EN/DIM High Threshold vs. Input
Voltage
Figure 8. LED Current vs. RSET Resistor
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4
100
CAT4002A, CAT4004A
TYPICAL PERFORMANCE CHARACTERISTICS
(CAT4002A, VIN = 4 V, VF = 3.3 V, IOUT = 50 mA (2 LEDs at 25 mA), CIN = 1 mF, TAMB = 25°C unless otherwise specified.)
30
100
25 mA
90
EFFICIENCY (%)
LED CURRENT (mA)
25
20
15
10
70
60
5
0
80
1 mA
0
50
100
150
200
250
50
300
5.5
5.0
4.5
4.0
3.5
3.0
2.5
LED PIN VOLTAGE (mV)
INPUT VOLTAGE (V)
Figure 9. Dropout Characteristics
Figure 10. Efficiency vs. Input Voltage
Figure 11. Power Up Waveform
Figure 12. Power Down Waveform
Figure 13. Line Transient Waveform
Figure 14. Dimming Levels
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5
2.0
CAT4002A, CAT4004A
Table 6. PIN DESCRIPTIONS
Name
EN/DIM
Function
Device enable (active high) and dimming control
GND
Ground reference
LED1
LED1 cathode terminal
LED2
LED2 cathode terminal
LED3
LED3 cathode terminal (CAT4004A only)
LED4
LED4 cathode terminal (CAT4004A only)
RSET
Connect external RSET resistor to set the LED current
VIN
Device supply input, connect to battery or supply
TAB
Connect to GND on the PCB (CAT4004A only)
Pin Function
LED1 to LED4 provide the internal regulated current for
each of the LED cathodes. There pins enter a high
impedance zero current state whenver the device is placed
in shutdown mode.
RSET is connected to the resistor (RSET) to set the full scale
current for the LEDs. The voltage at this pin is regulated to
0.6 V. The ground side of the external resistor should be star
connected back to the GND of the PCB. In shutdown mode,
the RSET input becomes high impedance.
GND is the ground reference for the device. The pin must be
connected to the ground plane on the PCB.
TAB (CAT4004A only) is the exposed pad underneath the
package. For best thermal performance, the tab should be
soldered to the PCB and connected to the ground plane.
VIN is the supply pin for the charge pump. A small 1 mF
ceramic bypass capacitor is required between the VIN pin
and ground near the device. The operating input voltage
range is from 2.5 V to 5.5 V. Whenever the input supply falls
below the under−voltage threshold (2.0 V), all the LED
channels are disabled and the device enters shutdown mode.
EN/DIM is the enable and one wire dimming input for all
LED channels. Levels of logic high and logic low are set at
1.3 V and 0.4 V respectively. When EN/DIM is initially
taken high, the CAT400XA becomes enabled and the LED
channel current is set to the full scale according to the
resistor RSET. To place the device into “zero current”
shutdown mode, the EN/DIM pin must be held low for 3 ms
typical.
Block Diagram
LED4
LED3
Undervoltage
Lockout
LED2
VIN
LED1
VIN
Reference
Voltage
RSET
EN/DIM
Current
Setting DAC
Serial
Interface
Register
4 Current Sink
Regulators
100 kW
GND
Figure 15. CAT4004A Functional Block Diagram
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6
CAT4002A, CAT4004A
Basic Operation
Table 7. DIMMING LEVELS
The CAT400XA uses tightly matched current sinks to
accurately regulate LED current in each channel
proportional to the current sourced from the RSET pin.
There are 32 different settings for LED brightness that can
be programmed through the EN/DIM pin. Tight current
regulation for all channels is possible over a wide range of
input and LED voltages due to independent current sensing
circuitry on each channel.
Each LED channel needs a minimum of 50 mV headroom
to sink a constant regulated current of 20 mA. If the input
supply falls below 2.0 V typical, the under−voltage lockout
circuit disables all LED channels and resets the circuit to
default values. Any unused LED channels should be left
open.
Full Scale (Current in %)
Dimming Pulses [n]
100
0
97
1
94
2
90
3
87
4
84
5
81
6
77
7
74
8
LED Current Selection
0.6 V
R SET
10
11
61
12
58
13
55
14
52
15
48
16
45
17
42
18
39
19
35
20
32
21
29
22
26
23
23
24
19
25
16
26
13
27
10
28
6
29
3
30
0
31
100
32
ǒ3131* nǓ
The full scale current is calculated from the above formula
with n equal to zero.
