6 Channel EMI Filter Array with ESD Protection CM1400-03
Features
• • • • • • • • • • Functionally and pin compatible with CSPEMI306A device OptiGuard™ coated for improved reliability at assembly Six channels of EMI filtering for data ports Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network 40dB absolute attenuation (typical) at 1 GHz 35dB attenuation (typical) at 1 GHz relative to pass band ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance RoHS compliant (lead-free) finishing
Product Description
The CM1400-03 is a six channel low-pass filter array that reduces EMI/RFI emissions while at the same time providing ESD protection. It is used on data ports on mobile devices. To reduce EMI/RFI emissions, the CM1400-03 integrates a pi-style filter (C-R-C) for each of the 6 channels. Each high quality filter provides greater than 30dB attenuation in the 800-2700 MHz range relative to the pass band attenuation. These pi-style filters also support bidirectional filtering, controlling EMI both to and from a data port connector. In addition, the CM1400-03 provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of ±15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±30kV. The CM1400-03 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CM1400-03 incorporates OptiGuard™ coating which results in improved reliability at assembly. The CM1400-03 is available in a space-saving, low-profile chip scale package with RoHS compliant lead-free finishing.
•
Applications
• • • • • • EMI filtering and ESD protection for both data and I/O ports Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs
©2010 SCILLC. All rights reserved. April 2010 Rev. 3
Publication Order Number: CM1400-03/D
CM1400-03
Block Diagram
Package/Pinout Diagrams
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CM1400-03
PIN DESCRIPTIONS
PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 C1 C2 C3 C4 C5 C6 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 GND FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Device Ground Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6
Ordering Information
PART NUMBERING INFORMATION
Bumps 15 Package CSP Ordering Part Number1 CM1400-03CP Part Marking N003
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
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CM1400-03
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 600 UNITS °C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C
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CM1400-03
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL R C TCR TCC VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Temperature Coefficient of Resistance Temperature Coefficient of Capacitance Diode Voltage (reverse bias) Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω At 2.5V DC IDIODE=10μA VDIODE=3.3V ILOAD = 10mA 5.6 -1.5 Note 2 ±30 ±15 Notes 2 and 3 +10 -5 R=100Ω, C=30pF 58 MHz V V kV kV 6.8 -0.8 9.0 -0.4 V V At 2.5V DC CONDITIONS MIN 80 24 TYP 100 30 1200 -300 6.0 100 MAX 120 36 UNITS Ω pF ppm/°C ppm/°C V nA
VESD
VCL
f
C
Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1.
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CM1400-03
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B2)
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CM1400-03
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
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CM1400-03
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B2)
Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B2)
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CM1400-03
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 7. Comparison of Filter Response Curves for CM1400-03 with DC Bias
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CM1400-03
Performance Information (cont’d)
Figure 8. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C)
Figure 9. Resistance vs. Temperature (normalized to resistance at 25°C)
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CM1400-03
Application Information
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 260°C
N on-Solder M ask D efined Pad 0.240m D m IA.
Solder Stencil Opening 0.300m D m IA.
Solder Mask Opening 0.290m D m IA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
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CM1400-03
Mechanical Details
CSP Mechanical Specifications The CM1400-03 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below.
PACKAGE DIMENSIONS
Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 15 Inches
2.915 2.960 3.005 0.1148 0.1165 0.1183 1.285 1.330 1.375 0.0506 0.0524 0.0541 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces
Package Dimensions for CM1400-03 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
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CM1400-03
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 3.10 X 1.45 X 0.74 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500
PART NUMBER CM1400-03
CHIP SIZE (mm) 2.96 X 1.33 X 0.644
P0 4mm
P1 4mm
Figure 12. Tape and Reel Mechanical Data
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CM1400-03
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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