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Is Now
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www.onsemi.com
onsemi and and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or
subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi
product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without
notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality,
or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws,
regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/
or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for
implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative
Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.
CAT93C86
16 Kb Microwire Serial
EEPROM
Description
The CAT93C86 is a 16 Kb Serial EEPROM memory device which
is configured as either registers of 16 bits (ORG pin at VCC) or 8 bits
(ORG pin at GND). Each register can be written (or read) serially by
using the DI (or DO) pin. The CAT93C86 is manufactured using
ON Semiconductor’s advanced CMOS EEPROM floating gate
technology. The device is designed to endure 1,000,000 program/erase
cycles and has a data retention of 100 years. The device is available in
8−pin DIP and 8−pin SOIC packages.
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SOIC−8
V, W SUFFIX
CASE 751BD
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
High Speed Operation: 3 MHz / VCC = 5 V
Low Power CMOS Technology
1.8 V to 5.5 V Operation
Selectable x8 or x16 Memory Organization
Self−timed Write Cycle with Auto−clear
Hardware and Software Write Protection
Power−up Inadvertent Write Protection
Sequential Read
Program Enable (PE) Pin
1,000,000 Program/Erase Cycles
100 Year Data Retention
Industrial and Extended Temperature Ranges
8−lead PDIP and SOIC Packages
These Devices are Pb−Free, Halogen Free/BFR Free, and RoHS
Compliant
PDIP−8
L SUFFIX
CASE 646AA
SOIC−8
X SUFFIX
CASE 751BE
PIN CONFIGURATION
CS
SK
DI
DO
1
VCC
PE
ORG
GND
1
PE
VCC
CS
SK
ORG
GND
DO
DI
SOIC (W)*
PDIP (L), SOIC (V, X)
PIN FUNCTION
VCC
SK
Function
CS
Chip Select
SK
Clock Input
DI
Serial Data Input
DO
Serial Data Output
VCC
Power Supply
GND
Ground
GND
ORG
Memory Organization
Figure 1. Functional Symbol
PE
ORG
CS
Pin Name
DI
CAT93C86
DO
PE
Note: When the ORG pin is connected to VCC, the x16 organization
is selected. When it is connected to ground, the x8 pin is selected. If
the ORG pin is left unconnected, then an internal pull−up device will
select the x16 organization.
© Semiconductor Components Industries, LLC, 2014
December, 2014 − Rev. 13
1
Program Enable
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
* Not Recommended for New Designs
Publication Order Number:
CAT93C86/D
CAT93C86
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameters
Ratings
Units
Temperature Under Bias
−55 to +125
°C
Storage Temperature
−65 to +150
°C
−2.0 to +VCC +2.0
V
Voltage on any Pin with Respect to Ground (Note 1)
VCC with Respect to Ground
−2.0 to +7.0
V
Package Power Dissipation Capability (TA = 25°C)
1.0
W
Lead Soldering Temperature (10 seconds)
300
°C
Output Short Circuit Current (Note 2)
100
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The minimum DC input voltage is −0.5 V. During transitions, inputs may undershoot to −2.0 V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC +0.5 V, which may overshoot to VCC +2.0 V for periods of less than 20 ns.
2. Output shorted for no more than one second. No more than one output shorted at a time.
Table 2. RELIABILITY CHARACTERISTICS
Symbol
Parameter
Reference Test Method
Min
Units
NEND (Note 3)
Endurance
MIL−STD−883, Test Method 1033
1,000,000
Cycles/Byte
TDR (Note 3)
Data Retention
MIL−STD−883, Test Method 1008
100
Years
VZAP (Note 3)
ESD Susceptibility
MIL−STD−883, Test Method 3015
2000
V
ILTH (Notes 3, 4)
Latch−Up
JEDEC Standard 17
100
mA
3. These parameters are tested initially and after a design or process change that affects the parameter.
4. Latch−up protection is provided for stresses up to 100 mA on address and data pins from −1 V to VCC +1 V.
Table 3. D.C. OPERATING CHARACTERISTICS (VCC = +1.8 V to +5.5 V unless otherwise specified.)
