DATA SHEET
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4-, 6-, 8-Channel EMI Filter
Array with ESD Protection
WLCSP15
CP SUFFIX
CASE 567BR
WLCSP10
CP SUFFIX
CASE 567BJ
Description
WLCSP20
CP SUFFIX
CASE 567BV
BLOCK DIAGRAM
35 nH 35 nH
GND
(Pins
B1−B4)
1 2 3 4
A +
GG
B
N57 (W)
C
An*
(Internal
Pins)
1.8 pF
Cn*
(External
Pins)
6 pF
The CM1457 is an inductor-based (L-C) EMI filter array with ESD
protection, which integrates four, six, or eight filters in a CSP form
factor with 0.40 mm pitch. Each EMI filter channel of the CM1457 is
implemented with the component value of 6 pF − 35 nH – 4.7 pF −
35 nH – 1.8 pF. The cut-off frequency at −3 dB attenuation is
300 MHz and can be used in applications where the data rates are as
high as 160 Mbps, while providing greater than −35 dB attenuation
over the 800 MHz to 2.7 GHz frequency range. The parts include ESD
diodes on every I/O pin and provide a high level of protection against
electrostatic discharge (ESD). The ESD protection diodes connected
to the external filter ports are designed and characterized to safely
dissipate ESD strikes of ±15 kV, which is beyond the maximum
requirement of the IEC61000−4−2 international standard.
This device is particularly well suited for wireless handsets, mobile
LCD modules and PDAs because of its small package format and
easy-to-use pin assignments. In particular, the CM1457 is ideal for
EMI filtering and protecting data and control lines for the LCD display
and camera interface in mobile handsets.
The CM1457 incorporates OptiGuard which results in improved
reliability at assembly. It is manufactured with a 0.40 mm pitch and
0.25 mm CSP solder ball to provide up to 28% board space savings vs.
competing CSP devices with 0.50 mm pitch and 0.30 mm CSP solder
ball.
4.7 pF
CM1457
MARKING DIAGRAM
N57 yww
CM1457−06
CM1457−04
10−Bump CSP 15−Bump CSP
N57
N57
N57
w/yww/yyww
N57 yyww
CM1457−08
20−Bump CSP
= CM1457−04CP
= CM1457−06CP
= CM1457−08CP
= date code
ORDERING INFORMATION
Device
Package
Shipping†
CM1457−04CP
CSP−10
(Pb−Free)
3500/Tape & Reel
• Greater than −40 dB of Attenuation at 1 GHz
CM1457−06CP
CSP−15
(Pb−Free)
3500/Tape & Reel
•
CM1457−08CP
CSP−20
(Pb−Free)
3500/Tape & Reel
Features
• Four, Six or Eight Channels of EMI Filtering
• ±15 kV ESD Protection (IEC 61000−4−2, Contact Discharge) at
External Pins
•
•
MIL−STD−883 International ESD Standard
Chip Scale Package (CSP) with 0.40 mm Pitch and 0.25 mm CSP
Solder Ball which Features Extremely Low Parasitic Inductance
for Optimum Filter and ESD Performance
OptiGuard Coating for Improved Reliability at Assembly
These Devices are Pb−Free and are RoHS Compliant
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Applications
• LCD and Camera Data Lines in Mobile Handsets
• I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs, etc.
• EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
•
•
•
Computers
Wireless Handsets
Handheld PCs/PDAs
LCD and Camera Modules
© Semiconductor Components Industries, LLC, 2013
April, 2022 − Rev. 7
1
Publication Order Number:
CM1457/D
CM1457
PACKAGE / PINOUT DIAGRAMS
Orientation
Marking
Top View
(Bumps Down View)
+
A
1
2
3
Bottom View
(Bumps Up View)
4
C1
B
A1
A1
CM1457−04CP
10−Bump CSP
Orientation
Marking
+
A
1
2
3
4
5
C1
C
CM1457−06CP
15−Bump CSP
A
+
2
4
3
5
B2
A2
A3
A4
C3
C4
C5
6
7
C2
B1
Orientation
Marking
1
C4
6
B
Orientation
Marking
C3
B1
Orientation
Marking
C
C2
B2
C6
B3
A1
A1
A2
A3
A4
A5
A6
C2
C3
C4
C5
C6
C7
8
C1
B
Orientation
Marking
C
B1
A1
A1
B2
A2
A3
B3
A4
A5
C8
B4
A6
A7
A8
CM1457−08CP
20−Bump CSP
Table 1. PIN DESCRIPTIONS
Pin Number
Pin Number
−04
−06
−08
−04
−06
−08
A1
A1
A1
Pin Description
Filter #1 (Internal)
C1
C1
C1
Filter #1 (External)
A2
A2
A2
Filter #2 (Internal)
C2
C2
C2
Filter #2 (External)
A3
A3
A3
Filter #3 (Internal)
C3
C3
C3
Filter #3 (External)
A4
A4
A4
Filter #4 (Internal)
C4
C4
C4
Filter #4 (External)
−
A5
A5
Filter #5 (Internal)
−
C5
C5
Filter #5 (External)
−
A6
A6
Filter #6 (Internal)
−
C6
C6
Filter #6 (External)
−
−
A7
Filter #7 (Internal)
−
−
C7
Filter #7 (External)
−
−
A8
Filter #8 (Internal)
−
−
C8
Filter #8 (External)
B1, B2
B1−B3
B1−B4
Pin Description
GND
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2
CM1457
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
−65 to +150
°C
DC current per Inductor
15
mA
DC Package Power Rating
0.5
W
Storage Temperature Range
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
−40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
LTOT
Total Channel Inductance
70
nH
RTOT
Total Channel DC Resistance
45
W
CTOT_0V
Total Channel Capacitance, 0 V bias
0 V dc; 1 MHz, 30 mV rms
Total Channel Capacitance, 2.5 V bias
2.5 V dc; 1 MHz,
30 mV rms
Stand−off Voltage
I = 10 mA
ILEAK
Diode Leakage Current
VIN = +3.3 V
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
ILOAD = −10 mA
VESD
In−system ESD Withstand Voltage
a) Contact Discharge per IEC 61000−4−2 standard,
Level 4 (External Pins)
b) Contact Discharge per IEC 61000−4−2 standard,
Level 4 (Internal Pins)
CTOT_2.5V
VST
fC
(Notes 2 and 3)
Cut−off Frequency
ZSOURCE = 50 W, ZLOAD = 50 W
20
24
12.5
pF
5.5
5.6
−1.5
pF
V
0.1
0.5
6.8
−0.8
9.0
−0.4
mA
V
kV
±15
±2
300
MHz
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Unused pins are left open.
