CM2009-02QR

CM2009 VGA Port Companion Circuit Product Description The CM2009 connects between a video graphics controller embedded in a PC, graphics adapter card or set top box and the VGA or DVI−I port connector. The CM2009 incorporates ESD protection for all signals, level shifting for the DDC signals and buffering for the SYNC signals. ESD protection for the video, DDC and SYNC lines is implemented with low−capacitance current steering diodes. All ESD diodes are designed to safely handle the high current spikes specified by IEC−61000−4−2 Level 4 (±8 kV contact discharge if CBYP is present, ±4 kV if not). The ESD protection for the DDC signal pins are designed to prevent “back current” when the device is powered down while connected to a monitor that is powered up. Separate positive supply rails are provided for the VIDEO, DDC and SYNC channels to facilitate interfacing with low voltage video controller ICs to provide design flexibility in multi−supply−voltage environments. Two non−inverting drivers provide buffering for the HSYNC and VSYNC signals from the video controller IC (SYNC1, SYNC2). These buffers accept TTL input levels and convert them to CMOS output levels that swing between Ground and VCC_SYNC, which is typically 5 V. Additionally, each driver has a series termination resistor (RT) connected to the SYNC_OUT pin, eliminating the external termination resistors typically required for the HSYNC and VSYNC lines of the video cable. There are three versions with different values of RT to allow termination at typically 65 W (CM2009−00) or 15 W (CM2009−02). The 15 W (CM2009−02) version will typically require two external resistors which can be chosen to exactly match the characteristic impedance of the SYNC lines of the video cable. Two N−channel MOSFETs provide the level shifting function required when the DDC controller is operated at a lower supply voltage than the monitor. The gate terminals for these MOSFETS (VCC_DDC) should be connected to the supply rail (typically 3.3 V) that supplies power to the transceivers of the DDC controller. Features • Includes ESD Protection, Level−Shifting, Buffering and • • http://onsemi.com QSOP16 QR SUFFIX CASE 492 MARKING DIAGRAM CMD YYWW CM2009 0xQR CM2009 0xQR = Specific Device Code YY = Year WW = Work Week ORDERING INFORMATION Device Package Shipping† CM2009−00QR QSOP−16 (Pb−Free) 2500/Tape & Reel CM2009−02QR QSOP−16 (Pb−Free) 2500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. • 5 V Drivers for HSYNC and VSYNC Lines • Integrated Impedance Matching Resistors on Sync Lines • Bi−directional Level Shifting N−Channel FETs Sync Impedance Matching 7 Channels of ESD Protection for all VGA Port Connector Pins Meeting IEC−61000−4−2 Level 4 ESD Requirements (±8 kV Contact Discharge) Very Low Loading Capacitance from ESD Protection Diodes on VIDEO Lines (4 pF Maximum) Provided for DDC_CLK & DDC_DATA Channels • Backdrive Protection on DDC Lines • Compact 16−Lead QSOP Package • These Devices are Pb−Free and are RoHS Compliant Applications • VGA and DVI−I Ports in: ♦ ♦ ♦ Desktop and Notebook PCs Graphics Cards Set Top Boxes © Semiconductor Components Industries, LLC, 2012 May, 2012 − Rev. 5 1 Publication Order Number: CM2009/D CM2009 SIMPLIFIED ELECTRICAL SCHEMATIC 9 VCC_VIDEO 2 12 VCC_DDC VIDEO_1 VIDEO_2 VIDEO_3 GND VCC_SYNC BYP 8 7 DDC_OUT1 DDC_OUT2 1 3 4 5 RT RT 6 16 14 DDC_IN1 DDC_IN2 10 SYNC_IN1 SYNC_IN2 13 15 GND SYNC_OUT2 SYNC_OUT1 11 PACKAGE / PINOUT DIAGRAM Top View VCC_SYNC 1 16 SYNC_OUT2 VCC_VIDEO 2 15 SYNC_IN2 VIDEO_1 3 14 SYNC_OUT1 VIDEO_2 4 13 SYNC_IN1 VIDEO_3 5 12 DDC_OUT2 GND 6 11 DDC_IN2 VCC_DDC 7 10 DDC_IN1 BYP 8 9 DDC_OUT1 16 Pin QSOP Table 1. PIN DESCRIPTIONS Lead(s) Name 1 VCC_SYNC This is an isolated supply input for the SYNC_1 and SYNC_2 level shifters and their associated ESD protection circuits. 2 VCC_VIDEO This is a supply pin specifically for the VIDEO_1, VIDEO_2 and VIDEO_3 ESD protection circuits. 3 VIDEO_1 Video signal ESD protection channel. This pin is typically tied one of the video lines between the VGA controller device and the video connector. 4 VIDEO_2 Video signal ESD protection channel. This pin is typically tied one of the video lines between the VGA controller device and the video connector. 