CM1205

8-Channel ESD Protection Array in Chip Scale Package CM1205 Features • • • • Functionally and pin compatible with CMD’s PACDN1408 ESD protection device Eight transient voltage suppressors in a single package Optiguard coated for improved reliability at assembly In-system Electrostatic Discharge (ESD) protection to +25kV contact discharge per IEC 61000-4-2 international standard Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages RoHS compliant (lead-free) 10-bump CSP TM Product Description The CM1205 transient voltage suppressor array provides a very high level of protection for sensitive electronic components that may be subjected to ESD. The CM1205 will safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, +8kV contact discharge). All I/Os are rated at +25kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than +30kV. The Chip Scale Package format of this device enables extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. The CM1205 features OptiGuard coating for improved reliability at assembly and is available with RoHS compliant lead-free finishing. TM • • Applications • • • • • • • • ESD protection for sensitive electronic equipment I/O port, keypad and button circuitry protection for portable devices Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Cameras and Camcorders Notebooks Desktop PCs Block Diagram ©2010 SCILLC. All rights reserved. April 2010 – Rev. 3 Publication Order Number: CM1205/D CM1205 Ordering Information PART NUMBERING INFORMATION Bumps 10 Package CSP Ordering Part Number CM1205-08CP 1 Part Marking 120508 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING -65 to +150 UNITS ° C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS ° C Rev. 3 | Page 2 of 8 | www.onsemi.com CM1205 ELECTRICAL OPERATING CHARACTERISTICS SYMBOL VREV ILEAK VSIG PARAMETER Reverse Standoff Voltage Leakage Current Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Channel Capacitance CONDITIONS IDIODE=10µA VIN=3.3V DC ILOAD = 10mA 5.6 -1.2 Note 2 +30 +25 6.8 -0.8 MIN TYP 6.0 1 MAX UNITS V 100 nA 8.0 -0.4 V V VESD kV kV VCL Note 2 +12 -8 At 2.5V DC, f = 1MHz, 39 47 V V pF C Note 1: TA=25° unless otherwise specified. GND in this document refers to the lower supply voltage. C Note 2: ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground. Rev. 3 | Page 3 of 8 | www.onsemi.com CM1205 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50µm +20µm 60 seconds 260ûC Figure 3. Recommended Non-Solder Mask Defined Pad Illustration Rev. 3 | Page 4 of 8 | www.onsemi.com CM1205 Figure 4. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 5 of 8 | www.onsemi.com CM1205 Mechanical Details The CM1205 is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. PACKAGE DIMENSions Package Bumps Dim Millimeters Min A1 A2 B1 B2 C1 C2 D1 D2 Nom Max Custom CSP 10 Inches Min Nom Max 1.109 1.154 1.199 0.0437 0.0454 0.0472 3.059 3.104 3.149 0.1204 0.1222 0.1240 0.645 0.650 0.655 0.0254 0.0256 0.0258 0.645 0.650 0.655 0.0254 0.0256 0.0258 0.202 0.252 0.302 0.0080 0.0099 0.0119 0.202 0.252 0.302 0.0080 0.0099 0.0119 0.612 0.682 0.751 0.0241 0.0268 0.0296 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces Package Dimensions for CM1205 Chip Scale Package # per tape and reel Controlling dimension: millimeters Rev. 3 | Page 6 of 8 | www.onsemi.com CM1205 CSP Tape and Reel Specifications POCKET SIZE (mm) TAPE WIDTH B0 X A0 X K0 W 3.28 X 1.32 X 0.81 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 PART NUMBER CM1205-08CP CHIP SIZE (mm) 3.104 X 1.154 X 0.682 P0 4mm P1 4mm Figure 5. Tape and Reel Mechanical Data Rev. 3 | Page 7 of 8 | www.onsemi.com CM1205 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 For additional information, please contact your local Sales Representative Order Literature: http://www.onsemi.com/orderlit ON Semiconductor Website: www.onsemi.com Rev. 3 | Page 8 of 8 | www.onsemi.com