CM2020-00TR

HDMI Transmitter Port Protection and Interface Device CM2020-00TR Features • • • • • HDMI 1.3 compliant 0.05pF matching capacitance between the TMDS intra-pair Overcurrent output protection Level shifting/isolation circuitry Provides ESD protection to IEC61000-4-2 Level 4 - 8kV contact discharge - 15kV air discharge Matched 0.5mm trace spacing (TSSOP) Simplified layout for HDMI connectors Backdrive protection RoHS-compliant, lead-free packaging Product Description The CM2020-00TR HDMI Transmitter Port Protection and Interface device is specifically designed for next generation HDMI source interface protection. An integrated package provides all ESD, level shift, overcurrent output protection and backdrive protection for an HDMI port in a single 38-Pin TSSOP package. The CM2020-00TR part is specifically designed to complement the CM2021 protection part in HDMI receivers (Displays, DTV, CE devices, etc.) The CM2020-00TR also incorporates a silicon overcurrent protection device for +5V supply voltage output to the connector. • • • • Applications • • • • PC Consumer Electronics Set Top Box DVDRW Players ©2010 SCILLC. All rights reserved. May 2010 – Rev. 4 Publication Order Number: CM2020-00TR/D CM2020-00TR Electrical Schematic Rev. 4 | Page 2 of 13 | www.onsemi.com CM2020-00TR Pin Descriptions PIN DESCRIPTIONS PINS 4, 35 6, 33 7, 32 9, 30 10, 29 12, 27 13, 26 15, 24 16 23 17 22 18 21 19 20 2 1 38 37 3, 36 5, 34, 8, 31, 11, 28, 14, 25 NAME TMDS_D2+ TMDS_D2TMDS_D1+ TMDS_D1TMDS_D0+ TMDS_D0TMDS_CK+ TMDS_CKCE_REMOTE_IN CE_REMOTE_OUT DDC_CLK_IN DDC_CLK_OUT DDC_DAT_IN DDC_DAT_OUT HOTPLUG_DET_IN HOTPLUG_DET_OUT LV_SUPPLY 5V_SUPPLY 5V_OUT ESD_BYP GND TMDS_GND ESD Level 8kV 8kV 3 3 DESCRIPTION TMDS 0.9pF ESD protection . TMDS 0.9pF ESD protection . TMDS 0.9pF ESD protection . TMDS 0.9pF ESD protection . TMDS 0.9pF ESD protection . TMDS 0.9pF ESD protection . TMDS 0.9pF ESD protection . TMDS 0.9pF ESD protection . LV_SUPPLY referenced logic level into ASIC. 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. LV_SUPPLY referenced logic level into ASIC. 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. LV_SUPPLY referenced logic level into ASIC. 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. LV_SUPPLY referenced logic level into ASIC. 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector Bias for CE / DDC / HOTPLUG level shifters. Current source for 5V_OUT. 55mA minimum overcurrent protected 5V output. This output must be bypassed with a 0.1µF ceramic capacitor. This pin must be connected to a 0.1µF ceramic capacitor. Supply GND reference. TMDS ESD and Parasitic GND return. 5 2 1 1 1 1 1 1 1 1 8kV 8kV 3 3 8kV 8kV 8kV 8kV 3 3 3 3 2kV 8kV 4 3 2kV 8kV 4 3 2kV 4 8kV 2kV 8kV 3 4 3 2kV 2kV 8kV 4 4 3 2kV 4 N/A N/A Note 1: These 2 pins need to be connected together in-line on the PCB. Note 2: This output can be connected to an external 0.1µF ceramic capacitor, resulting in an increased ESD withstand voltage rating. Note 3: Standard IEC 61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330Ω, 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND=0V and ESD_BYP (pin 37), 5V_OUT (pin 38), and HOTPLUG_DET_OUT (pin 20) each bypassed with a 0.1µF ceramic capacitor connected to GND. Note 4: Human Body Model per MIL-STD-883, Method 3015, CDISCHARGE=100pF, RDISCHARGE=1.5kΩ, 5V_SUPPLYand LV_SUPPLY within recommended operating conditions, GND=0V and ESD_BYP (pin 37), 5V_OUT (pin 38), and HOTPLUG_DET_OUT (pin 20) each bypassed