Symbol
Parameter
ICC1
Power Supply Current (Write)
ICC2
Power Supply Current (Read)
ISB1
Test Conditions
Min
Typ
Max
Units
fSK = 1 MHz; VCC = 5.0 V
3
mA
fSK = 1 MHz; VCC = 5.0 V
500
mA
Power Supply Current
(Standby) (x8 Mode)
CS = 0 V ORG = GND
10
mA
ISB2
Power Supply Current
(Standby) (x16 Mode)
CS = 0 V ORG = Float or VCC
10
mA
ILI
Input Leakage Current
VIN = 0 V to VCC
1
mA
ILO
Output Leakage Current
(Including ORG pin)
VOUT = 0 V to VCC, CS = 0 V
1
mA
VIL1
Input Low Voltage
4.5 V ≤ VCC < 5.5 V
−0.1
0.8
V
VIH1
Input High Voltage
4.5 V ≤ VCC < 5.5 V
2
VCC + 1
V
0
VIL2
Input Low Voltage
1.8 V ≤ VCC < 4.5 V
0
VCC x 0.2
V
VIH2
Input High Voltage
1.8 V ≤ VCC < 4.5 V
VCC x 0.7
VCC + 1
V
VOL1
Output Low Voltage
4.5 V ≤ VCC < 5.5 V; IOL = 2.1 mA
0.4
V
VOH1
Output High Voltage
4.5 V ≤ VCC < 5.5 V; IOH = −400 mA
VOL2
Output Low Voltage
1.8 V ≤ VCC < 4.5 V; IOL = 1 mA
VOH2
Output High Voltage
1.8 V ≤ VCC < 4.5 V; IOH = −100 mA
2.4
V
0.2
VCC − 0.2
V
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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2
CAT93C86
Table 4. PIN CAPACITANCE (Note 5)
Test
Symbol
COUT
CIN
Conditions
Output Capacitance (DO)
Max
Units
VOUT = 0 V
5
pF
VIN = 0 V
5
pF
Input Capacitance (CS, SK, DI, ORG)
Min
Typ
Table 5. POWER−UP TIMING (Notes 5, 6)
Symbol
Parameter
Max
Units
tPUR
Power−up to Read Operation
1
ms
tPUW
Power−up to Write Operation
1
ms
Table 6. A.C. TEST CONDITIONS
≤ 50 ns
Input Rise and Fall Times
0.4 V to 2.4 V
4.5 V ≤ VCC ≤ 5.5 V
0.8 V, 2.0 V
4.5 V ≤ VCC ≤ 5.5 V
0.2 x VCC to 0.7 x VCC
1.8 V ≤ VCC ≤ 4.5 V
0.5 x VCC
1.8 V ≤ VCC ≤ 4.5 V
Input Pulse Voltages
Timing Reference Voltages
Input Pulse Voltages
Timing Reference Voltages
Table 7. A.C. CHARACTERISTICS
Symbol
Parameter
Test Conditions
VCC =
1.8 V − 5.5 V
VCC =
2.5 V − 5.5 V
VCC =
4.5 V − 5.5 V
Min
Min
Min
Max
tCSS
CS Setup Time
tCSH
CS Hold Time
0
tDIS
DI Setup Time
200
tDIH
DI Hold Time
200
100
tPD1
Output Delay to 1
tPD0
Output Delay to 0
tHZ (Note 5)
tEW
200
CL = 100 pF (Note 7)
Output Delay to High−Z
Program/Erase Pulse Width
Max
100
Max
Units
50
ns
0
0
ns
100
50
ns
50
ns
1
0.5
0.15
ms
1
0.5
0.15
ms
400
200
100
ns
5
ms
5
5
tCSMIN
Minimum CS Low Time
1
0.5
0.15
ms
tSKHI
Minimum SK High Time
1
0.5
0.15
ms
tSKLOW
Minimum SK Low Time
1
0.5
0.15
ms
tSV
Output Delay to Status Valid
SKMAX
Maximum Clock Frequency
1
DC
500
0.5
DC
1000
5. These parameters are tested initially and after a design or process change that affects the parameter.
6. tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated.
7. The input levels and timing reference points are shown in the “A.C. Test Conditions” table.
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3
DC
0.1
ms
3000
kHz
CAT93C86
Table 8. INSTRUCTION SET
Address
Data
Instruction
Start
Bit
Opcode
x8
x16
READ
1
10
A10−A0
A9−A0
Read Address AN– A0
ERASE
1
11
A10−A0
A9−A0
Clear Address AN– A0
WRITE
1
01
A10−A0
A9−A0
EWEN
1
00
11XXXXXXXXX
11XXXXXXXX
Write Enable
EWDS
1
00
00XXXXXXXXX
00XXXXXXXX
Write Disable
ERAL
1
00
10XXXXXXXXX
10XXXXXXXX
Clear All Addresses
WRAL
1
00
01XXXXXXXXX
01XXXXXXXX
x8
D7−D0
D7−D0
x16
D15−D0
D15−D0
Comments
Write Address AN– A0
Write All Addresses
Read
Device Operation
The CAT93C86 is a 16,384−bit nonvolatile memory
intended for use with industry standard microprocessors.
