6-Channel EMI Filter Array with ESD Protection CM1440
Features
• • • • • • • Six channels of EMI filtering for data ports Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network ±30kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Greater than 35dB attenuation (typical) at 1 GHz 15-bump, 0.4mm pitch, 2.360mm x 1.053mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance OptiGuard™ coated for improved reliability at assembly RoHS compliant (lead-free) finishing
Product Description
The CM1440 is a six channel low-pass EMI filter array with ESD protection that reduces EMI/RFI emissions while providing robust protection from ESD strikes. Each EMI filter channel integrates a high quality pi-style filter (30pF-100Ω-30pF) which provides greater than 30dB of attenuation in the 800MHz to 2.7GHz frequency range. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports safely dissipate ESD strikes of ±30kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. This device is particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package and easyto-use pin assignments. In particular, the CM1440 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1440 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1440 is available in a space saving, low profile Chip Scale Package with RoHS compliant lead-free finishing. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space savings versus competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball.
• •
Applications
• • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules
©2010 SCILLC. All rights reserved. April 2010 Rev. 3
Publication Order Number: CM1440/D
CM1440
Electrical Schematic
1 of 6 EMI/RFI + ESD Channels
PIN DESCRIPTIONS
PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 C1 C2 C3 C4 C5 C6 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 GND FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Device Ground Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6
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CM1440
Ordering Information
PART NUMBERING INFORMATION
Pins 15 Package CSP Ordering Part Number1 CM1440-06CP Part Marking N406
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS °C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C
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CM1440
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL R CTOTAL C PARAMETER Resistance Total Channel Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC At 2.5VDC Reverse Bias, 1MHz, 30mVAC IDIODE=10μA VDIODE= 3.3V ILOAD = 10mA 5.6 -1.5 Note 2 ±30 ±30 2.3 0.9 R=100Ω, C=30pF 60 MHz kV kV Ω Ω 6.8 -0.8 9.0 -0.4 V V CONDITIONS MIN 80 48 TYP 100 60 MAX 120 72 UNITS Ω pF
Capacitance C1
24
30
36
pF
VDIODE ILEAK VSIG
Standoff Voltage Diode Leakage Current (reverse bias) Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω
6.0 0.1 1
V μA
VESD
RDYN
f
C
Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time.
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CM1440
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1)
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CM1440
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
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CM1440
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3)
Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3)
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CM1440
Performance Information (cont’d)
Typical Diode Capacitance vs. Input Voltage
Figure 7. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5VDC and 25°C)
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CM1440
Application Information
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 260°C
N on-Solder M ask D efined Pad 0.240m D m IA.
Solder Stencil Opening 0.300m D m IA.
Solder Mask Opening 0.290m D m IA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
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CM1440
Mechanical Details
CSP Mechanical Specifications CM1440 devices are supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document.
# per tape and reel 3500 pieces
PACKAGE DIMENSIONS
Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Nom Max Min 0.911 Nom Max Custom CSP 15 Inches
Controlling dimension: millimeters
2.3150 2.3600 2.4050 1.008 0.395 0.195 1.053 1.098
0.0929 0.0947
B3
0.0397 0.0415 0.0432 0.0156 0.0157 0.0159 0.0076 0.0078 0.0080
0.25 DIA. 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
0.4000 0.405 0.2000 0.205
0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 0.130 0.130 0.575 0.368 0.1800 0.230 0.1800 0.230 0.644 0.419 0.714 0.470 0.0051 0.0071 0.0091 0.0051 0.0071 0.0091 0.0226 0.0254 0.0281 0.0145 0.0165 0.0185
Package Dimensions for CM1440 Chip Scale Package
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CM1440
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 2.62 X 1.12X 0.76 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500
PART NUMBER CM1440
CHIP SIZE (mm) 2.36 X 1.053X 0.644
P0 4mm
P1 4mm
+
+
+
Figure 10. Tape and Reel Mechanical Data
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CM1440
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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