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CM1419-02CP

CM1419-02CP

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    WLCSP5

  • 描述:

    L-C EMI FILTER W/ESD

  • 数据手册
  • 价格&库存
CM1419-02CP 数据手册
CM1419 Praetoriant L-C EMI Filter with ESD Protection for Headset Speakers Product Description The CM1419 is an L−C EMI filter array with ESD protection that integrates two Pi−filters (C−L−C) for a headset speaker. The CM1419 has component values of 117 pF/3.0 nH/117 pF. The parts include ESD protection diodes on all input/output pins, and provide a very high level of protection for sensitive electronic components against possible electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±30 kV, which is beyond the maximum requirement of the IEC61000−4−2 international standard. In accordance with MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy−to−use pin assignments. In particular, the CM1419 is ideal for EMI filtering and protecting speaker output lines of the headset speaker from ESD in mobile handsets. Most speakers have an impedance of 8 W. However, to maximize the power output, the resistance of an EMI filter needs to be as low as possible. The CM1419 addresses this by using a C−L−C based EMI filter with an inductor having less than 0.35 W of resistance. The CM1419 comes with OptiGuardt coating resulting in improved reliability at assembly. The CM1419 is housed in a space saving, low profile Chip Scale Package with RoHS−compliant, lead−free finishing. http://onsemi.com WLCSP5 CP SUFFIX CASE 567BA BLOCK DIAGRAM 3 nH A1 FILTER #1 A3 FILTER #1 117 pF 117 pF GND A2 3 nH B1 FILTER #2 B3 FILTER #2 117 pF 117 pF GND B2 MARKING DIAGRAM Features • • • • • • • Two Channels of EMI Filtering ±30 kV ESD Protection (IEC 61000−4−2, Contact Discharge) ±30 kV ESD Protection (HBM) OptiGuardt Coating for Improved Reliability at Assembly Greater than 30 dB of Attenuation at 1 GHz 5−Bump, 1.590 mm X 1.220 mm Footprint Chip Scale Package (CSP) These Devices are Pb−Free and are RoHS Compliant Applications • Headset Speaker Port in Mobile Handsets • I/O Port Protection for Mobile Handsets, Notebook Computers, PDAs etc. CH CH = CM1419−02CP ORDERING INFORMATION Device Package Shipping† CM1419−02CP WLCSP5 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. • EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook Computers © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 4 1 Publication Order Number: CM1419/D CM1419 PACKAGE/PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS Pin Name A1 Filter #1 Filter #1 Input A3 Filter #1 Filter #1 Input C1 Filter #2 Filter #2 Input C3 Filter #2 Filter #2 Input B2 GND Description Top View (Bumps Down View) Orientation Marking A B C Device Ground + 1 2 Bottom View (Bumps Up View) 3 C1 C3 B2 CH A1 A1 A3 Orientation Marking CM1419 WLCSP5 Package SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units −65 to +150 °C DC Current per Inductor 500 mA DC Package Power Rating 0.5 W Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units –40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Parameter Symbol Conditions Min Typ Max Units L Inductance 3.0 R DC Channel Resistance 0.28 0.35 W CTOT nH Total Channel Capacitance 2.5 V DC, 1 MHz, 30 mV AC 187 234 281 pF C1 Capacitance C1 2.5 V DC, 1 MHz, 30 mV AC 93 117 140 pF VST Stand−off Voltage I = 10 mA 6.0 ILEAK Diode Leakage Current VIN = 3.3 V 0.1 1.0 VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA 6.8 −6.8 9.0 −5.6 VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 RDYN Dynamic Resistance Positive Negative fC (Note 2) 5.6 −9.0 L = 3 nH, C = 117 pF Cut−off Frequency, ZSOURCE = 50 W, ZLOAD = 50 W http://onsemi.com 2 mA V kV ±30 ±30 0.95 0.90 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. V 22 W MHz CM1419 PERFORMANCE INFORMATION Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) −5 −10 Insertion Loss (dB) −15 −20 −25 −30 −35 −40 −45 −50 3 10 100 1000 6000 Frequency (MHz) Figure 1. Insertion Loss vs. Frequency (Filter #1 to GND B2) −5 −10 Insertion Loss (dB) −15 −20 −25 −30 −35 −40 −45 −50 3 10 100 1000 6000 Frequency (MHz) Figure 2. Insertion Loss vs. Frequency (Filter #2 to GND B2) http://onsemi.com 3 CM1419 PERFORMANCE INFORMATION (Cont’d) Figure 3. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5 V DC) http://onsemi.com 4 CM1419 APPLICATION INFORMATION Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 mm − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 4. Recommended Non−Solder Mask Defined Pad Illustration Temperature (5C) 250 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 5. Lead−free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 5 CM1419 PACKAGE DIMENSIONS WLCSP5, 1.59x1.22 CASE 567BA−01 ISSUE O È È PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C D A E ÉÉÉÉ ÉÉÉÉ OptiGuard Option 0.05 C 5X A1 A2 SIDE VIEW eD eE/2 0.50 PITCH SEATING PLANE A1 0.25 PITCH 0.44 A 0.25 0.44 DIMENSIONS: MILLIMETERS eE 2 PACKAGE OUTLINE 5X C B 1 MILLIMETERS MIN MAX 0.56 0.72 0.21 0.27 0.40 REF 0.29 0.35 1.59 BSC 1.22 BSC 0.435 BSC 0.50 BSC RECOMMENDED SOLDERING FOOTPRINT* A C b 0.05 C A B 0.03 C DIM A A1 A2 b D E eD eE TOP VIEW 0.05 C NOTE 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 3 BOTTOM VIEW Praetorian and OptiGuard are trademarks of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 6 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CM1419/D
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