The CAT93C86 can be organized as either registers of 16
bits or 8 bits. When organized as X16, seven 13−bit
instructions control the reading, writing and erase
operations of the device. When organized as X8, seven
14−bit instructions control the reading, writing and erase
operations of the device. The CAT93C86 operates on a
single power supply and will generate on chip, the high
voltage required during any write operation.
Instructions, addresses, and write data are clocked into the
DI pin on the rising edge of the clock (SK). The DO pin is
normally in a high impedance state except when reading data
from the device, or when checking the ready/busy status
after a write operation.
The ready/busy status can be determined after the start of
a write operation by selecting the device (CS high) and
polling the DO pin; DO low indicates that the write
operation is not completed, while DO high indicates that the
device is ready for the next instruction. If necessary, the DO
pin may be placed back into a high impedance state during
chip select by shifting a dummy “1” into the DI pin. The DO
pin will enter the high impedance state on the falling edge of
the clock (SK). Placing the DO pin into the high impedance
state is recommended in applications where the DI pin and
the DO pin are to be tied together to form a common DI/O
pin.
The format for all instructions sent to the device is a
logical “1” start bit, a 2−bit (or 4−bit) opcode, 10−bit address
(an additional bit when organized X8) and for write
operations a 16−bit data field (8−bit for X8 organizations).
Note: The Write, Erase, Write all and Erase all instructions
require PE = 1. If PE is left floating, 93C86 is in Program
Enabled mode. For Write Enable and Write Disable
instruction PE = don’t care.
Upon receiving a READ command and an address
(clocked into the DI pin), the DO pin of the CAT93C86 will
come out of the high impedance state and, after sending an
initial dummy zero bit, will begin shifting out the data
addressed (MSB first). The output data bits will toggle on
the rising edge of the SK clock and are stable after the
specified time delay (tPD0 or tPD1).
After the initial data word has been shifted out and CS
remains asserted with the SK clock continuing to toggle, the
device will automatically increment to the next address and
shift out the next data word in a sequential READ mode. As
long as CS is continuously asserted and SK continues to
toggle, the device will keep incrementing to the next address
automatically until it reaches to the end of the address space,
then loops back to address 0. In the sequential READ mode,
only the initial data word is preceeded by a dummy zero bit.
All subsequent data words will follow without a dummy
zero bit.
Write
After receiving a WRITE command, address and the data,
the CS (Chip Select) pin must be deselected for a minimum
of tCSMIN. The falling edge of CS will start the self clocking
clear and data store cycle of the memory location specified
in the instruction. The clocking of the SK pin is not
necessary after the device has entered the self clocking
mode. The ready/busy status of the CAT93C86 can be
determined by selecting the device and polling the DO pin.
Since this device features Auto−Clear before write, it is
NOT necessary to erase a memory location before it is
written into.
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4
CAT93C86
tSKHI
tSKLOW
tCSH
SK
tDIS
tDIH
VALID
DI
VALID
tCSS
CS
tPD0, tPD1
tDIS
DO
tCSMIN
DATA VALID
Figure 2. Synchronous Data Timing
SK
1
1
1
1
1
AN
AN−1
1
1
1
1
1
1
1
1
1
1
CS
Don’t Care
DI
1
1
A0
0
HIGH−Z
DO
Dummy 0
D15 . . . D0
or
D7 . . . D0
Address + 1
D15 . . . D0
or
D7 . . . D0
Address + 2
D15 . . . D0
or
D7 . . . D0
Address + n
D15 . . .
or
D7 . . .
Figure 3. Read Instruction Timing
SK
tCSMIN
CS
STATUS
VERIFY
AN AN−1
DI
1
0
A0
DN
D0
1
tSV
DO
STANDBY
BUSY
HIGH−Z
READY
tEW
Figure 4. Write Instruction Timing
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5
tHZ
HIGH−Z
CAT93C86
Erase
Erase All
Upon receiving an ERASE command and address, the CS
(Chip Select) pin must be deasserted for a minimum of
tCSMIN. The falling edge of CS will start the self clocking
clear cycle of the selected memory location. The clocking of
the SK pin is not necessary after the device has entered the
self clocking mode. The ready/busy status of the CAT93C86
can be determined by selecting the device and polling the
DO pin. Once cleared, the content of a cleared location
returns to a logical “1” state.
Upon receiving an ERAL command, the CS (Chip Select)
pin must be deselected for a minimum of tCSMIN. The falling
edge of CS will start the self clocking clear cycle of all
memory locations in the device. The clocking of the SK pin
is not necessary after the device has entered the self clocking
mode. The ready/busy status of the CAT93C86 can be
determined by selecting the device and polling the DO pin.
