CM1230

2, 4, and 8-Channel Low-Capacitance ESD Protection Array CM1230 Features • • Two, four, and eight channels of ESD protection Provides ESD protection to IEC61000-4-2 Level 4 • ±8kV contact discharge • ±15kV air discharge Low loading capacitance of 0.8pF typical Minimal capacitance change with temperature and voltage Channel I/O to GND capacitance difference of 0.02pF typical is ideal for differential signals Channel I/O to I/O capacitance 0.15pF typical Zener diode protects supply rail and eliminates the need for external by-pass capacitors Each I/O pin can withstand over 1000 ESD strikes* Available in 4, 6 and 10 bump Chip Scale Packages (CSP) OptiGuard™ coated for improved reliability at assembly RoHS-compliant, lead-free version finishing Product Description The CM1230 is a family of 2, 4 and 8 channel, very low capacitance ESD protection diode arrays in a CSP form factor. It is ideal for protecting systems with high data and clock rates or for circuits that need low capacitive loading. Each channel consists of a pair of ESD diodes that act as clamp diodes to steer ESD current pulses to either the positive or negative supply rail. A zener diode is integrated between the positive and negative supply rails. The VCC rail is protected from ESD strikes and eliminates the need for a bypass capacitor to absorb positive ESD strikes to ground. Each channel can safely dissipate ESD strikes of ±8kV, meeting the Level 4 requirement of the IEC61000-4-2 international standard as well as ±15kV air discharges per the IEC61000-4-2 specification. Using the MIL-STD883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±15kV. This device is well-suited for next generation wireless handsets that implement high-speed serial interface solutions for the LCD display and camera interfaces. In these designs, a tolerance above 1.5pF cannot be tolerated when high data rates are transferred between the baseband choppiest and the LCD driver/controller Is. Higher capacitive loading normally causes the rise and fall times to slow which hampers the functionality of circuit and operation of the wireless handset. The CM1230 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1230 is available in a space-saving, low profile Chip Scale Package with RoHS-compliant, lead-free finishing. • • • • • • • • • Applications • • LCD and camera data lines in wireless handsets that use high-speed serial interfaces. I/O port protection for mobile handsets, notebook computers, DSCs, MP3 players, PDAs, etc. including USB, 1394 and serial ATA Wireless handsets Handheld PCs/PDAs LCD and camera modules • • • ©2010 SCILLC. All rights reserved. May 2010 – Rev. 2 Publication Order Number: CM1230/D CM1230 *Standard test condition is IEC61000-4-2 level 4 test circuit with each (A continuous test run. OUT /BOUT) pin subjected to ±12kV contact discharge for 1000 pulses. Discharges are timed at 1 second intervals and all 1000 strikes are completed in one Rev.3 | Page 2 of 16 | www.onsemi.com CM1230 Ordering Information PART NUMBERING INFORMATION # of Channels 2 2 4 8 Bumps 4 4 6 10 Package CSP-4 CSP-4 CSP-6 CSP-10 Ordering Part Number1 CM1230-02CP CM1230-J2CP CM1230-04CP CM1230-08CP Part Marking L L L30 L308 Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Pin Descriptions 2-CHANNEL, 4-BUMP CSP PI N A1 B1 A2 B2 NAME VN CH2 CH1 VP TYPE GND I/O I/O PWR DESCRIPTION Negative voltage supply rail ESD Channel ESD Channel Positive voltage supply rail PI N A1 B1 A2 B2 A3 B3 A4 B4 A5 B5 8-CHANNEL, 10-BUMP CSP NAME CH1 CH2 CH3 CH4 VP VN CH5 CH6 CH7 CH8 TYPE I/O I/O I/O I/O PWR GND I/O I/O I/O I/O DESCRIPTION ESD Channel ESD Channel ESD Channel ESD Channel Positive voltage supply rail Negative voltage supply rail ESD Channel ESD Channel ESD Channel ESD Channel 4-CHANNEL, 6-BUMP CSP PI N A1 B1 A2 B2 A3 B3 NAME CH1 CH2 VP VN CH3 CH4 TYPE I/O I/O PWR GND I/O I/O DESCRIPTION ESD Channel ESD Channel Positive voltage supply rail Negative voltage supply rail ESD Channel ESD Channel Rev. 3 | Page 3 of 16 | www.onsemi.com CM1230 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Operating Supply Voltage (VP - VN) Operating Temperature Range Storage Temperature Range DC Voltage at any channel input RATING 6.0 -40 to +85 -65 to +150 (VN - 0.5) to (VP + 0.5) UNITS V °C °C V STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C Rev.3 | Page 4 of 16 | www.onsemi.com CM1230 ELECTRICAL OPERATING CHARACTERISTICS(SEE NOTE 1) SYMBOL PARAMETER VP IP VF Operating Supply Voltage (VP-VN) Operating Supply Current Diode Forward Voltage Top Diode Bottom Diode Channel Leakage Current Channel Input Capacitance Channel Input Capacitance Matching Mutual Capacitance between signal pin and adjacent signal pin In-system ESD Protection Peak Discharge Voltage at any channel input, in system a) Contact discharge per IEC 61000-4-2 standard b) Human Body Model, MILSTD-883, Method 3015 Channel Clamp Voltage Positive Transients Negative Transients Dynamic Resistance Positive Transients Negative Transients Note 1: Note 2: Note 3: Note 4: Note 5: CONDITIONS MIN TYP 3.3 MAX 5.5 8.0 UNITS V μA V V μA pF pF pF (VP-VN)=3.3V IF = 8mA; TA=25°C 0.60 0.60 TA=25°C; VP=5V, VN=0V, VIN = 0V to 5V At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V 0.80 0.80 ±0.1 0.8 0.02 0.15 0.95 0.95 ±1.0 1.20 ILEAK CIN ΔC IN CMUTUAL VESD Notes 3 and 4; TA=25°C Notes 2 and 4; TA=25°C TA=25°C, IPP = 1A, tP = 8/20μS; Note 4 IPP = 1A, tP = 8/20μS Any I/O pin to Ground; Note 4 ±8 ±15 kV kV VCL +9.8 -1.8 0.76 0.56 V V Ω Ω RDYN All parameters specified at TA = -40°C to +85°C unless otherwise noted. Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded. Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded. These measurements performed with no external capacitor on VP. Measured under pulsed conditions, pulse width = 0.7ms, maximum current = 1.5A. Rev. 3 | Page 5 of 16 | www.onsemi.com CM1230 Performance Information Input Channel Capacitance Performance Curves Rev.3 | Page 6 of 16 | www.onsemi.com CM1230 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Insertion Loss VS. Frequency (0V DC Bias, VP=3.3V) Insertion Loss VS. Frequency (2.5V DC Bias, VP=3.3V) Rev. 3 | Page 7 of 16 | www.onsemi.com CM1230 Application Information PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 260°C N on-Solder M ask D efined Pad 0.240m D m IA. Solder Stencil Opening 0.300m D m IA. Solder Mask Opening 0.290m D m IA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev.3 | Page 8 of 16 | www.onsemi.com CM1230 Mechanical Details CSP-4 Mechanical Specifications (CM1230-02CP) The CM1230-02CP is supplied in a 4 bump Chip Scale Package (CSP). Dimensions are shown below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Bumps Millimeters Dim Min A1 A2 B1 B2 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 4 Inches 0.915 0.960 1.005 0.0360 0.0378 0.0396 0.915 0.960 1.005 0.0360 0.0378 0.0396 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces Package Dimensions for CM1230-02CP Chip Scale Package # per tape and reel Controlling dimension: millimeters Rev. 