APPLICATION INFORMATION
Refer to Application Note “The Chip Scale Package”, for a detailed description of Chip Scale Packages offered by onsemi.
www.onsemi.com
3
CM1457
PERFORMANCE INFORMATION
0 dB
INSERTION LOSS
−10 dB
−20 dB
−30 dB
−40 dB
−50 dB
3
10
100
1000
2000
6000
FREQUENCY (MHz)
Figure 1. Insertion Loss vs. Frequency (0 V Bias)
0 dB
INSERTION LOSS
−10 dB
−20 dB
−30 dB
−40 dB
−50 dB
3
10
100
1000
FREQUENCY (MHz)
Figure 2. Insertion Loss vs. Frequency (2.5 V Bias)
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4
2000
6000
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP10, 1.67x1.05
CASE 567BJ−01
ISSUE O
SCALE 4:1
È
È
PIN A1
REFERENCE
2X
0.05 C
2X
0.05 C
D
A
DATE 26 JUL 2010
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
eD
eE
TOP VIEW
A2
OptiGuard Option
ÉÉÉÉ
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
NOTE 3
A1
C
SIDE VIEW
eD/2
10X
b
0.05 C A B
0.03 C
eD
eE
B
A1
PACKAGE
OUTLINE
0.35
0.40
PITCH
10X
0.25
DIMENSIONS: MILLIMETERS
A
1 2 3
4 5 6
BOTTOM VIEW
DESCRIPTION:
SEATING
PLANE
0.35
C
DOCUMENT NUMBER:
MILLIMETERS
MIN
MAX
0.69
0.54
0.17
0.24
0.42 REF
0.24
0.29
1.67 BSC
1.05 BSC
0.400 BSC
0.347 BSC
98AON49818E
WLCSP10, 1.67X1.05
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP15, 2.47x1.05
CASE 567BR−01
ISSUE O
SCALE 4:1
È
È
PIN A1
REFERENCE
2X
0.05 C
2X
D
0.05 C
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
eD
eE
TOP VIEW
OptiGuard Option
ÉÉÉÉÉÉ
0.05 C
A2
A
A1
C
SIDE VIEW
eD/2
15X
b
0.05 C A B
0.03 C
eD
C
SEATING
PLANE
PACKAGE
OUTLINE
A1
0.35
eE
0.35
15X
0.40
PITCH
B
MILLIMETERS
MIN
MAX
0.69
0.54
0.17
0.24
0.42 REF
0.24
0.29
2.47 BSC
1.05 BSC
0.400 BSC
0.347 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
NOTE 3
DATE 26 JUL 2010
0.25
DIMENSIONS: MILLIMETERS
A
1 2 3
4 5 6
7 8 9
BOTTOM VIEW
DOCUMENT NUMBER:
DESCRIPTION:
98AON49825E
WLCSP15, 2.47X1.05
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP20, 3.27x1.05
CASE 567BV−01
ISSUE O
DATE 26 JUL 2010
SCALE 4:1
PIN A1
REFERENCE
2X
0.05 C
2X
D
ÈÈ
ÈÈ
A
E
0.05 C
DIM
A
A1
A2
b
D
E
eD
eE
TOP VIEW
OptiGuard Option
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
ÉÉÉÉÉÉÉÉ
A2
MILLIMETERS
MIN
MAX
0.69
0.54
0.17
0.24
0.42 REF
0.24
0.29
3.27 BSC
1.05 BSC
0.400 BSC
0.347 BSC
A
0.05 C
NOTE 3
A1
C
SIDE VIEW
SEATING
PLANE
eD/2
b
20X
0.05 C A B
0.03 C
eD
eE
C
B
A
1 2 3
4 5 6
7 8 9
10 1112
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
A1
0.35
0.35
20X
0.40
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON49829E
WLCSP20, 3.27X1.05
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
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and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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