4-Channel ESD Array in CSP CM1204
Features
•
•
Product Description
The CM1204 is a quad ESD transient voltage supression diode array. Each diode provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). These diodes safely dissipate ESD strikes of ±15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +30kV. The CM1204 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight.
Functionally and pin compatible with CMD’s CSPESD304 TM Optiguard coated for improved reliability Four channels of ESD protection ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Chip Scale Package features extremely low lead inductance for optimum ESD protection 5-bump, 0.960mm X 1.330mm footprint Chip Scale Package (CSP) RoHS compliant (lead-free)
• • • • • •
Applications
• • • • • • • • ESD protection for sensitive electronic equipment I/O port and keypad and button circuitry protection for portable devices W ireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs
The CM1204 features Optiguard
TM
coating which results in
improved reliability at assembly. It is available in a spacesaving, low-profile chip scale package with RoHScompliant lead-free finishing.
Block Diagram
ESD_1 ESD_2 ESD_3 ESD_4 C1 C3 A1 A3
GND
B2
©2010 SCILLC. All rights reserved. April 2010 – Rev. 3
Publication Order Number: CM1204/D
CM1204
PIN DESCRIPTIONS
Pin
A1 A3 B2 C1 C3
Name
ESD_1 ESD_2 GND ESD_3 ESD_4
Description
ESD Channel1 ESD Channel 2 Device Ground ESD Channel 3 ESD Channel 4
Ordering Information
PART NUMBERING INFORMATION
Pins
5
Package
CSP
Ordering Part Number
CM1204-03CP
1
Part Marking
S
Parts are shipped in Tape & Reel form unless otherwise specified.
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CM1204
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Package Power Rating RATING -65 to +150 200 UNITS ° C mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS ° C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL VDIODE ILEAK VSIG PARAMETER Diode Reverse Breakdown Voltage Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Diode Capacitance CONDITIONS IDIODE = 10µA VIN=3.3V, TA=25° C IDIODE = 10mA 5.6 -1.5 Note 2 ±30 ±15 Note 2 +15 -8 At 2.5VDC Reverse Bias, 1MHz, 30mVAC 22 27 32 V V pF kV kV 6.8 -0.8 9.0 -0.4 V V MIN TYP 6.0 100 MAX UNITS V nA
VESD
VCL
CDIODE
Note 1: TA=-40 to +85° unless otherwise specified. C Note 2: ESD applied to input and output pins with respect to GND, one at a time.
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CM1204
Performance Information
Diode Characteristics (nominal conditions unless specified otherwise)
Figure 1. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC)
Figure 2. Frequency Response (single channel vs. GND, in 50Ω system)
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CM1204
Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50µm +20µm 60 seconds 260ûC
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
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CM1204
Figure 4. Lead-free (SnAgCu) Solder Ball Reflow Profile
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CM1204
Mechanical Details The CM1204 is offered in a custom Chip Scale Package (CSP). Dimensions are presented below.
PACKAGE DIMENSIONS
Package Bumps Dim Millimeters Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Custom CSP 5 Inches Nom Max
0.915 0.960 1.005 0.0360 0.0378 0.0396 1.285 1.330 1.375 0.0506 0.0524 0.0541 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces
# per tape and reel
Package Dimensions for CM1204 Chip Scale Package
Controlling dimension: millimeters
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CM1204
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 1.42 X 1.07 X 0.740 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500
PART NUMBER CM1204-03CP
CHIP SIZE (mm) 1.33 X 0.96 X 0.644
P0 4mm
P1 4mm
Figure 5. Tape and Reel Mechanical Data
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CM1204
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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