CM1443-04CP

CM1443-04CP 4-Channel EMI Filter Array with ESD Protection Features • Four Channels of EMI Filtering for Data Ports • Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C) http://onsemi.com Network • ±15 kV ESD Protection on Each Channel • • • • • (IEC 61000−4−2 Level 4, Contact Discharge) ±30 kV ESD Protection on Each Channel (HBM) Chip Scale Package (CSP) Features Extremely Low Lead Inductance for Optimum Filter and ESD Performance 10−Bump; 0.4 mm Pitch, 1.560 x 1.053 mm Footprint OptiGuardt Coating for Improved Reliability at Assembly These Devices are Pb−Free and are RoHS Compliant WLCSP10 CP SUFFIX CASE 567BH MARKING DIAGRAM Applications • • • • • • EMI Filtering and ESD Protection for Both Data and I/O Ports Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs R = 100 W 8.5 pF CS 8.5 pF 43 = CM1443−04CP M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION BLOCK DIAGRAM FILTERn* (Pins A1−A4) 43 MG G FILTERn* (Pins C1−C4) CS GND (Pins B1−B2) Device Package Shipping† CM1443−04CP CSP−10 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 of 4 EMI/RFI + ESD Channels *See Package/Pinout Diagrams for expanded pin information. © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 3 1 Publication Order Number: CM1443−04CP/D CM1443−04CP PACKAGE / PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS 10−bump CSP Package Pin(s) Name A1 FILTER1 Filter Channel 1 A2 FILTER2 Filter Channel 2 A3 FILTER3 Filter Channel 3 A4 FILTER4 Filter Channel 4 B1−B2 GND Device Ground C1 FILTER1 Filter Channel 1 C2 FILTER2 Filter Channel 2 C3 FILTER3 Filter Channel 3 C4 FILTER4 Filter Channel 4 Orientation Marking Description A 1 + Top View (Bumps Down View) 2 3 4 43 B C Bottom View (Bumps Up View) FILTER1 FILTER2 FILTER3 FILTER4 C1 C2 C3 C4 GND GND B1 B2 FILTER1 FILTER2 FILTER3 FILTER4 A1 A2 A3 A4 A1 Orientation Marking CM1443−04CP SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units –65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 600 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range http://onsemi.com 2 Rating Units –40 to +85 °C CM1443−04CP Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions R Resistance CT Total Capacitance At 2.5 V DC CS Single Capacitor At 2.5 V DC Diode Voltage (reverse bias) IDIODE = 10 mA ILEAK Diode Leakage Current (reverse bias) VDIODE = 3.3 V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10 mA VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 (Notes 2 and 4) Clamping Voltage during ESD Discharge MIL−STD−883 (Method 3015), 8 kV Positive Transients Negative Transients (Notes 2, 3 and 4) Cut−off Frequency ZSOURCE = 50 W, ZLOAD = 50 W R = 100 W, CS = 8.5 pF VDIODE VCL fC Min Typ Max Units 80 100 120 W 14 17 21 pF 8.5 pF 5.5 5.6 −0.4 V 0.1 1.0 6.8 –0.8 9.0 −1.5 mA V kV ±30 ±15 V +10 –5 220 MHz 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. 4. Unused pins are left open. APPLICATION INFORMATION Refer to Application Note “The Chip Scale Package”, for a detailed description of Chip Scale Packages offered by ON Semiconductor. PERFORMANCE INFORMATION Figure 1. Resistance vs. Temperature (normalized to resistance at 255C) http://onsemi.com 3 CM1443−04CP PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 2. Insertion Loss vs. Frequency (A1−C1 to GND B1) Figure 3. Insertion Loss vs. Frequency (A2−C2 to GND B1) http://onsemi.com 4 CM1443−04CP PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 4. Insertion Loss vs. Frequency (A3−C3 to GND B2) Figure 5. Insertion Loss vs. Frequency (A4−C4 to GND B2) http://onsemi.com 5 CM1443−04CP PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 6. Comparison of Filter Response Curves for CM1443 vs. DC Bias Figure 7. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5 VDC and 255C) OptiGuardt is a trademark of Semiconductor Components Industries, LLC. http://onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 1.56x1.05 CASE 567BH−01 ISSUE O SCALE 4:1 È È PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C D A DATE 26 JUL 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E eD eE TOP VIEW A2 OptiGuard Option ÉÉÉÉ 0.05 C A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 A1 C SIDE VIEW eD/2 10X b 0.05 C A B 0.03 C eD eE B A1 PACKAGE OUTLINE 0.35 0.40 PITCH 10X 0.25 DIMENSIONS: MILLIMETERS A 1 2 3 4 5 6 BOTTOM VIEW DESCRIPTION: SEATING PLANE 0.35 C DOCUMENT NUMBER: MILLIMETERS MIN MAX 0.69 0.54 0.17 0.24 0.42 REF 0.24 0.29 1.56 BSC 1.05 BSC 0.400 BSC 0.347 BSC 98AON49817E WLCSP10, 1.56X1.05 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative