CM1423-03CP

Secure Digital (SD) Card EMI Filter Array with ESD Protection CM1423 Features • • • • • • • • • Provides EMI filtering and ESD protection for an SD port on a mobile device Six channels of EMI filtering with ESD protection Four channels of ESD protection ±15kV ESD protection on all I/O pins (IEC 610004-2, contact discharge) ±30kV ESD protection (HBM) Better than 25dB of attenuation at 1GHz for 12pF-100Ω -12pF filter configuration Integrates 34 components into small form factor CSP solution 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Available with OptiGuard™ coating for improved reliability at assembly RoHS compliant (lead-free) finishing Product Description The CM1423 is an EMI filter array with ESD protection, which integrates six Pi- filters (C-R-C) and four channels of ESD protection. The CM1423’s filters have component values of 12pF-100Ω-12pF. The part includes ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). All the ESD diodes safely dissipate ESD strikes of ±15kV, beyond the maximum requirement of the IEC 610004-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. This device is particularly well-suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easyto-use pin assignments. In particular, the CM1423 is ideal for EMI filtering and protecting data lines from ESD for the Secure Digital (SD) Card interface slot in mobile handsets. The CM1423 is an all-inclusive solution for the SD card interface since its EMI filters provide the proper cut-off frequency to attenuate unwanted signals. The CM1423 is manufactured in a space-saving, lowprofile, chip-scale package, and is optionally available with OptiGuard™ coating for improved reliability. It is available with RoHS compliant leadfree finishing. • • Applications • • Secure Digital (SD) card data lines in mobile handsets SD card interface protection for other mobile electronics such as MP3 players, PDAs and digital cameras I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. • • ©2010 SCILLC. All rights reserved. April 2010 Rev. 3 Publication Order Number: CM1423/D CM1423 Block Diagram Rev. 3 | Page 2 of 14 | www.onsemi.com CM1423 PIN DESCRIPTIONS PIN(s) A1 A2 A3 A4 A5 A6 A7 A8 B1-B4 NAME DAT2 DAT3 CMD VSS1 CLK ESD DAT0 DAT1 GND DESCRIPTION DATA2 Filter+ESD Channel, System Side DATA3 Filter+ESD Channel, System Side CMD Signal Filter+ESD Channel, System Side ESD-only Channel, Supply Voltage Ground Clock Filter + ESD Channel ESD-only Channel DATA0 Filter+ ESD Channel, System Side DATA1 Filter+ ESD Channel, System Side Device Ground PIN(s) C1 C2 C3 C4 C5 C6 C7 C8 NAME DAT2 DAT3 CMD VDD CLK VSS2 DAT0 DAT1 DESCRIPTION DATA2 Filter+ ESD Channel, SD Card Side DATA3 Filter+ ESD Channel, SD Card Side CMD Signal Filter+ESD Channel, SD Card Side ESD-only Channel, Supply Voltage Clock Filter + ESD Channel ESD-only Channel, Supply Voltage Ground DATA0 Filter+ ESD Channel, SD Card Side DATA1 Filter+ ESD Channel, SD Card Side Ordering Information PART NUMBERING INFORMATION -No Coating Part Marking N231 OptiGuard TM Coated Part Marking N233 Bumps 20 PKG CSP Ordering Part Number CM1423-01CP 1 Ordering Part Number CM1423-03CP 1 Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Rev. 3 | Page 3 of 14 | www.onsemi.com CM1423 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C Rev. 3 | Page 4 of 14 | www.onsemi.com CM1423 ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL R C PARAMETER Resistance Capacitance At 2.5V DC, 1MHz, 30mV AC IDIODE = 10μA VDIODE = 3.3V CONDITIONS MIN 80 9 TYP 100 12 MAX 120 15 UNITS Ω pF VDIODE ILEAK VSIG Diode Standoff Voltage Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω 6.0 100 300 V nA ILOAD = 10mA ILOAD = -10mA Note 2 5.6 -1.5 6.8 -0.8 9.0 -0.4 V V VESD ±30 ±15 kV kV RDYN 1.6 0.4 R = 100Ω, C = 12pF; 145 Ω Ω MHz f C Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Rev. 3 | Page 5 of 14 | www.onsemi.com CM1423 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. A1-C1 EMI Filter Performance Figure 2. A2-C2 EMI Filter Performance Rev. 3 | Page 6 of 14 | www.onsemi.com CM1423 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. A3-C3 EMI Filter Performance Figure 4. A5-C5 EMI Filter Performance Rev. 3 | Page 7 of 14 | www.onsemi.com CM1423 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 5. A7-C7 EMI Filter Performance Figure 6. A8-C8 EMI Filter Performance Rev. 3 | Page 8 of 14 | www.onsemi.com CM1423 Performance Information Figure 7. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) Rev. 3 | Page 9 of 14 | www.onsemi.com CM1423 Application Information Figure 8. Typical SD Card Application Rev. 3 | Page 10 of 14 | www.onsemi.com CM1423 Application Information PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 260°C N on-Solder M ask D efined Pad 0.240m D m IA. Solder Stencil Opening 0.300m D m IA. Solder Mask Opening 0.290m D m IA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 11 of 14 | www.onsemi.com CM1423 Mechanical Details CM1423Mechanical Specifications The package dimensions for the CM1423-01 and the CM1423-03 are presented below. PACKAGE DIMENSIONS Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 D3 D4 Nom Max Min Nom Max Custom CSP 20 Inches 3.955 4.000 4.045 0.1557 0.1575 0.1593 1.413 1.458 1.503 0.0556 0.0574 0.0592 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.200 0.250 0.300 0.0079 0.0098 0.0118 0.244 0.294 0.344 0.0096 0.0116 0.0135 0.562 0.606 0.650 0.0221 0.0239 0.0256 0.356 0.381 0.406 0.0140 0.0150 0.0160 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces Package Dimensions for CM1423 Chip Scale Package # per tape and reel Controlling dimension: millimeters Rev. 3 | Page 12 of 14 | www.onsemi.com CM1423 CSP Tape and Reel Specifications POCKET SIZE (mm) TAPE WIDTH B0 X A0 X K0 W 4.11 X 1.57 X 0.76 4.11 X 1.57 X 0.76 12mm 12mm REEL DIAMETER 330mm (13") 330mm (13") QTY PER REEL 3500 3500 PART NUMBER CM1423-01 CM1423-03 CHIP SIZE (mm) 4.00 X 1.46 X 0.606 4.00 X 1.46 X 0.644 P0 4mm 4mm P1 4mm 4mm + + + Figure 11. Tape and Reel Mechanical Data Rev. 3 | Page 13 of 14 | www.onsemi.com CM1423 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. 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