The EN/DIM pin has two primary functions. One function
enables and disables the device. The other function is LED
current dimming with 32 different levels by pulsing the input
signal, as shown on Figure 16. On each consecutive pulse
rising edge, the LED current is decreased by about 3.2%
(1/31th of the full scale value). After 30 pulses, the LED
current is 3.2% of the full scale current. On the 31st pulse, the
current drops to zero, and then goes back to full scale on the
following pulse.
Each pulse width should be between 200 ns and 100 ms.
Pulses faster than the minimum TLO may be ignored and
filtered by the device. Pulses longer than the maximum TLO
may shutdown the device. By pulsing the EN/DIM signal at
high frequency, the LED current can quickly be set to zero.
The LED driver enters a “zero current” shutdown mode if
EN/DIM is held low for 3 ms typical.
The dimming level is set by the number of pulses on the
EN/DIM after the power−up, as shown in Table 7.
9
68
65
After power−up, the LED current is set by the external
resistor (RSET) value and the number of pulses (n) on the
EN/DIM input as follows:
LED current + 125
71
THI
EN/DIM
TLO
TPWRDWN
TLED
100%
LED
Current
Shutdown
100%
97% 94%
32 Levels
3%
0%
Figure 16. EN/DIM Digital Dimming Timing Diagram
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7
Shutdown
CAT4002A, CAT4004A
Example of Ordering Information (Note 4)
Prefix
Device #
Suffix
CAT
4004A
HU2
−G
T3
Package
Lead Finish
G: NiPdAu
Tape & Reel (Note 6)
T: Tape & Reel
3: 3,000 Units / Reel
Company ID
(Optional)
HU2: UDFN
SD: SC70
Product Number
4002A
4004A
Table 8. ORDERING INFORMATION
Part Number
CAT4002ASD−GT3
CAT4004AHU2−GT3
2.
3.
4.
5.
6.
Package
Quantity per Reel
SC70−6
3,000
UDFN−8 (2 x 2 mm)
3,000
All packages are RoHS−compliant (Lead−free, Halogen−free).
The standard lead finish is NiPdAu.
The device used in the above example is a CAT4004AHU2−GT3 (UDFN, NiPdAu, Tape & Reel, 3,000/Reel).
For additional package and temperature options, please contact your nearest onsemi Sales office.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88 (SC−70 6 Lead), 1.25x2
CASE 419AD
ISSUE A
DATE 07 JUL 2010
1
D
e
e
E1 E
SYMBOL
MIN
A
0.80
MAX
1.10
A1
0.00
0.10
A2
0.80
1.00
b
0.15
0.30
0.18
c
0.10
D
1.80
2.00
2.20
E
1.80
2.10
2.40
E1
1.15
1.25
1.35
0.65 BSC
e
L
0.26
L1
0.36
0.46
0.42 REF
0.15 BSC
L2
TOP VIEW
NOM
θ
0º
8º
θ1
4º
10º
q1
A2 A
q
b
q1
L
L1
A1
SIDE VIEW
c
L2
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34266E
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88 (SC−70 6 LEAD), 1.25X2
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN8, 2x2
CASE 517AW
ISSUE A
1
SCALE 2:1
ÇÇ
ÇÇ
E
DETAIL A
ALTERNATE
CONSTRUCTIONS
0.10 C
2X
L
L
L1
PIN ONE
REFERENCE
2X
B
A
D
DATE 13 NOV 2015
0.10 C
TOP VIEW
DETAIL B
A
0.10 C
A3
A1
0.08 C
A1
SIDE VIEW
NOTE 4
C
D2
DETAIL A
1
8X
4
SEATING
PLANE
5
e
e/2
A3
ALTERNATE
CONSTRUCTION
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.18
0.30
2.00 BSC
1.50
1.70
2.00 BSC
0.80
1.00
0.50 BSC
0.20
0.45
−−−
0.15
GENERIC
MARKING DIAGRAM*
8X
1
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
1.73
PACKAGE
OUTLINE
DETAIL B
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
L
E2
8
ÇÇ
ÇÇ
ÉÉ
MOLD CMPD
EXPOSED Cu
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINALS AND IS MEASURED BETWEEN 0.15
AND 0.30 MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. FOR DEVICE OPN CONTAINING W OPTION,
DETAIL B ALTERNATE CONSTRUCTION IS
NOT APPLICABLE.
8X
0.50
XX MG
G
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
2.30
1.00
1
8X
0.50
PITCH
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34462E
UDFN8, 2X2
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
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onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
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