CM1442-08CS

LCD and Camera EMI Filter Array with ESD Protection CM1442 Features • • • • • • • • Six and eight channels of EMI filtering with integrated ESD protection 0.4mm pitch, 15-bump, 2.360mm x 1.053mm footprint Chip Scale Package (CM1442-06) 0.4mm pitch, 20-bump, 3.160mm x 1.053mm footprint Chip Scale Package (CM1442-08) Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Greater than 30dB attenuation (typical) at 1 GHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance OptiGuard™ coated for improved reliability at assembly Lead-free version available Product Description The CM1442 is a family of pi-style EMI filter arrays with ESD protection, which integrates six and eight filters (C-R-C) in Chip Scale Package form factor with 0.40mm pitch. The CM1442 has component values of 15pF-100Ω-15pF per channel. The CM1442 has a cut-off frequency of 120MHz and can be used in applications where the data rates are as high as 48Mbps. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes safely dissipate ESD strikes of ±15kV, well beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CM1442 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1442 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1442 is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space saving versus competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball. • • Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules ©2010 SCILLC. All rights reserved. April 2010 Rev. 2 Publication Order Number: CM1442/D CM1442 Electrical Schematic 1 of 6 or 8 EMI/RFI + ESD Channels Rev. 2 | Page 2 of 15 | www.onsemi.com CM1442 PIN DESCRIPTIONS PIN(s) A1 A2 A3 A4 A5 A6 A7 A8 B1-B4 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 GND DESCRIPTION Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 Filter + ESD Channel 5 Filter + ESD Channel 6 Filter + ESD Channel 7 Filter + ESD Channel 8 Device Ground PIN(s) C1 C2 C3 C4 C5 C6 C7 C8 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 DESCRIPTION Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 Filter + ESD Channel 5 Filter + ESD Channel 6 Filter + ESD Channel 7 Filter + ESD Channel 8 Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 15 20 Package CSP CSP Ordering Part Number1 CM1442-06CS CM1442-08CS Lead-free Finish2 Ordering Part Number1 CM1442-06CP CM1442-08CP Part Marking N426 N428 Part Marking N426 N428 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 3 of 15 | www.onsemi.com CM1442 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R CTOTAL C VDIODE ILEAK VSIG PARAMETER Resistance Total Channel Capacitance Capacitance C1 Standoff Voltage Diode Leakage Current (reverse bias) Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω R=100Ω, C=15pF 115 MHz At 2.5VDC Reverse Bias, 1MHz, 30mVAC At 2.5VDC Reverse Bias, 1MHz, 30mVAC IDIODE=10μA VDIODE= 3.3V ILOAD = 10mA ILOAD = -10mA Notes 2 and 3 ±30 ±15 2.3 0.9 kV kV Ω Ω 5.6 -1.5 CONDITIONS MIN 80 24 12 TYP 100 30 15 6.0 0.1 1 MAX 120 36 18 UNITS Ω pF pF V μA 6.8 -0.8 9.0 -0.4 V V VESD RDYN f C Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Unused pins are left open. Rev. 2 | Page 4 of 15 | www.onsemi.com CM1442 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1) Rev. 2 | Page 5 of 15 | www.onsemi.com CM1442 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2) Rev. 2 | Page 6 of 15 | www.onsemi.com CM1442 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3) Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3) ) Rev. 2 | Page 7 of 15 | www.onsemi.com CM1442 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 7. Insertion Loss vs. Frequency (A7-C7 to GND B4, CM1442-08CS/CP Only) Figure 8. Insertion Loss vs. Frequency (A8-C8 to GND B4, CM1442-08CS/CP Only ) Rev. 2 | Page 8 of 15 | www.onsemi.com CM1442 Performance Information (cont’d) Typical Diode Capacitance vs. Input Voltage Figure 7. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5VDC and 25°C) Rev. 2 | Page 9 of 15 | www.onsemi.com CM1442 Application Information PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 260°C N on-Solder M ask D efined Pad 0.240m D m IA. Solder Stencil Opening 0.300m D m IA. Solder Mask Opening 0.290m D m IA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 10 of 15 | www.onsemi.com CM1442 Mechanical Details CSP Mechanical Specifications CM1442 devices are supplied in custom Chip Scale Packages (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. CM1442-06 Mechanical Specifications The package dimensions for the CM1442-06 are presented below. PACKAGE DIMENSIONS Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 2.315 1.008 0.395 0.195 Nom 2.360 1.053 Max 2.405 1.098 Min 0.911 Nom Max Custom CSP 15 Inches 0.0929 0.0947 0.0397 0.0415 0.0432 0.0156 0.0157 0.0159 0.0076 0.0078 0.0080 0.4000 0.405 0.2000 0.205 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 0.130 0.130 0.575 0.368 0.1800 0.230 0.1800 0.230 0.644 0.419 0.714 0.470 0.0051 0.0071 0.0091 0.0051 0.0071 0.0091 0.0226 0.0254 0.0281 0.0145 0.0165 0.0185 Package Dimensions for CM1442-06 Chip Scale Package # per tape and reel 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 11 of 15 | www.onsemi.com CM1442 CSP Tape and Reel Specifications POCKET SIZE (mm) TAPE WIDTH REEL B0 X A0 X K0 W DIAMETER 2.62 X 1.12 X 0.76 8mm 178mm (7") QTY PER REEL 3500 PART NUMBER CM1442-06 CHIP SIZE (mm) 2.36 X 1.053 X 0.644 P0 4mm P1 4mm Figure 13. Tape and Reel Mechanical Data Rev. 2 | Page 12 of 15 | www.onsemi.com CM1442 Mechanical Details (cont’d) CM1442-08 Mechanical Specifications The package dimensions for the CM1442-08 are presented below. PACKAGE DIMENSIONS Package Bumps Millimeters Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 3.115 1.008 0.395 0.195 Nom 3.160 1.053 Max 3.205 1.098 Min Nom Max Custom CSP 15 Inches 0.1226 0.1244 0.1262 0.0397 0.0415 0.0432 0.0156 0.0157 0.0159 0.0076 0.0078 0.0080 0.4000 0.405 0.2000 0.205 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 0.130 0.130 0.575 0.368 0.1800 0.230 0.1800 0.230 0.644 0.419 0.714 0.470 0.0051 0.0071 0.0091 0.0051 0.0071 0.0091 0.0226 0.0254 0.0281 0.0145 0.0165 0.0185 Package Dimensions for CM1442-08 Chip Scale Package # per tape and reel 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 13 of 15 | www.onsemi.com CM1442 CSP Tape and Reel Specifications PART NUMBER CM1442-08 POCKET SIZE (mm) B0 X A0 X K0 3.28 X 1.32 X 0.81 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 CHIP SIZE (mm) 3.16 X 1.053 X 0.644 P0 4mm P1 4mm Figure 14. Tape and Reel Mechanical Data Rev. 2 | Page 14 of 15 | www.onsemi.com CM1442 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. 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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative Rev. 2 | Page 15 of 15 | www.onsemi.com