Once cleared, the contents of all memory bits return to a
logical “1” state.
Erase/Write Enable and Disable
Write All
The CAT93C86 powers up in the write disable state. Any
writing after power−up or after an EWDS (write disable)
instruction must first be preceded by the EWEN (write
enable) instruction. Once the write instruction is enabled, it
will remain enabled until power to the device is removed, or
the EWDS instruction is sent. The EWDS instruction can be
used to disable all CAT93C86 write and clear instructions,
and will prevent any accidental writing or clearing of the
device. Data can be read normally from the device
regardless of the write enable/disable status.
Upon receiving a WRAL command and data, the CS
(Chip Select) pin must be deselected for a minimum of
tCSMIN. The falling edge of CS will start the self clocking
data write to all memory locations in the device. The
clocking of the SK pin is not necessary after the device has
entered the self clocking mode. The ready/busy status of the
CAT93C86 can be determined by selecting the device and
polling the DO pin. It is not necessary for all memory
locations to be cleared before the WRAL command is
executed.
SK
CS
AN
DI
1
1
AN−1
A0
tCS
STATUS
VERIFY
1
tSV
DO
STANDBY
HIGH−Z
BUSY
tEW
Figure 5. Erase Instruction Timing
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6
tHZ
READY
HIGH−Z
CAT93C86
PACKAGE DIMENSIONS
PDIP−8, 300 mils
CASE 646AA−01
ISSUE A
SYMBOL
MIN
NOM
A
E1
5.33
A1
0.38
A2
2.92
3.30
4.95
b
0.36
0.46
0.56
b2
1.14
1.52
1.78
c
0.20
0.25
0.36
D
9.02
9.27
10.16
E
7.62
7.87
8.25
E1
6.10
6.35
7.11
e
PIN # 1
IDENTIFICATION
MAX
2.54 BSC
eB
7.87
L
2.92
10.92
3.30
3.80
D
TOP VIEW
E
A2
A
A1
c
b2
L
e
eB
b
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC MS-001.
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7
CAT93C86
PACKAGE DIMENSIONS
SOIC 8, 150 mils
CASE 751BD−01
ISSUE O
E1
E
SYMBOL
MIN
A
1.35
1.75
A1
0.10
0.25
b
0.33
0.51
c
0.19
0.25
D
4.80
5.00
E
5.80
6.20
E1
3.80
4.00
MAX
1.27 BSC
e
PIN # 1
IDENTIFICATION
NOM
h
0.25
0.50
L
0.40
1.27
θ
0º
8º
TOP VIEW
D
h
A1
θ
A
c
e
b
L
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MS-012.
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8
CAT93C86
PACKAGE DIMENSIONS
SOIC−8, 208 mils
CASE 751BE−01
ISSUE O
SYMBOL
MIN
NOM
A
E1 E
MAX
2.03
A1
0.05
0.25
b
0.36
0.48
c
0.19
0.25
D
5.13
5.33
E
7.75
8.26
E1
5.13
e
5.38
1.27 BSC
L
0.51
0.76
θ
0º
8º
PIN#1 IDENTIFICATION
TOP VIEW
D
A
e
b
q
L
A1
SIDE VIEW
c
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with EIAJ EDR-7320.
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9
CAT93C86
ORDERING INFORMATION
Specific Device
Marking*
Pkg Type
Temperature Range
Lead
Finish
CAT93C86LI−G
93C86D
PDIP−8
Shipping
I = Industrial
(−40°C to +85°C)
NiPdAu
Tube, 50 Units / Tube
CAT93C86VI−G
93C86D
SOIC−8, JEDEC
I = Industrial
(−40°C to +85°C)
NiPdAu
Tube, 100 Units / Tube
CAT93C86VI−GT3
93C86D
SOIC−8, JEDEC
I = Industrial
(−40°C to +85°C)
NiPdAu
Tape & Reel,
3000 Units / Reel
CAT93C86WI−GT3
(Note 10)
93C86D
SOIC−8, JEDEC
I = Industrial
(−40°C to +85°C)
NiPdAu
Tape & Reel,
3000 Units / Reel
CAT93C86XI−T2
93C86D
SOIC−8, EIAJ
I = Industrial
(−40°C to +85°C)
Matte−Tin
Tape & Reel,
2000 Units / Reel
OPN
*Marking for new product Revision D.
8. All packages are RoHS−compliant (Lead−free, Halogen−free).
9. The standard lead finish is NiPdAu.
10. Not recommended for new designs.
11. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office.
12. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
13. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device
Nomenclature document, TND310/D, available at www.onsemi.com
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Email: orderlit@onsemi.com
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Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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