with a 0.1µF ceramic capacitor connected to GND. Note 5: These pins should be routed directly to the associated GND pins on the HDMI connector with single point ground vias at the connector Rev. 4 | Page 3 of 13 | www.onsemi.com CM2020-00TR Ordering Information PART NUMBERING INFORMATION Pins 38 Package TSSOP-38 Ordering Part Number CM2020-00TR 1 Part Marking CM2020-00TR Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Backdrive protection Below, two scenarios are discussed to illustrate what can happen when a powered device is connected to an unpowered device via a HDMI interface, substantiating the need for backdrive protection on this type of interface. In the first example a DVD player is connected to a TV via an HDMI interface. If the DVD player is switched off and the TV is left on, there is a possibility of reverse current flow back into the main power supply rail of the DVD player. Typically, the DVD's power supply has some form of bulk supply capacitance associated with it. Because all CMOS logic exhibits a very high impedance on the power rail node when "off", if there may be very little parasitic shunt resistance, and even with as little as a few milliamps of "backdrive" current flowing into the power rail, it is possible over time to charge that bulk supply capacitance to some intermediate level. If this level rises above the power-onreset (POR) voltage level of some of the integrated circuits in the DVD player, these devices may not reset properly when the DVD player is turned back on. In a more serious scenario, if any SOC devices are incorporated in the design which have built-in level shifter and DRC diodes for ESD protection, there is even a risk for permanent damage. In this case, if there is a pullup resistor (such as with DDC) on the other end of the cable, then that resistance will pull the SOC chips "output" up to a high level. This will forward bias the upper ESD diode in the DRC and charge the bulk capacitance in a similar fashion as described in the first example. If this current flow is high enough, even as little as a few milliamps, it could destroy one of the SOC chip's internal DRC diodes, as they are not designed for passing DC. To avoid either of these situations, the CM2020-00TR was designed to block backdrive current, guaranteeing no more than 5mA on any I/O pin when the I/O pin voltage is greater than the CM2020-00TR supply voltage. Figure 1. Backdrive Protection Diagram. Rev. 4 | Page 4 of 13 | www.onsemi.com CM2020-00TR Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER VCC5V, VCCLV DC Voltage at any Channel Input Storage Temperature Range RATING 6.0 6.0 -65 to +150 UNITS V V ° C STANDARD (RECOMMENDED) OPERATING CONDITIONS SYMBOL 5V_SUPPLY LV_SUPPLY PARAMETER Operating Supply Voltage Bias Supply Voltage Operating Temperature Range MIN GND 1 -40 TYP 5 3.3 MAX 5.5 5.5 85 UNITS V V ° C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL ICC5V ICCLV VDROP ISC IOFF IBACKDRIVE PARAMETER Operating Supply Current Bias Supply Current 5V_OUT Overcurrent Output Drop 5V_OUT Short Circuit Current Limit OFF state leakage current, level shifting NFET Current conducted from output pins to V_SUPPLY rails when powered down CONDITIONS 5V_SUPPLY = 5.0V LV_SUPPLY = 3.3V 5V_SUPPLY= 5.0V, IOUT=55mA 5V_SUPPLY= 5.0V, 5V_OUT = GND LV_SUPPLY 0V 5V_SUPPLY VCH_OUT; Signal pins: TMDS_D[2:0]+/-, TMDS_CK+/-, CE_REMOTE_OUT, DDC_DAT_OUT, DDC_CLK_OUT, HOTPLUG_DET_OUT, 5V_OUT Only CE-REMOTE_IN = LV_SUPPLY < CE_REMOTE_OUT 