CM1420-03CP

DATA SHEET www.onsemi.com LCD EMI Filter Array with ESD Protection WLCSP15 CP SUFFIX CASE 567BS CM1420, CM1422 WLCSP20 CP SUFFIX CASE 567BZ Description The CM1420 and CM1422 are EMI filter arrays with ESD protection, which integrate six and eight Pi−filters (C−R−C), respectively. The CM1420/22 has component values of 15 pF − 100 W − 15 pF. These devices include ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±15 kV, well beyond the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV. This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easy−to−use pin assignments. In particular, the CM1420/22 is ideal for EMI filtering and protecting data lines from ESD for the LCD display in clamshell handsets. The CM1420 and CM1422 incorporate OptiGuard coating which results in improved reliability at assembly. The CM1420 and CM1422 are available in space−saving, low−profile chip scale packages with RoHS compliant lead−free finishing. Features • Functionally and Pin Compatible with CSPEMI606 (CM1420) and MARKING DIAGRAM 1 2 3 4 5 6 7 8 A + GG B N223 C N203 CM1420 15−Bump CSP Package N203 N223 CM1422 20−Bump CSP Package = CM1420−03CP = CM1422−03CP ORDERING INFORMATION Device Package Shipping† CM1420−03CP CSP−15 (Pb−Free) 3500/Tape & Reel CM1422−03CP CSP−20 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. CSPEMI608 (CM1422) Devices • OptiGuard Coated for Improved Reliability at Assembly • Six and Eight Channels of EMI Filtering • ±15 kV ESD Protection on Each Channel (IEC 61000−4−2 Level 4, Contact Discharge) • ±30 kV ESD Protection on Each Channel (HBM) • Better than 30 dB of Attenuation at 1 GHz to 3 GHz • Chip Scale Package Features Extremely Low Lead Inductance for • • • Optimum Filter and ESD Performance 15−Bump, 2.960 mm x 1.330 mm Footprint Chip Scale Package (CM1420) 20−Bump, 4.000 mm x 1.458 mm Footprint Chip Scale Package (CM1422) These Devices are Pb−Free and are RoHS Compliant Applications • • • • • • LCD Data Lines in Clamshell Wireless Handsets EMI Filtering & ESD Protection for High−Speed I/O Data Ports Wireless Handsets / Cell Phones Notebook Computers PDAs / Handheld PCs EMI Filtering for High−Speed Data Lines © Semiconductor Components Industries, LLC, 2011 April, 2022 − Rev. 5 1 Publication Order Number: CM1420/D CONFIDENTIAL AND PROPRIETARY NOT FOR PUBLIC RELEASE CM1420, CM1422 BLOCK DIAGRAM 100 W FILTERn* FILTERn* 15 pF 15 pF GND (Pins B1−Bn) 1 of n EMI Filtering + ESD Channels (n = 6 for CM1420, 8 for CM1422) *See Package/Pinout Diagrams for expanded pin information. PACKAGE / PINOUT DIAGRAMS Orientation Marking Top View (Bumps Down View) + A 1 2 3 4 5 Bottom View (Bumps Up View) 6 C1 N203 B C3 B1 Orientation Marking C C2 C4 C5 B2 C6 B3 A1 A1 A2 A3 A4 A5 A6 C2 C3 C4 C5 C6 C7 CM1420 CSP Package Orientation Marking + A 1 2 4 3 5 6 7 8 C1 N223 B Orientation Marking C B1 A1 A1 B2 A2 A3 B3 A4 A5 C8 B4 A6 A7 A8 CM1422 CSP Package Table 1. PIN DESCRIPTIONS CM1420 CM1422 CM1420 CM1422 Pin(s) Pin(s) Name Pin(s) Pin(s) Name A1 A1 FILTER1 Filter Channel 1 C1 C1 FILTER1 Filter Channel 1 A2 A2 A3 A3 FILTER2 Filter Channel 2 C2 C2 FILTER2 Filter Channel 2 FILTER3 Filter Channel 3 C3 C3 FILTER3 Filter Channel 3 A4 A4 FILTER4 Filter Channel 4 C4 C4 FILTER4 Filter Channel 4 A5 A5 FILTER5 Filter Channel 5 C5 C5 FILTER5 Filter Channel 5 A6 A6 FILTER6 Filter Channel 6 C6 C6 FILTER6 Filter Channel 6 − A7 FILTER7 Filter Channel 7 − C7 FILTER7 Filter Channel 7 − A8 FILTER8 Filter Channel 8 − C8 FILTER8 Filter Channel 8 B1−B3 B1−B4 GND Device Ground Description www.onsemi.com 2 Description CM1420, CM1422 CONFIDENTIAL AND PROPRIETARY NOT FOR PUBLIC RELEASE SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Unit −65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW Storage Temperature Range Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Unit −40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max Unit 80 100 120 W 12 15 18 pF R Resistance C Capacitance At 2.5 V DC, 1 MHz, 30 mV AC Diode Standoff Voltage IDIODE = 10 mA 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE = 3.3 V 100 200 VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA (Note 3) 6.8 −0.8 9.0 −0.4 VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 (Note 2) RDYN Dynamic Resistance Positive Negative VDIODE fC 5.6 −1.5 R = 100 W, C = 15 pF nA V kV ±30 ±15 2.30 0.90 Cut−off Frequency ZSOURCE = 50 W, ZLOAD = 50 W V 120 W MHz 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. www.onsemi.com 3 CONFIDENTIAL AND PROPRIETARY NOT FOR PUBLIC RELEASE CM1420, CM1422 PERFORMANCE INFORMATION Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B1) Figure 2. Insertion Loss vs. Frequency (A2−C2 to GND B1) www.onsemi.com 4 CM1420, CM1422 CONFIDENTIAL AND PROPRIETARY NOT FOR PUBLIC RELEASE PERFORMANCE INFORMATION (continued) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 3. Insertion Loss vs. Frequency (A3−C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4−C4 to GND B2) www.onsemi.com 5 CONFIDENTIAL AND PROPRIETARY NOT FOR PUBLIC RELEASE CM1420, CM1422 PERFORMANCE INFORMATION (continued) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 5. Insertion Loss vs. Frequency (A5−C5 to GND B3) Figure 6. Insertion Loss vs. Frequency (A6−C6 to GND B3) www.onsemi.com 6 CM1420, CM1422 PERFORMANCE INFORMATION (continued) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 7. Insertion Loss vs. Frequency (A7−C7 to GND B4, CM1422 Only) Figure 8. Insertion Loss vs. Frequency (A8−C8 to GND B4, CM1422 Only) www.onsemi.com 7 CONFIDENTIAL AND PROPRIETARY NOT FOR PUBLIC RELEASE CONFIDENTIAL AND PROPRIETARY NOT FOR PUBLIC RELEASE CM1420, CM1422 PERFORMANCE INFORMATION (continued) Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5 VDC and 255C) www.onsemi.com 8 CONFIDENTIAL AND PROPRIETARY NOT FOR PUBLIC RELEASE CM1420, CM1422 APPLICATION INFORMATION Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 10. Recommended Non−Solder Mask Defined Pad Illustration Temperature (5C) 250 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 11. Lead−free (SnAgCu) Solder Ball Reflow Profile www.onsemi.com 9 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP15, 2.96x1.33 CASE 567BS−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X D ÈÈ A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW A2 0.05 C A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 A1 C SIDE VIEW eD/2 15X 0.05 C A B 0.03 C eE C SEATING PLANE PACKAGE OUTLINE A1 0.87 eD b 0.44 15X 0.50 PITCH B A 1 2 3 4 5 6 7 8 9 BOTTOM VIEW DOCUMENT NUMBER: DESCRIPTION: 98AON49826E WLCSP15, 2.96X1.33 MILLIMETERS MIN MAX 0.65 0.56 0.21 0.27 0.40 REF 0.29 0.35 2.96 BSC 1.33 BSC 0.50 BSC 0.435 BSC 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP20, 4.00x1.46 CASE 567BZ−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X D ÈÈ A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW A2 0.05 C MILLIMETERS MIN MAX 0.65 0.56 0.21 0.27 0.40 REF 0.29 0.35 4.00 BSC 1.46 BSC 0.50 BSC 0.435 BSC A 0.05 C NOTE 3 A1 C SIDE VIEW SEATING PLANE eD/2 20X eD b 0.05 C A B 0.03 C eE C B A 1 2 3 4 5 6 7 8 9 10 11 12 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE A1 0.87 0.44 20X 0.50 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON49833E WLCSP20, 4.00X1.46 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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