5 VIDEO_3 Video signal ESD protection channel. This pin is typically tied one of the video lines between the VGA controller device and the video connector. 6 GND 7 VCC_DDC 8 BYP 9 DDC_OUT1 10 DDC_IN1 Description Ground reference supply pin. This is an isolated supply input for the DDC_1 and DDC_2 level−shifting N−FET gates. This input is used to connect an external 0.2 mF bypass capacitor to the DDC circuits, resulting in an increased ESD withstand voltage rating for these circuits (±8 kV with vs. ±4 kV without). DDC signal output. Connects to the video connector side of one of the sync lines. DDC signal input. Connects to the VGA controller side of one of the sync lines. http://onsemi.com 2 CM2009 Table 1. PIN DESCRIPTIONS Lead(s) Name 11 DDC_IN2 Description 12 DDC_OUT2 DDC signal output. Connects to the video connector side of one of the sync lines. 13 SYNC_IN1 Sync signal buffer input. Connects to the VGA controller side of one of the sync lines. 14 SYNC_OUT1 15 SYNC_IN2 16 SYNC_OUT2 DDC signal input. Connects to the VGA controller side of one of the sync lines. Sync signal buffer output. Connects to the video connector side of one of the sync lines. Sync signal buffer input. Connects to the VGA controller side of one of the sync lines. Sync signal buffer output. Connects to the video connector side of one of the sync lines. SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter VCC_VIDEO, VCC_DDC and VCC_SYNC Supply Voltage Inputs ESD Diode Forward Current (one diode conducting at a time) DC Voltage at Inputs VIDEO_1, VIDEO_2, VIDEO_3 DDC_IN1, DDC_IN2 DDC_OUT1, DDC_OUT2 SYNC_IN1, SYNC_IN2 Rating Units [GND − 0.5] to +6.0 V 10 mA [GND − 0.5] to [VCC_VIDEO + 0.5] [GND − 0.5] to 6.0 [GND − 0.5] to 6.0 [GND − 0.5] to [VCC_SYNC + 0.5] V Operating Temperature Range −40 to +85 Storage Temperature Range −40 to +150 °C 500 mW Package Power Rating (TA = 25°C) °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 3 CM2009 Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Max Units VCC_VIDEO Supply Current VCC_VIDEO = 5.0 V; VIDEO inputs at VCC_VIDEO or GND 10 mA ICC_DDC VCC_DDC Supply Current VCC_DDC = 5.0 V 10 mA ICC_SYNC VCC_SYNC Supply Current VCC_SYNC = 5 V; SYNC inputs at GND or VCC_SYNC; SYNC outputs unloaded 50 mA VCC_SYNC = 5 V; SYNC inputs at 3.0 V; SYNC outputs unloaded 2.0 mA 1.0 V ICC_VIDEO Parameter Conditions Min Typ VF ESD Diode Forward Voltage IF = 10 mA VIH Logic High Input Voltage VCC_SYNC = 5.0 V; (Note 2) VIL Logic Low Input Voltage VCC_SYNC = 5.0 V; (Note 2) VOH Logic High Output Voltage IOH = 0 mA, VCC_SYNC = 5.0 V; (Note 2) VOL Logic Low Output Voltage IOL = 0 mA, VCC_SYNC = 5.0 V; (Note 2) ROUT SYNC Driver Output Resistance (CM2009−00 only) VCC_SYNC = 5.0 V; SYNC Inputs at GND or 3.0 V 65 W ROUT SYNC Driver Output Resistance (CM2009−02 only) VCC_SYNC = 5.0 V; SYNC Inputs at GND or 3.0 V; (Note ?) 15 W VOH−02 Logic High Output Voltage (CM2009−02 only) IOH = 24 mA; VCC_SYNC = 5.0 V; (Note 2) VOL−02 Logic Low Output Voltage (CM2009−02 only) IOL = 24 mA; VCC_SYNC = 5.0 V; (Note 2) 0.8 V Input Current VIDEO Inputs VCC_VIDEO = 5.0 V; VIN = VCC_VIDEO or GND ±1 mA VCC_SYNC = 5.0 V; VIN = VCC_SYNC or GND ±1 mA (VCC_DDC − VDDC_IN) ≤ 0.4 V; VDDC_OUT = VCC_DDC 10 mA (VCC_DDC − VDDC_OUT) ≤ 0.4 V; VDDC_IN = VCC_DDC 10 mA IIN SYNC_IN1, SYNC_IN2 Inputs IOFF VON CIN_VID Level Shifting N−MOSFET ”OFF” State Leakage Current 2.0 V 0.6 4.85 V V 0.15 2.0 V V Voltage Drop Across Level−shifting N−MOSFET when “ON” VCC_DDC = 2.5 V; VS = GND; IDS = 3 mA; 0.18 V VIDEO Input Capacitance VCC_VIDEO = 5.0 V; VIN = 2.5 V; f = 1 MHz; (Note 4) 4 pF VCC_VIDEO = 2.5 V; VIN = 1.25 V; f = 1 MHz; (Note 4) 4.5 pF tPLH SYNC Driver L => H Propagation Delay CL = 50 pF; VCC = 5.0 V; Input tR and tF ≤ 5 ns 12 ns tPHL SYNC Driver H => L Propagation Delay CL = 50 pF; VCC = 5.0 V; Input tR and tF ≤ 5 ns 12 ns tR, tF SYNC Driver Output Rise & Fall Times CL = 50 pF; VCC = 5.0 V; Input tR and tF ≤ 5 ns VESD ESD Withstand Voltage VCC_VIDEO = VCC_SYNC = 5 V; (Notes 3, 4 & ?) 4 ±8 ns kV 1. All parameters specified over standard operating conditions unless otherwise noted. 2. These parameters apply only to the SYNC drivers. Note that ROUT = RT + RBUFFER. 3. Per the IEC−61000−4−2 International ESD Standard, Level 4 contact discharge method. BYP, VCC_VIDEO and VCC_SYNC must be bypassed to GND via a low impedance ground plane with a 0.2 mF, low inductance, chip ceramic capacitor at each supply pin. ESD pulse is applied between the applicable pins and GND. ESD pulses can be positive or negative with respect to GND. Applicable pins are: VIDEO_1, VIDEO_2, VIDEO_3, SYNC_OUT1, SYNC_OUT2, DDC_OUT1 and DDC_OUT2. All other pins are ESD protected to the industry standard ±2 kV Human Body Model (MIL−STD−883, Method 3015). The bypass capacitor at the BYP pin may optionally be omitted, in which case the max. ESD withstand voltage for the DDC_OUT1 and DDC_OUT2 pins is reduced to ±4 kV. 4. The SYNC_OUT pins on the CM2009−02 are guaranteed for 2 kV HBM ESD protection. http://onsemi.com 4 CM2009 APPLICATION INFORMATION Figure 1. Typical Application Connection Diagram NOTES: 1. The CM2009 should be placed as close to the VGA or DVI−I connector as possible. 2. The ESD protection channels VIDEO_1, VIDEO_2, VIDEO_3 may be used interchangeably between the R, G, B signals. 3. If differential video signal routing is used, the RED, BLUE, and GREEN signal lines should be terminated with external 37.5 W resistors. 4. “VF” are external video filters for the RGB signals. 5. Supply bypass capacitors C1 and C2 must be placed immediately adjacent to the corresponding Vcc pins. Connections to the Vcc pins and ground plane must be made with minimal length copper traces (preferably less than 5 mm) for best ESD protection. 6. The bypass capacitor for the BYP pin has been omitted in this diagram. This results in a reduction in the maximum ESD withstand voltage at the DDC_OUT pins from ±8 kV to ±4 kV. If 8 kV ESD protection is required, a 0.2 mF ceramic bypass capacitor should be connected between BYP and ground. 7. The SYNC buffers may be used interchangeably between HSYNC and VSYNC. 8. The EMI filters at the SYNC_OUT and DDC_OUT pins (C5 to C12, and Ferrite Beads FB1 to FB4) are for reference only. The component values and filter configuration may be changed to suit the application. 9. The DDC level shifters DDC_IN, DDC_OUT, may be used interchangeably between DDCA_CLK and DDCA_DATA. 10. R1, R2 are optional. They may be used, if required, to pull the DDC_CLK and DDC_DATA lines to VCC_5V when no monitor is connected to the VGA connector. If used, it should be noted that “back current” may flow between the DDC pins and VCC_5V via these resistors when VCC_5V is powered down. 11. For optimal ESD performance with the CM2009−02, an additional clamp device (such as the CMD PACDN042) should be placed on HSYNC/VSYNC lines between the external matching resistor and the VGA connector. http://onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QSOP16 CASE 492−01 ISSUE A DATE 23 MAR 2011 2X SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. 4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EX­ CEED 0.005 PER SIDE. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. IN­ TERLEAD FLASH OR PROTRUSION SHALL NOT EX­ CEED 0.005 PER SIDE. D AND E1 ARE DETERMINED AT DATUM H. 5. DATUMS A AND B ARE DETERMINED AT DATUM H. 0.20 C D D 16 L2 D A 9 GAUGE PLANE SEATING PLANE E E1 C L C DETAIL A 2X 2X 10 TIPS 0.20 C D 1 8 16X e B b 0.25 A2 0.10 C 0.10 C A1 16X C 0.25 C D M C A-B D h x 45 _ A SEATING PLANE M 1.12 9 XXXXXXX XXXXXXX YYWWG 6.40 1 8 0.635 PITCH DOCUMENT NUMBER: DESCRIPTION: MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 1.24 ---0.20 0.30 0.19 0.25 4.89 BSC 6.00 BSC 3.90 BSC 0.635 BSC 0.22 0.50 0.40 1.27 0.25 BSC 0_ 8_ 16X 0.42 16 DETAIL A INCHES MIN MAX 0.053 0.069 0.004 0.010 0.049 ---0.008 0.012 0.007 0.010 0.193 BSC 0.237 BSC 0.154 BSC 0.025 BSC 0.009 0.020 0.016 0.050 0.010 BSC 0_ 8_ GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT 16X H DIM A A1 A2 b c D E E1 e h L L2 M XXXXX YY WW G = Specific Device Code = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. DIMENSIONS: MILLIMETERS 98AON04472D QSOP16 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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