LCD EMI Filter Array with ESD Protection CM1405
Features
• • • • • Eight channels of EMI filtering 30kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) 30kV ESD protection on each channel (HBM) Better than 35dB of attenuation at 800-2700MHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package OptiGuard™ coated version available for improved reliability at assembly RoHS-compliant, lead-free finishing
Product Description
California Micro Device's CM1405 is an EMI filter array with ESD protection, which integrates eight Pifilters (C-R-C). The CM1405 has component values of 25pF-100W-25pF. The parts include avalanchetype ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of •30kV, exceeding the maximum requirement of the IEC61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than •30kV. This device is particularly well-suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easyto-use pin assignments. In particular, the CM1405 is ideal for EMI filtering and protecting data lines from ESD for the LCD display in mobile handsets. The CM1405-03 incorporates OptiGuardä coating which results in improved reliability at assembly and is available in space-saving, low-profile chip-scale packages with RoHS-compliant, lead-free finishing. The CM1400-03 incorporates OptiGuard™ coating which results in improved reliability at assembly. The CM1400-03 is available in a space-saving, low-profile chip scale package with RoHS compliant lead-free finishing.
• • •
Applications
• • • • • • • LCD data lines in mobile handsets EMI filtering & ESD protection for high-speed I/O ports EMI filtering for high-speed data lines Wireless handsets Cell phones Notebook computers PDAs / Handheld PCs
©2010 SCILLC. All rights reserved. April 2010 Rev.2
Publication Order Number: CM1405/D
CM1405
Block Diagram
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CM1405
PIN DESCRIPTIONS
PIN(s) A1 A2 A3 A4 A5 A6 A7 A8 B1-B4 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 GND DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Filter Channel 7 Filter Channel 8 Device Ground PIN(s) C1 C2 C3 C4 C5 C6 C7 C8 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Filter Channel 7 Filter Channel 8
Ordering Information
PART NUMBERING INFORMATION
Standard Finish No Coating Ordering Part 1 Number CM1405-01CS Part Marking N051 Optiguard
TM
Lead-free Finish Coated Part Marking N053 -No Coating Ordering Part 1 Number CM1405-01CP Part Marking N051
2
Optiguard
TM
Coated Part Marking N053
Bumps 20
PKG CSP
Ordering Part 1 Number CM1405-03CS
Ordering Part 1 Number CM1405-03CP
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS °C mW mW
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CM1405
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL R C PARAMETER Resistance Capacitance At 2.5V DC, 1MHz, 30mV AC IDIODE = 10μA VDIODE = +3.3V CONDITIONS MIN 80 20 TYP 100 25 MAX 120 30 UNITS Ω pF
VDIODE ILEAK VSIG
Diode Standoff Voltage Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω
6.0 0.1 1
V μA
ILOAD = 10mA ILOAD = -10mA Note 2
5.6 -1.5
6.8 -0.8
9.0 -0.4
V V
VESD
30 30
kV kV
RDYN
1.5 0.9 R = 100Ω, C = 25pF 70
Ω Ω MHz
f
C
Note 1: TA = 25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time.
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CM1405
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. A1-C1 EMI Filter Performance
Figure 2. A2-C2 EMI Filter Performance
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CM1405
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. A3-C3 EMI Filter Performance
Figure 4. A4-C4 EMI Filter Performance
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CM1405
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 5. A5-C5 EMI Filter Performance
Figure 6. A6-C6 EMI Filter Performance
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CM1405
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 7. A7-C7 EMI Filter Performance
Figure 8. A8-C8 EMI Filter Performance
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CM1405
Performance Information (cont’d)
Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) Figure 9.
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CM1405
Application Information
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 260°C
N on-Solder M ask D efined Pad 0.240m D m IA.
Solder Stencil Opening 0.300m D m IA.
Solder Mask Opening 0.290m D m IA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
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CM1405
Mechanical Details
CM1405-01 Mechanical Specifications The package dimensions for the CM1405-01 are presented below.
PACKAGE DIMENSIONS
Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 20 Inches
3.955 4.000 4.045 0.1557 0.1575 0.1593 1.413 1.458 1.503 0.0556 0.0574 0.0592 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.200 0.250 0.300 0.0079 0.0098 0.0118 0.244 0.294 0.344 0.0096 0.0116 0.0135 0.562 0.606 0.650 0.0221 0.0239 0.0256 0.356 0.381 0.406 0.0140 0.0150 0.0160 3500 pieces
Package Dimensions for CM1405-01 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
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CM1405
Mechanical Details (cont’d)
CM1405-03 Mechanical Specifications The package dimensions for the CM1405-03 are presented below.
PACKAGE DIMENSIONS
Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 20 Inches
3.955 4.000 4.045 0.1557 0.1575 0.1593 1.413 1.458 1.503 0.0556 0.0574 0.0592 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.200 0.250 0.300 0.0079 0.0098 0.0118 0.244 0.294 0.344 0.0096 0.0116 0.0135 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces
Package Dimensions for CM1405-03 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
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CM1405
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 4.11 X 1.57 X 0.76 4.11 X 1.57 X 0.76 TAPE WIDTH W 12mm 12mm REEL DIAMETER 330mm (13") 330mm (13") QTY PER REEL 3500 3500
PART NUMBER CM1405-01 CM1405-03
CHIP SIZE (mm) 4.00 X 1.46 X 0.606 4.00 X 1.46 X 0.644
P0 4mm 4mm
P1 4mm 4mm
Figure 13. Tape and Reel Mechanical Data
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CM1405
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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