CM1416

Headset/Speaker EMI Filter with ESD Protection CM1416 Features • • • • • • • • • Functionally and pin compatible with the CSPEMI201A and CM1411 OptiGuard™ coated for improved reliability at assembly Two channels of EMI filtering for 8Ω speakers Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network Greater than 30dB attenuation at 1GHz ±30kV ESD protection on each channel per IEC 61000-4-2 Level 4, contact discharge Extremely low lead inductance for optimum filter and ESD performance 5-bump, 0.96mm X 1.33mm footprint Chip Scale Package (CSP) RoHS-compliant, lead-free finishing Product Description The CM1416 is an EMI filter array with ESD protection, which integrates two Pi-filters (C-R-C). The CM1416 has component values of 117pF-2Ω117pF. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes safely dissipate ESD strikes of ±30kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body Model (HBM) ESD, these devices protect for contact discharges at greater than ±30kV. This device is well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easy-to-use pin assignments. In particular, the CM1416 is ideal for filtering unwanted EMI-induced noise and providing ESD protection for headset speaker port applications in wireless handsets with 8Ω speakers. The CM1416 incorporates OptiGuard™ coating which results in improved reliability at assembly. The CM1416 is available in a space saving, low profile Chip Scale Package with RoHS-compliant, lead-free finishing. Applications • • • Headset Speaker port in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. ©2010 SCILLC. All rights reserved. April 2010 Rev. 2 Publication Order Number: CM1416/D CM1416 Block Diagram Rev. 2 | Page 2 of 9 | www.onsemi.com CM1416 PIN DESCRIPTIONS PIN A1 A3 B2 C1 C3 NAME FILTER1 FILTER2 GND FILTER1 FILTER2 DESCRIPTION EMI FIlter 1 EMI FIlter 2 Device Ground EMI FIlter 1 EMI FIlter 2 Ordering Information PART NUMBERING INFORMATION Lead-free Finish Pins 5 Package CSP Ordering Part Number1 CM1416-03CP Part Marking CJ Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor (note 5) DC Package Power Rating (note 5) RATING -65 to +150 100 500 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C Rev. 2 | Page 3 of 9 | www.onsemi.com CM1416 ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL R CTOT C1 VDIODE ILEAK PARAMETER R1 Resistance Total Channel Capacitance At 2.5VDC, 1MHz, 30mVAC At 2.5VDC, 1MHz, 30mVAC IDIODE = 10μA VIN= 3.3V (reverse bias voltage) 187 CONDITIONS MIN TYP 2 234 281 MAX UNITS Ω pF C1 Capacitance 93 117 140 pF Diode Standoff Voltage Diode Leakage Current 6.0 0.1 2 V μA VSIG Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω ILOAD = 10mA ILOAD = -10mA Note 2 6.4 -9.8 7.6 -7.6 9.8 -6.4 V V VESD ±30 ±30 kV kV RDYN 0.95 0.90 R = 2Ω, C = 117pF 21 Ω Ω MHz fC Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Rev. 2 | Page 4 of 9 | www.onsemi.com CM1416 Performance Information Figure 1. Typical EMI FIlter Performance (0VDC, 50 Ohm Environment) Figure 2. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC) Rev. 2 | Page 5 of 9 | www.onsemi.com CM1416 Application Information PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 260°C N on-Solder M ask D efined Pad 0.240m D m IA. Solder Stencil Opening 0.300m D m IA. Solder Mask Opening 0.290m D m IA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 6 of 9 | www.onsemi.com CM1416 Mechanical Details CSP Mechanical Specifications The CM1416 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. PACKAGE DIMENSIONS Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min Nom Max Custom CSP 5 Inches 0.955 1.000 1.045 0.0376 0.0394 0.0411 1.325 1.370 1.415 0.0522 0.0539 0.0557 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.200 0.250 0.300 0.0079 0.0098 0.0118 0.200 0.250 0.300 0.0079 0.0098 0.0118 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces Package Dimensions for CM1416 Chip Scale Package # per tape and reel Controlling dimension: millimeters Rev. 2 | Page 7 of 9 | www.onsemi.com CM1416 CSP Tape and Reel Specifications POCKET SIZE (mm) B0 X A0 X K0 1.42 x 1.07 x 0.74 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 PART NUMBER CM1416 CHIP SIZE (mm) 1.33 x 0.96 x 0.644 P0 4mm P1 4mm Figure 5. Tape and Reel Mechanical Data Rev. 2 | Page 8 of 9 | www.onsemi.com CM1416 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. 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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative Rev. 2 | Page 9 of 9 | www.onsemi.com