3 | Page 9 of 16 | www.onsemi.com CM1230 CSP Tape and Reel Specifications PART NUMBER CM1230-02CP* CHIP SIZE (mm) 0.96 x 0.96 x 0.644 POCKET SIZE (mm) B0 X A0 X K0 1.14 x 1.00 x 0.70 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm Figure 3. Tape and Reel Mechanical Data* * CM1230-02CP and CM1230-J2CP are the same mechanical package. The only difference is the Pin 1 orientation (red dot) on the tape and reel. Rev.3 | Page 10 of 16 | www.onsemi.com CM1230 Mechanical Details (cont’d) CSP-4 Mechanical Specifications (CM1230-J2CP) The CM1230-J2CP is supplied in a 4 bump Chip Scale Package (CSP). Dimensions are shown below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Bumps Millimeters Dim Min A1 A2 B1 B2 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 4 Inches 0.915 0.960 1.005 0.0360 0.0378 0.0396 0.915 0.960 1.005 0.0360 0.0378 0.0396 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces Package Dimensions for CM1230-J2CP Chip Scale Package # per tape and reel Controlling dimension: millimeters Rev. 3 | Page 11 of 16 | www.onsemi.com CM1230 CSP Tape and Reel Specifications PART NUMBER CM1230-J2CP* CHIP SIZE (mm) 0.96 x 0.96 x 0.644 POCKET SIZE (mm) B0 X A0 X K0 1.14 x 1.00 x 0.70 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm Figure 4. Tape and Reel Mechanical Data* *CM1230-02CP and CM1230-J2CP are the same mechanical package. Only difference is the Pin 1 orientation (red dot) on the tape and reel. Rev.3 | Page 12 of 16 | www.onsemi.com CM1230 Mechanical Details (cont’d) CSP-6 Mechanical Specifications The CM1230-04CP is supplied in a 6 bump Chip Scale Package (CSP). Dimensions are shown below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Bumps Millimeters Dim Min A1 A2 B1 B2 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 6 Inches 0.915 0.960 1.005 0.0360 0.0378 0.0396 1.415 1.460 1.505 0.0557 0.0575 0.0593 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces Package Dimensions for CM1230-04CP Chip Scale Package # per tape and reel Controlling dimension: millimeters Rev. 3 | Page 13 of 16 | www.onsemi.com CM1230 CSP Tape and Reel Specifications PART NUMBER CM1230-04CP CHIP SIZE (mm) 1.46 x 0.96 x 0.644 POCKET SIZE (mm) B0 X A0 X K0 1.72 x 1.17 x 0.73 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm Figure 5. Tape and Reel Mechanical Data Rev.3 | Page 14 of 16 | www.onsemi.com CM1230 Mechanical Details (cont’d) CSP-10 Mechanical Specifications The CM1230-08CP is supplied in a 10 bump Chip Scale Package (CSP). Dimensions are shown below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. Controlling dimension: millimeters PACKAGE DIMENSIONS Package Bumps Millimeters Dim Min A1 A2 B1 B2 C1 C2 D1 D2 0.915 2.415 0.495 0.495 0.180 0.180 0.575 0.368 Nom 0.960 2.460 0.500 0.500 0.230 0.230 0.644 0.419 Max 1.005 2.505 0.505 0.505 0.280 0.280 0.714 0.470 Min Nom Max Custom CSP 10 Inches 0.0360 0.0378 0.0396 0.0951 0.0969 0.0986 0.0195 0.0197 0.0199 0.0195 0.0197 0.0199 0.0071 0.0091 0.0110 0.0071 0.0091 0.0110 0.0226 0.0254 0.0281 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces Package Dimensions for CM1230-08CP Chip Scale Package Rev. 3 | Page 15 of 16 | www.onsemi.com CM1230 CSP Tape and Reel Specifications PART NUMBER CM1230-08CP CHIP SIZE (mm) 2.46 x 0.96 x 0.644 POCKET SIZE (mm) B0 X A0 X K0 2.62 x 1.12 x 0.76 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm Figure 6. Tape and Reel Mechanical Data ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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