CM1431-06DF

LCD and Camera EMI Filter Array with ESD Protection CM1431 Features • • • • • • Four, six and eight channels of EMI filtering with integrated ESD protection Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Greater than 35dB attenuation (typical) at 1 GHz TDFN package with 0.40mm lead pitch: • 4-ch. = 8-lead TDFN • 6-ch. = 12-lead TDFN • 8-ch. = 16-lead TDFN Tiny TDFN package size: • 8-lead: 1.7mm x 1.35mm • 12-lead: 2.5mm x 1.35mm • 16-lead: 3.3mm x 1.35mm Increased robustness against vertical impacts during manufacturing process Lead-free finishing Product Description The CM1431 is a family of pi-style EMI filter arrays with ESD protection, which integrates four, six and eight filters (C-R-C) in small form factor TDFN 0.40mm pitch packages. The CM1431 has component values of 15pF-100Ω-15pF per channel. The CM1431 has a cut-off frequency of 120MHz and can be used in applications with data rates up to 48Mbps. The parts include ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes safely dissipate ESD strikes of ±15kV, well beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easyto-use pin assignments. In particular, the CM1431 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1431 is housed in space-saving, low-profile 8-, 12- and 16-lead TDFN packages with a 0.40mm pitch and is available with lead-free finishing. This smaller size TDFN package provides up to 42% board space saving vs. the 0.50mm pitch TDFN packages. • • • Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules ©2010 SCILLC. All rights reserved. April 2010 Rev. 2 Publication Order Number: CM1431/D CM1431 Electrical Schematic 1 of 4, 6 or 8 EMI/RFI + ESD Channels 8 765 Rev. 2 | Page 2 of 12 | www.onsemi.com CM1431 PIN DESCRIPTIONS DEVICE PIN(s) -04 1 2 3 4 -06 1 2 3 4 5 6 -08 1 2 3 4 5 6 7 8 GND PAD NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 GND DESCRIPTION Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 Filter + ESD Channel 5 Filter + ESD Channel 6 Filter + ESD Channel 7 Filter + ESD Channel 8 Device Ground DEVICE PIN(s) -04 8 7 6 5 -06 12 11 10 9 8 7 -08 16 15 14 13 12 11 10 9 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 DESCRIPTION Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 Filter + ESD Channel 5 Filter + ESD Channel 6 Filter + ESD Channel 7 Filter + ESD Channel 8 Ordering Information PART NUMBERING INFORMATION Standard Finish Pins 8 12 16 Package TDFN-8 TDFN-12 TDFN-16 Ordering Part 1 Number CM1431-04DF CM1431-06DF CM1431-08DF Lead-free Finish Ordering Part 1 Number CM1431-04DE CM1431-06DE CM1431-08DE Part Marking WF N31F N318F Part Marking WE N31E N318E Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Rev. 2 | Page 3 of 12 | www.onsemi.com CM1431 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS ° C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS ° C Rev. 2 | Page 4 of 12 | www.onsemi.com CM1431 ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R CTOTAL C PARAMETER Resistance Total Channel Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC At 2.5VDC Reverse Bias, 1MHz, 30mVAC IDIODE=10µA VDIODE= 3.3V ILOAD = 10mA ILOAD = -10mA Note 2 ±30 ±15 kV kV 5.6 -1.5 CONDITIONS MIN 80 24 TYP 100 30 MAX 120 36 UNITS Ω pF Capacitance C 12 15 18 pF VDIODE ILEAK VSIG Standoff Voltage Diode Leakage Current (reverse bias) Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-42 Level 4 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω Absolute Attenuation @ 1GHz from 0dB Level 6.0 0.1 1.0 V µA 6.8 -0.8 9.0 -0.4 V V VESD RDYN 2.3 0.9 Channel R = 100Ω, Channel C = 15pF ZSOURCE = 50Ω, Z LOAD = 50Ω, DC Bias = 0V; Notes 1and 3 ZSOURCE = 50Ω, Z LOAD = 50Ω, DC Bias = 0V; Notes 1 and 3 Ω Ω MHz dB f C 110 35 A1GHz A800MHz - 6GHz Absolute Attenuation @ 800MHz to 6GHz from 0dB Level 30 dB Note 1: TA=25° unless otherwise specified. C Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Attenuation / RF curves characterized by a network analyzer using microprobes. Rev. 2 | Page 5 of 12 | www.onsemi.com CM1431 Performance Information Typical Filter Performance (TA=25° DC Bias=0V, 50 Ohm Environment) C, Figure 1. Insertion Loss vs. Frequency (FILTER1 Input to GND) Figure 2. Insertion Loss vs. Frequency (FILTER2 Input to GND) Rev. 2 | Page 6 of 12 | www.onsemi.com CM1431 Performance Information (cont’d) Typical Filter Performance (TA=25° DC Bias=0V, 50 Ohm Environment) C, Figure 3. Insertion Loss vs. Frequency (FILTER3 Input to GND) Figure 4. Insertion Loss vs. Frequency (FILTER4 Input to GND) Rev. 2 | Page 7 of 12 | www.onsemi.com CM1431 Performance Information (cont’d) Typical Diode Capacitance vs. Input Voltage Figure 5. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5VDC and 25° C) Rev. 2 | Page 8 of 12 | www.onsemi.com CM1431 Mechanical Details CM1431-04DF/DE Mechanical Specifications Dimensions for the CM1431-04DF/DE supplied in a 8-lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-8, see the California Micro Devices TDFN Package Information document. PACKAGE DIMENSIONS Package JEDEC No. Leads Dim. Min A A1 A3 b D D2 E E2 e K L # per tape and reel 0.20 0.15 0.25 0.35 0.15 1.65 1.10 1.30 0.30 0.70 0.00 Millimeters Nom 0.75 0.02 0.20 REF 0.20 1.70 1.20 1.35 0.40 0.40 BSC 0.25 1.75 1.30 1.40 0.50 Max 0.80 0.05 Min 0.028 0.000 TDFN MO-229C ¦ 8 Inches Nom 0.030 0.001 Max 0.031 0.002 0.008 REF 0.006 0.065 0.043 0.051 0.012 0.008 0.067 0.047 0.053 0.016 0.010 0.069 0.051 0.055 0.020 0.016 BSC 0.008 0.006 0.010 0.014 3000 pieces Dimensions for 8-Lead, 0.4mm pitch TDFN package Controlling dimension: millimeters ¦ This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. Rev. 2 | Page 9 of 12 | www.onsemi.com CM1431 Mechanical Details (cont’d) CM1431-06DF/DE Mechanical Specifications Dimensions for the CM1431-06DF/DE suplied in a 12-lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-12, see the California Micro Devices TDFN Package Information document. PACKAGE DIMENSIONS Package JEDEC No. Leads Dim. Min A A1 A3 b D D2 E E2 e K L # per tape and reel 0.20 0.15 0.25 0.35 0.15 2.45 1.90 1.30 0.25 0.70 0.00 Millimeters Nom 0.75 0.02 0.20 REF 0.20 2.50 2.00 1.35 0.35 0.40 BSC 0.25 2.55 2.10 1.40 0.45 Max 0.80 0.05 Min 0.028 0.000 TDFN MO-229C ¦ 12 Inches Nom 0.030 0.001 Max 0.031 0.002 0.008 REF 0.006 0.096 0.075 0.051 0.010 0.008 0.098 0.079 0.053 0.014 0.010 0.100 0.083 0.055 0.018 0.016 BSC 0.008 0.006 0.010 0.014 3000 pieces Dimensions for 12-Lead, 0.4mm pitch TDFN package Controlling dimension: millimeters This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. ¦ Rev. 2 | Page 10 of 12 | www.onsemi.com CM1431 Mechanical Details (cont’d) CM1431-08DF/DE Mechanical Specifications Dimensions for the CM1431-08DF/DE supplied in a 16-lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-16, see the California Micro Devices TDFN Package Information document. PACKAGE DIMENSIONS Package JEDEC No. Leads Dim. Min A A1 A3 b D D2 E E2 e K L # per tape and reel 0.20 0.15 0.25 0.35 3.25 2.80 1.30 0.35 0.70 0.00 0.40 Millimeters Nom 0.75 0.02 0.55 0.20 REF 3.30 2.90 1.35 0.40 0.40 BSC 3.35 3.00 1.40 0.45 Max 0.80 0.05 0.70 Min 0.028 0.000 0.016 TDFN MO-229C ¦ 16 Inches Nom 0.030 0.001 0.022 Max 0.031 0.002 0.028 0.008 REF 0.128 0.110 0.051 0.014 0.130 0.114 0.053 0.016 0.132 0.118 0.055 0.018 0.016 BSC 0.008 0.006 0.010 0.014 3000 pieces Dimensions for 16-Lead, 0.4mm pitch TDFN package Controlling dimension: millimeters This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. ¦ Rev. 2 | Page 11 of 12 | www.onsemi.com CM1431 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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