CM1461-06DE

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Other names and brands may be claimed as the property of others. CM1461 Praetorian C-L-C LCD and Camera EMI Filter Array with ESD Protection Product Description The CM1461 is a family of pi−style EMI filter arrays with ESD protection, which integrates four, six and eight filters (C−L−C) in small form factor WDFN 0.50 mm pitch packages. Each EMI filter channel of the CM1461 is implemented as a 3−pole L−C filter where the component values are 10 pF − 20 nH − 10 pF. The CM1461’s roll−off frequency at −6 dB attenuation is 400 MHz and can be used in applications where the data rates are as high as 140 Mbps while providing greater than 30 dB over the 800 MHz to 2.7 GHz frequency range. The parts include ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±15 kV, beyond the maximum requirement of the IEC61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV. This device is particularly well suited for wireless handsets, mobile LCD modules and PDAs because of its small package format and easy−to−use pin assignments. In particular, the CM1461 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in mobile handsets. The CM1461 is housed in space saving, low profile 8, 12 and 16−lead WDFN packages where the pitch is 0.50 mm in lead−free format. Features • Four, Six and Eight Channels of EMI Filtering with Integrated ESD Protection • Pi−Style EMI Filters in a Capacitor−Inductor−Capacitor (C−L−C) Network http://onsemi.com WDFN12 DE SUFFIX CASE 511AZ WDFN8 DE SUFFIX CASE 511BE WDFN16 DE SUFFIX CASE 511AU ELECTRICAL SCHEMATIC Filter + ESDn* Filter + ESDn* 20 nH 10 pF 10 pF GND 1 of 4, 6 or 8 EMI/RFI Filter Channels with Integrated ESD Protection * See Package/Pinout Diagrams for expanded pin information. MARKING DIAGRAM YE N61E YE N61E N618E N618E = CM1461−04DE = CM1461−06DE = CM1461−08DE ORDERING INFORMATION • ±15 kV ESD Protection on Each Channel Device Package Shipping† CM1461−04DE 3000/Tape & Reel • • • CM1461−06DE WDFN−8 (Pb−Free) WDFN−12 (Pb−Free) WDFN−16 EEP (Pb−Free) • • • (IEC 61000−4−2 Level 4, Contact Discharge) ±30 kV ESD Protection on Each Channel (HBM) Greater than 20 dB Attenuation (Typical) at 1 GHz WDFN Lead−Free Package with 0.50 mm Lead Pitch: ♦ 4−ch. = 8−lead WDFN ♦ 6−ch. = 12−lead WDFN ♦ 8−ch. = 16−lead WDFN Tiny WDFN Package Size: ♦ 8−lead: 2.00 mm x 2.00 mm ♦ 12−lead: 3.00 mm x 1.35 mm ♦ 16−lead: 4.00 mm x 1.60 mm Increased Robustness against Vertical Impacts During Manufacturing Process These Devices are Pb−Free and are RoHS Compliant © Semiconductor Components Industries, LLC, 2011 April, 2011 − Rev. 3 CM1461−08DE 3000/Tape & Reel 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 Publication Order Number: CM1461/D CM1461 Applications • LCD and Camera Data Lines in Mobile Handsets • I/O Port Protection for Mobile Handsets, Notebook • Wireless Handsets • Handheld PCs/PDAs • LCD and Camera Modules Computers, PDAs, etc. • EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook Computers PACKAGE / PINOUT DIAGRAMS Top View (Pins Down View) 8 7 6 5 Pin 1 Marking Bottom View (Pins Up View) 1 2 3 4 GND PAD YE Top View (Pins Down View) 12 11 10 9 8 7 Bottom View (Pins Up View) 1 2 3 4 5 6 N61E GND PAD Pin 1 Marking 1 2 3 4 8 7 6 5 CM1461−04DE 8 Lead WDFN Package Pin 1 Marking 1 2 3 4 5 6 12 11 10 9 8 7 CM1461−06DE 12 Lead WDFN Package Top View (Pins Down View) 16 15 14 13 12 11 10 9 Bottom View (Pins Up View) 1 2 3 4 5 6 7 8 N618E GND PAD 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 CM1461−08DE 16 Lead WDFN Package (with Exposed End Pads) Table 1. PIN DESCRIPTIONS Device Pin(s) Device Pin(s) −04 −06 −08 −04 Name −06 −08 1 1 1 FILTER1 Name Filter + ESD Channel 1 8 12 16 FILTER1 Filter + ESD Channel 1 2 2 2 FILTER2 Filter + ESD Channel 2 7 11 15 FILTER2 Filter + ESD Channel 2 3 3 3 FILTER3 Filter + ESD Channel 3 6 10 14 FILTER3 Filter + ESD Channel 3 4 4 4 FILTER4 Filter + ESD Channel 4 5 9 13 FILTER4 Filter + ESD Channel 4 − 5 5 FILTER5 Filter + ESD Channel 5 − 8 12 FILTER5 Filter + ESD Channel 5 − 6 6 FILTER6 Filter + ESD Channel 6 − 7 11 FILTER6 Filter + ESD Channel 6 − − 7 FILTER7 Filter + ESD Channel 7 − − 10 FILTER7 Filter + ESD Channel 7 − − 8 FILTER8 Filter + ESD Channel 8 − − 9 FILTER8 Filter + ESD Channel 8 Device Ground − − − − GND PAD GND Description http://onsemi.com 2 Description CM1461 SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units −65 to +150 °C Current per Inductor 30 mA DC Package Power Rating 500 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units –40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol L CTOTAL Parameter Conditions Min Channel Inductance Typ Max 20 At 2.5 V DC Reverse Bias, 1 MHz, 30 mV AC Capacitance C1 At 2.5 V DC Reverse Bias, 1 MHz, 30 mV AC 10 pF Stand−off Voltage IDIODE = 10 mA 6.0 V ILEAK Diode Leakage Current (Reverse Bias) VDIODE = 3.3 V 0.1 1.0 VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA 6.8 −0.8 9.0 −0.4 VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 VDIODE RDYN fR (Notes 2 and 3) 5.6 −1.5 20 nH Total Channel Capacitance C 16 Units 24 pF mA V kV ±30 ±15 Dynamic Resistance Positive Negative 2.3 0.9 Roll−off Frequency at −6 dB Attenuation ZSOURCE = 50 W, ZLOAD = 50 W 400 W MHz 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin (i.e. if ESD is applied to pin A1 then clamping voltage is measured at pin C1). Unused pins are left open. http://onsemi.com 3 CM1461 PERFORMANCE INFORMATION Typical Filter Performance (TA = 25C, DC Bias = 0 V, 50 W Environment) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz Frequency Figure 1. Filter 1 Insertion Loss (CM1461−04DE) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz Frequency Figure 2. Filter 2 Insertion Loss (CM1461−04DE) http://onsemi.com 4 6 GHz CM1461 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 25C, DC Bias = 0 V, 50 W Environment) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz Frequency Figure 3. Filter 3 Insertion Loss (CM1461−04DE) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz Frequency Figure 4. Filter 4 Insertion Loss (CM1461−04DE) http://onsemi.com 5 6 GHz CM1461 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 25C, DC Bias = 0 V, 50 W Environment) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz Frequency Figure 5. Filter 1 Insertion Loss (CM1461−06DE) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz Frequency Figure 6. Filter 2 Insertion Loss (CM1461−06DE) http://onsemi.com 6 6 GHz CM1461 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 25C, DC Bias = 0 V, 50 W Environment) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz Frequency Figure 7. Filter 3 Insertion Loss (CM1461−06DE) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz Frequency Figure 8. Filter 4 Insertion Loss (CM1461−06DE) http://onsemi.com 7 6 GHz CM1461 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 25C, DC Bias = 0 V, 50 W Environment) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz Frequency Figure 9. Filter 5 Insertion Loss (CM1461−06DE) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz Frequency Figure 10. Filter 6 Insertion Loss (CM1461−06DE) http://onsemi.com 8 6 GHz CM1461 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 25C, DC Bias = 0 V, 50 W Environment) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz Frequency Figure 11. Filter 1 Insertion Loss (CM1461−08DE) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz Frequency Figure 12. Filter 2 Insertion Loss (CM1461−08DE) http://onsemi.com 9 6 GHz CM1461 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 25C, DC Bias = 0 V, 50 W Environment) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz Frequency Figure 13. Filter 3 Insertion Loss (CM1461−08DE) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz Frequency Figure 14. Filter 4 Insertion Loss (CM1461−08DE) http://onsemi.com 10 6 GHz CM1461 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 25C, DC Bias = 0 V, 50 W Environment) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz Frequency Figure 15. Filter 5 Insertion Loss (CM1461−08DE) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz Frequency Figure 16. Filter 6 Insertion Loss (CM1461−08DE) http://onsemi.com 11 6 GHz CM1461 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 25C, DC Bias = 0 V, 50 W Environment) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz Frequency Figure 17. Filter 7 Insertion Loss (CM1461−08DE) 0 dB −10 dB Insertion Loss −20 dB −30 dB −40 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz Frequency Figure 18. Filter 8 Insertion Loss (CM1461−08DE) http://onsemi.com 12 6 GHz CM1461 PERFORMANCE INFORMATION (Cont’d) Capacitance (Normalized) Typical Diode Capacitance vs. Input Voltage DC Voltage Figure 19. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5 V DC and 25C) http://onsemi.com 13 CM1461 PACKAGE DIMENSIONS WDFN8 2x2, 0.5P CASE 511BE−01 ISSUE O A D PIN ONE REFERENCE 2X ÇÇÇ ÇÇÇ ÇÇÇ 0.10 C E DETAIL A ALTERNATE CONSTRUCTIONS TOP VIEW ÇÇ ÉÉ EXPOSED Cu DETAIL B A 0.10 C A3 A3 MOLD CMPD A1 DETAIL B 0.08 C NOTE 4 C D2 1 8X 4 SEATING PLANE 5 e BOTTOM VIEW MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.50 1.70 2.00 BSC 0.80 1.00 0.50 BSC 0.25 REF 0.20 0.40 −−− 0.15 RECOMMENDED SOLDERING FOOTPRINT* 8X 1.70 PACKAGE OUTLINE 8X DIM A A1 A3 b D D2 E E2 e K L L1 L E2 8 ÉÉ ÇÇ ÇÇ ALTERNATE CONSTRUCTIONS A1 SIDE VIEW DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L1 0.10 C 2X L L B 0.50 b 0.10 C A B 0.05 C NOTE 3 2.30 1.00 1 0.50 PITCH 8X 0.30 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 14 CM1461 PACKAGE DIMENSIONS WDFN12, 3x1.35, 0.5P CASE 511AZ−01 ISSUE O PIN ONE REFERENCE 2X 2X 0.10 C 0.10 C L1 É É 0.10 C DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS ÉÉÉ ÇÇÇ TOP VIEW EXPOSED Cu (A3) DETAIL B 0.08 C A1 SIDE VIEW DETAIL A D2 1 K 12 e e/2 C 12X 6 7 MOLD CMPD ÉÉ ÇÇ ÇÇ A3 A1 DETAIL B A NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L A B D SEATING PLANE ALTERNATE CONSTRUCTIONS DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.20 0.30 3.00 BSC 2.40 2.60 1.35 BSC 0.30 0.50 0.50 BSC 0.22 REF 0.20 0.30 −−− 0.15 L E2 RECOMMENDED SOLDERING FOOTPRINT* 12X b 0.10 C A B 0.05 C 2.60 12X 0.45 NOTE 3 BOTTOM VIEW 1.65 0.50 12X 0.30 0.50 PITCH DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 15 CM1461 PACKAGE DIMENSIONS WDFN16, 4x1.6, 0.5P CASE 511AU−01 ISSUE O A B D PIN ONE REFERENCE 2X ÉÉ ÉÉ ÉÉ L1 DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS 0.10 C 2X 0.10 C ÉÉ ÇÇ EXPOSED Cu TOP VIEW (A3) DETAIL B 0.10 C 0.08 C A1 SIDE VIEW D2 DETAIL A 1 K F C 16X 8 MOLD CMPD ÉÉÉ ÇÇÇ ÇÇÇ A3 A1 DETAIL B A NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L SEATING PLANE ALTERNATE CONSTRUCTIONS DIM A A1 A3 b D D2 E E2 e F K L L1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.20 0.30 4.00 BSC 3.10 3.30 1.60 BSC 0.30 0.50 0.50 BSC 0.25 REF 0.30 REF 0.20 0.40 −−− 0.15 L E2 RECOMMENDED SOLDERING FOOTPRINT* 4.30 16 9 e e/2 16X 2X b 0.10 C A B 0.05 C 0.35 16X 3.30 0.53 NOTE 3 BOTTOM VIEW 1.90 3X 0.50 16X 0.30 0.50 PITCH DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PRAETORIAN is registered trademark of Semiconductor Components Industries, LCC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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