90 MIN TYP 110 1 65 135 0.1 0.1 MAX 130 5 100 175 5 5 UNITS µA µA mV mA µA µA IBACKDRIVE, CEC Current through CE-REMOTE_OUT when powered down 0.1 1 µA Rev. 4 | Page 5 of 13 | www.onsemi.com CM2020-00TR SYMBOL VON VF PARAMETER VOLTAGE drop across level shifting NFET when ON Diode Forward Voltage Top Diode Bottom Diode ESD Withstand Voltage, contact discharge per IEC 61000-4-2 standard (IEC) Channel Clamp Voltage Positive Transients Negative Transients Dynamic Resistance Positive Transients Negative Transients TMDS Channel Leakage Current TMDS Channel Input Capacitance TMDS Channel Input Capacitance Matching Level Shifting Input Capacitance, Capacitance to GND Level Shifting Input Capacitance, Capacitance to GND CONDITIONS LV_SUPPLY = 2.5V, VS = GND, IDS = 3mA IF = 8mA, TA = 25° C 0.6 0.6 Pins 4, 7, 10, 13, 20, 21, 22, 23, 24, 27, 30, 33, 38; TA=25° C Note 2 TA=25° IPP = 1A, tP = 8/20uS; C, Note 3 10.8 -2.1 IPP = 1A, tP = 8/20µS; TA = 25° C; Note 3 TA = 25° C 5V_SUPPLY= 5.0V, Measured at 1MHz, VBIAS=2.5V 5V_SUPPLY= 5.0V, Measured at 1MHz, VBIAS=2.5V; Note 4 5V_SUPPLY= 5.0V, Measured at 100KHz, VBIAS=2.5V; Note 2 5V_SUPPLY= 5.0V, Measured at 100KHz, VBIAS=2.5V 5V_SUPPLY= 5.0V, Measured at 100KHz, VBIAS=2.5V 1.4 0.9 0.01 0.9 1 1.2 V V Ω Ω µA pF 0.85 0.85 0.95 0.95 V V kV MIN 75 TYP 95 MAX 140 UNITS mV VESD ±8 VCL RDYN ILEAK CIN, TMDS ∆C IN, TMDS 0.05 pF CIN, DDC 3.5 4 pF CIN, CEC 3.5 4 pF CIN, HP Level Shifting Input Capacitance, Capacitance to GND 3.5 4 pF Note 1: Operating Characteristics are over Standard Operating Conditions unless otherwise specified. Note2: Standard IEC 61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330Ω, 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND=0V and ESD_BYP (pin 37), 5V_OUT (pin 38), and HOTPLUG_DET_OUT (pin 20) each bypassed with a 0.1µF ceramic capacitor connected to GND. Note 3: These measurements performed with no external capacitor on ESD_BYP. Note 4: Intra-pair matching, each TMDS pair (i.e. D+, D-) Rev. 4 | Page 6 of 13 | www.onsemi.com CM2020-00TR Performance Information Typical Filter Performance (TA=25° DC Bias=0V, 50 Ohm Environment) C, Figure 2. Insertion Loss vs. Frequency (TMDS_D1- to GND) Rev. 4 | Page 7 of 13 | www.onsemi.com CM2020-00TR Application Information Figure 3. Typical Application for CM2020-00TR Rev. 4 | Page 8 of 13 | www.onsemi.com CM2020-00TR Application Information (cont’d) Design Considerations ESD Bypass Pin 37 (ESD_BYP) is provided for an optional external ESD bypass capacitor only (i.e. 0.1mF ceramic.) It should not be connected to any supply rail. 5V Overcurrent Output Maximum Overcurrent Protection output drop at 55mA on 5V_OUT is 100mV. To meet HDMI output requirements of 4.8-5.3V, an input of greater than 4.9V should be used (i.e. 5.1V +/- 4%). A 0.1µF ceramic bypass capacitor on this output is also recommended. Hotplug Detect Input To meet the requirements of HDMI CTS TID7-12, the following pullup/pulldown configuration is recommended for a 3.3V+/-10% internal VCC rail (See Figure 4 below). A 0.1µF ceramic capacitor is recommended for additional edge debounce and ESD bypass. DUT On vs. DUT Off Many HDMI CTS tests require a power off condition on the System Under Test. Many Dual Rail Clamp (DRC) ESD diode configurations will be forward biased when their VDD rail is lower than the I/O pin bias, thereby TM exhibiting extremely high apparent capacitance measurements, for example. The MediaGuard backdrive isolation circuitry limits this current to