CM1412

2-Channel Headset/Microphone EMI Filter Array with ESD Protection CM1412 Features • • • • • • • • • Functionally and pin compatible with CMD’s CSPEMI202A OptiGuard™ coated for improved reliability at assembly Two channels of EMI filtering Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network Greater than 40dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) Supports AC signals—ideal for audio applications Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 5-bump, 0.930mm X 1.410mm footprint Chip Scale Package (CSP) Lead-free RoHS compliant Product Description The CM1412 is a dual, low-pass filter array integrating two pi-style filters (C-R-C) that reduce EMI/RFI emissions while providing ESD protection. This part is custom-designed to interface with a microphone port on a cellular telephone or similar device. Each high quality filter provides more than 35dB attenuation in the 800 to 2700 MHz range. These pi-style filters support bidirectional filtering that control EMI both to and from a microphone element. They also support AC signals, enabling audio signals to pass through without distortion. In addition, the CM1412 provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CM1412 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CM1412 incorporates OptiGuard™ coating which results in improved reliability at assembly and is available in a space-saving, lowprofile Chip Scale Package with lead-free finishing. • • Applications • • • • • • • EMI filtering and ESD protection for headset microphone ports Wireless handsets Handheld PCs / PDAs MP3 players Digital camcorders Notebooks Desktop PCs ©2010 SCILLC. All rights reserved. April 2010 Rev. 3 Publication Order Number: CM1412/D CM1412 Block Diagram PIN DESCRIPTIONS PIN A1 A3 B2 C1 C3 NAME MIC_IN1 MIC_IN2 GND MIC_OUT1 MIC_OUT2 DESCRIPTION Microphone Input 1 (from microphone) Microphone Input 2 (from microphone) Device Ground Microphone Output 1 (to audio circuitry) Microphone Output 2 (to audio circuitry) Rev. 3 | Page 2 of 9 | www.onsemi.com CM1412 Ordering Information PART NUMBERING INFORMATION Lead-free Finish Bumps 5 Package CSP Ordering Part Number1 CM1412-03CP Part Marking CB Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 200 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C Rev. 3 | Page 3 of 9 | www.onsemi.com CM1412 ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL R RMATCH C ILEAK VSIG PARAMETER Resistance Resistance Matching Capacitance Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω VIN=5.0V ILOAD = 10mA 5 -15 Notes 2 and 4 ±15 ±8 Notes 2,3 and 4 +15 -19 R = 68Ω, C = 47pF 60 V V MHz kV kV 7 -10 15 -5 V V 38 47 CONDITIONS MIN 61 TYP 68 MAX 75 5 56 1.0 UNITS Ω % pF μA VESD VCL fC Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open. Rev. 3 | Page 4 of 9 | www.onsemi.com CM1412 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2) Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2) Rev. 3 | Page 5 of 9 | www.onsemi.com CM1412 Application Information PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 260°C N on-Solder M ask D efined Pad 0.240m D m IA. Solder Stencil Opening 0.300m D m IA. Solder Mask Opening 0.290m D m IA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 6 of 9 | www.onsemi.com CM1412 Mechanical Details CSP Mechanical Specifications The CM1411 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. PACKAGE DIMENSIONS Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 5 Inches 0.885 0.930 0.975 0.0348 0.0366 0.0384 1.365 1.410 1.455 0.0537 0.0555 0.0573 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.165 0.215 0.265 0.0065 0.0085 0.0104 0.220 0.270 0.320 0.0087 0.0106 0.0126 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces Package Dimensions for CM1412 Chip Scale Package # per tape and reel Controlling dimension: millimeters Rev. 3 | Page 7 of 9 | www.onsemi.com CM1412 CSP Tape and Reel Specifications POCKET SIZE (mm) TAPE WIDTH B0 X A0 X K0 W 1.52 X 1.07 X 0.720 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 PART NUMBER CM1412 CHIP SIZE (mm) 1.41 X 0.95 X 0.644 P0 4mm P1 4mm Figure 5. Tape and Reel Mechanical Data Rev. 3 | Page 8 of 9 | www.onsemi.com CM1412 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative Rev. 3 | Page 9 of 9 | www.onsemi.com