CM1419
Praetoriant L-C EMI Filter
with ESD Protection for
Headset Speakers
Product Description
The CM1419 is an L−C EMI filter array with ESD protection that
integrates two Pi−filters (C−L−C) for a headset speaker. The CM1419
has component values of 117 pF/3.0 nH/117 pF. The parts include
ESD protection diodes on all input/output pins, and provide a very
high level of protection for sensitive electronic components against
possible electrostatic discharge (ESD). The ESD diodes connected to
the filter ports safely dissipate ESD strikes of ±30 kV, which is beyond
the maximum requirement of the IEC61000−4−2 international
standard. In accordance with MIL−STD−883 (Method 3015)
specification for Human Body Model (HBM) ESD, the pins are
protected for contact discharges at greater than ±30 kV.
This device is particularly well suited for portable electronics
(e.g. mobile handsets, PDAs, notebook computers) because of its
small package format and easy−to−use pin assignments. In particular,
the CM1419 is ideal for EMI filtering and protecting speaker output
lines of the headset speaker from ESD in mobile handsets. Most
speakers have an impedance of 8 W. However, to maximize the power
output, the resistance of an EMI filter needs to be as low as possible.
The CM1419 addresses this by using a C−L−C based EMI filter with
an inductor having less than 0.35 W of resistance.
The CM1419 comes with OptiGuardt coating resulting in
improved reliability at assembly. The CM1419 is housed in a space
saving, low profile Chip Scale Package with RoHS−compliant,
lead−free finishing.
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WLCSP5
CP SUFFIX
CASE 567BA
BLOCK DIAGRAM
3 nH
A1
FILTER #1
A3
FILTER #1
117 pF 117 pF
GND A2
3 nH
B1
FILTER #2
B3
FILTER #2
117 pF 117 pF
GND B2
MARKING DIAGRAM
Features
•
•
•
•
•
•
•
Two Channels of EMI Filtering
±30 kV ESD Protection (IEC 61000−4−2, Contact Discharge)
±30 kV ESD Protection (HBM)
OptiGuardt Coating for Improved Reliability at Assembly
Greater than 30 dB of Attenuation at 1 GHz
5−Bump, 1.590 mm X 1.220 mm Footprint Chip Scale Package
(CSP)
These Devices are Pb−Free and are RoHS Compliant
Applications
• Headset Speaker Port in Mobile Handsets
• I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs etc.
CH
CH
= CM1419−02CP
ORDERING INFORMATION
Device
Package
Shipping†
CM1419−02CP
WLCSP5
(Pb−Free)
3500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
• EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
Computers
© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 4
1
Publication Order Number:
CM1419/D
CM1419
PACKAGE/PINOUT DIAGRAMS
Table 1. PIN DESCRIPTIONS
Pin
Name
A1
Filter #1
Filter #1 Input
A3
Filter #1
Filter #1 Input
C1
Filter #2
Filter #2 Input
C3
Filter #2
Filter #2 Input
B2
GND
Description
Top View
(Bumps Down View)
Orientation
Marking
A
B
C
Device Ground
+
1
2
Bottom View
(Bumps Up View)
3
C1
C3
B2
CH
A1
A1
A3
Orientation
Marking
CM1419
WLCSP5 Package
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
−65 to +150
°C
DC Current per Inductor
500
mA
DC Package Power Rating
0.5
W
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
–40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Parameter
Symbol
Conditions
Min
Typ
Max
Units
L
Inductance
3.0
R
DC Channel Resistance
0.28
0.35
W
CTOT
nH
Total Channel Capacitance
2.5 V DC, 1 MHz, 30 mV AC
187
234
281
pF
C1
Capacitance C1
2.5 V DC, 1 MHz, 30 mV AC
93
117
140
pF
VST
Stand−off Voltage
I = 10 mA
6.0
ILEAK
Diode Leakage Current
VIN = 3.3 V
0.1
1.0
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
ILOAD = −10 mA
6.8
−6.8
9.0
−5.6
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
RDYN
Dynamic Resistance
Positive
Negative
fC
(Note 2)
5.6
−9.0
L = 3 nH, C = 117 pF
Cut−off Frequency, ZSOURCE = 50 W, ZLOAD = 50 W
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2
mA
V
kV
±30
±30
0.95
0.90
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
V
22
W
MHz
CM1419
PERFORMANCE INFORMATION
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
−5
−10
Insertion Loss (dB)
−15
−20
−25
−30
−35
−40
−45
−50
3
10
100
1000
6000
Frequency (MHz)
Figure 1. Insertion Loss vs. Frequency (Filter #1 to GND B2)
−5
−10
Insertion Loss (dB)
−15
−20
−25
−30
−35
−40
−45
−50
3
10
100
1000
6000
Frequency (MHz)
Figure 2. Insertion Loss vs. Frequency (Filter #2 to GND B2)
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3
CM1419
PERFORMANCE INFORMATION (Cont’d)
Figure 3. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5 V DC)
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4
CM1419
APPLICATION INFORMATION
Parameter
Value
Pad Size on PCB
0.240 mm
Pad Shape
Round
Pad Definition
Non−Solder Mask defined pads
Solder Mask Opening
0.290 mm Round
Solder Stencil Thickness
0.125 mm − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300 mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
±50 mm
Solder Ball Side Coplanarity
±20 mm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 4. Recommended Non−Solder Mask Defined Pad Illustration
Temperature (5C)
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 5. Lead−free (SnAgCu) Solder Ball Reflow Profile
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5
CM1419
PACKAGE DIMENSIONS
WLCSP5, 1.59x1.22
CASE 567BA−01
ISSUE O
È
È
PIN A1
REFERENCE
2X
0.05 C
2X
0.05 C
D
A
E
ÉÉÉÉ
ÉÉÉÉ
OptiGuard Option
0.05 C
5X
A1
A2
SIDE VIEW
eD
eE/2
0.50
PITCH
SEATING
PLANE
A1
0.25
PITCH 0.44
A
0.25
0.44
DIMENSIONS: MILLIMETERS
eE
2
PACKAGE
OUTLINE
5X
C
B
1
MILLIMETERS
MIN
MAX
0.56
0.72
0.21
0.27
0.40 REF
0.29
0.35
1.59 BSC
1.22 BSC
0.435 BSC
0.50 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
A
C
b
0.05 C A B
0.03 C
DIM
A
A1
A2
b
D
E
eD
eE
TOP VIEW
0.05 C
NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
3
BOTTOM VIEW
Praetorian and OptiGuard are trademarks of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CM1419/D